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XL-DZ234SYGD 4-Chip Through-Hole LED: Grading & Thermal Limits

The XINGLIGHT XL-DZ234SYGD is a 4-in-one 12mm through-hole LED designed for high-brightness status indication and industrial instrumentation. 💡 This article provides a technical breakdown of its luminous intensity gra...

XL-DZ234SYGD 4-Chip Through-Hole LED: Grading & Thermal Limits

📌 Product Overview

The XL-DZ234SYGD is a robust 4-in-one Through-Hole Technology (THT) LED from XINGLIGHT, featuring a 12x5.2x14.2mm package with a water-clear green colloid. 💡 Designed for high-visibility indication in industrial environments, it integrates four parallel LED dies to deliver a typical luminous intensity of up to 300 mcd. This component is engineered to serve as a reliable status indicator in dense storage server arrays and communication equipment, offering a balance of high brightness and wide 110° viewing angle for versatile board placement. 🚀 It operates efficiently at standard logic voltages, making it suitable for 5V control systems.

🎯 Typical Applications

Based on the XL-DZ234SYGD's wavelength (560-575nm) and robust packaging, the following applications are optimal:

  • Status Indicators: High-visibility feedback for power and network activity on industrial control panels.
  • Storage Servers & Communication: 🌐 Essential signal units for HDD activity LEDs and rack mount status lights.
  • Electronic Testing Instruments: 📊 Visual indicators for measurement ranges and device status.
  • IoT & Converters: Low-power signaling for smart hubs and power conversion modules.
  • Medical Devices: ⚕️ Status lighting for non-invasive monitoring equipment where reliability is critical.

📈 Key Technical Specifications

The XL-DZ234SYGD utilizes a 4-chip series/parallel configuration, demanding specific attention to voltage and brightness binning during procurement.

ParameterSymbolMinTyp.MaxUnitTest Conditions
Luminous IntensityIv50-300mcdIF=20mA
Dominant Wavelengthλd560-575nmIF=20mA
Peak Wavelengthλp-565-nmIF=20mA
Forward VoltageVF1.8-2.4VIF=20mA
Viewing Angle2Ø1/2-110-degIF=20mA
Half Wave WidthΔλ-15-nmIF=20mA

💡 Design Note: Ensure circuit design accounts for the 2.4V maximum forward voltage to maintain consistent brightness across the 4-die array.

🔒 Absolute Maximum Ratings & Process Limits

Exceeding these parameters may cause permanent device failure. The 4-dip structure allows for high peak currents but requires strict thermal management during soldering.

ParameterSymbolValueUnitNotes
Max Power DissipationPD200mWDerate above 25°C ambient
Max Continuous CurrentIF80mA20mA per die x 4
Peak Forward CurrentIFP320mAPulse width ≤ 5ms
Max Reverse VoltageVR5V
ESD ResistanceESD2000VHuman Body Model
Operating Temp.TOPR-40 ~ +85°C
Soldering Temp/TimeTSOL260°C≤5 Seconds

👇 Process Alert: The MSL (Moisture Sensitivity Level) is 2. Boards must be baked within 1 year of exposure if sealed bags are opened, prior to reflow to prevent popcorning.

📦 Package, Dimensions & Assembly Notes

The component uses a standard 12mm bulb package with a 2.54mm lead pitch, suitable for wave soldering or manual insertion.

  • Dimensions: 12.0 (L) x 5.2 (W) x 14.2 (H) mm.
  • Tolerance: ±0.25mm for unmarked dimensions.
  • Packaging: ESD-safe, moisture-proof foil bags (EIA standard).
  • Assembly: 🔒 Lead soldering max is 260°C for 5 seconds. Avoid excessive mechanical stress on the lead frame (bending load limit 0.25kgf).

🚀 Sourcing & Supply Considerations

  • Binning Selection: The datasheet specifies distinct binning codes for Brightness (A1-A3), Voltage (N12), and Wavelength (HYG01-06). 💡 Request specific bins (e.g., A3 for brightness) to ensure visual uniformity on the production line.
  • Authenticity: Verify anti-static bag sealing integrity upon receipt.
  • Lead Time: 12mm THT LEDs generally offer better availability than SMD alternatives, but green-yellow specific bins may have longer lead times.

❓ FAQ

Q: What is the difference between this 4-chip LED and standard single-chip indicators?
A: The XL-DZ234SYGD integrates four dies into one lens, significantly increasing luminous intensity (up to 300mcd) and total power dissipation (200mW) compared to standard single-chip LEDs. This makes it suitable for environments requiring high visibility or longer viewing distances.

Q: Can I drive this LED with a standard 5V microcontroller GPIO?
A: Generally, no. While the max reverse voltage is 5V, the forward voltage is 1.8-2.4V. Connecting directly to 5V without a current-limiting resistor will likely destroy the LED due to excessive current. A series resistor is mandatory.

Q: How should I manage the storage of this component prior to assembly?
A: Store at <30°C and <70% RH. The MSL is 2, meaning it can sit on the factory floor for up to 1 year (after bag opening) before baking is required. For long-term storage, keep in the original moisture-proof bag with desiccant.

Q: What is the importance of the wavelength binning (HYG codes)?
A: The codes HYG01 to HYG06 split the 560-575nm range into smaller increments. 💡 If you are designing an array of status lights (e.g., server racks), ordering the same bin code ensures that every LED appears visually identical in color, preventing a "patchy" look.

Q: What are the mechanical limits for the leads during assembly?
A: The leads can withstand a load of 2.5N (0.25kgf) during bending. Support the lead body during forming to avoid stress on the epoxy body, which can cause cracking or hermeticity failure.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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