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XL-DZT502UBD1 5mm LED: Thermal & Electrical Specs for Design

The XL-DZT502UBD1 is a standard 5mm through-hole LED featuring a blue colloid and dominant wavelength range of 460–470nm. This technical brief provides essential data on forward voltage distributions, luminous intensi...

XL-DZT502UBD1 5mm LED: Thermal & Electrical Specs for Design

📌 Product Overview

The XL-DZT502UBD1 from XINGLIGHT is a 5mm Through-Hole Technology (THT) LED designed with a blue lens and a metal lamp base. It functions as a standard indicator component, providing a luminous intensity ranging from 1000 to 3000 mcd at a typical forward current of 20mA. 💡 The device is engineered for high energy efficiency and features a low DC drive voltage.

This component is ideally suited for applications requiring clear visual status indication and backlighting. With a robust operating temperature range and fast startup characteristics, it supports designs in consumer electronics and industrial control panels. The product adheres to RoHS environmental standards, ensuring compliance with modern electronic manufacturing requirements.

🛠️ Typical Applications

The versatile optical and electrical characteristics of the XL-DZT502UBD1 make it suitable for integration across a wide spectrum of electronic assemblies:

  • Industrial & Consumer Indicators: Home appliances, digital communication devices, and electronic clocks.
  • Automotive Electronics: Interior dashboard illumination and panel indicators.
  • Specialized Illumination: Urban lighting beautification, medical cosmetic instruments, and traffic instruction signs.
  • Educational & Recreational: Electronic teaching equipment and electronic toys.

📊 Key Technical Specifications

The optical performance of the XL-DZT502UBD1 is categorized by specific intensity and wavelength bins to ensure uniformity in mass production. The table below summarizes the initial electrical and optical characteristics under standard test conditions ($T_a = 25^\circ C$).

ParameterSymbolMinTyp.MaxUnitTest Conditions
Luminous Intensity$I_V$10003000mcd$I_F = 20\text{mA}$
Dominant Wavelength$\lambda_d$460470nm$I_F = 20\text{mA}$
Peak Wavelength$\lambda_p$465nm$I_F = 20\text{mA}$
Forward Voltage$V_F$2.83.03.6V$I_F = 20\text{mA}$
Viewing Angle$2\theta_{1/2}$35deg$I_F = 20\text{mA}$
Reverse Current$I_R$$\le 5$$\mu\text{A}$$V_R = 5\text{V}$

⚠️ Absolute Maximum Ratings & Process Limits

Exceeding these ratings may cause permanent device failure. Designers must ensure that operational conditions remain within these limits, particularly during power surges or environmental shifts.

ParameterSymbolMax. ValueUnitNotes
Power Dissipation$P_D$70mWDerating required above $25^\circ C$ ambient.
Continuous Forward Current$I_F$20mA
Peak Forward Current$I_{Fp}$80mAPulse width limitations apply.
Operating Temperature$T_{opr}$-40 ~ +85$^\circ C$
Storage Temperature$T_{stg}$-40 ~ +85$^\circ C$
Soldering (Wave)$T_{sol}$240$^\circ C$$\le 6\text{s}$
Soldering (Manual)$T_{sol}$300$^\circ C$$\le 3\text{s}$; Keep $>2.0\text{mm}$ from colloid base.

📦 Package, Dimensions & Assembly Notes

  • Package Type: F5 Round (Metal Base Lamp Seat)
  • Dimensions: $11.3 \times 15.0 \times 10.3\text{ mm}$ (Appearance Dimension).
  • Moisture Sensitivity: MSL Level 2 (Must be baked/used within 1 year if sealed, or per manufacturer's floor life instructions).
  • Packaging: EIA Standard Packaging, shipped in moisture-proof and anti-electrostatic foil bags.

🔒 Assembly Note: When soldering manually, ensure the soldering point is at least 2.0mm away from the bottom of the colloid to prevent thermal damage to the epoxy lens and internal bonding wires.

🚢 Sourcing & Supply Considerations

  • Binning Codes: Verify specific brightness (Code A8-B4) and voltage (Code N13-3 to N13-6) binning requirements with the supplier to match circuit design limits.
  • Authenticity: Source through XINGLIGHT authorized channels to guarantee RoHS compliance and MSL 2 integrity.
  • Yield Management: For high-volume orders involving strict wavelength control (HB04-HB06), coordinate with the distributor to secure consistent manufacturing lots.

❓ Frequently Asked Questions

Q: What is the forward voltage range required to drive this LED at 20mA?
A: The forward voltage ($V_F$) varies between 2.8V and 3.6V depending on the specific bin. Designers should account for this range to ensure constant current regulation and avoid over-driving the lower voltage bins.

Q: Is the XL-DZT502UBD1 compatible with lead-free soldering processes?
A: Yes, the datasheet specifies compliance with ROHS requirements. For wave soldering, the maximum temperature is $240^\circ C$ for $\le 6\text{ seconds}$. Manual soldering should not exceed $300^\circ C$ for 3 seconds.

Q: How should I handle storage to prevent moisture damage?
A: This LED has a Moisture Sensitivity Level (MSL) of 2. If the moisture-proof barrier bag is opened, components should be used within the specified floor life (typically 1 year for MSL 2) or baked according to IPC/JEDEC standards before reflow soldering.

Q: What does the brightness binning code (e.g., A8, B1) signify?
A: The brightness codes (A8 through B4) indicate the luminous intensity in millicandelas (mcd). For instance, Code A8 ranges from 900–1200 mcd, while Code B4 ranges from 2500–3000 mcd. Selecting a specific bin helps maintain visual uniformity across your product line.

Q: What safety margin should I leave for the peak current?
A: While the Absolute Maximum Rating for peak forward current ($I_{Fp}$) is 80mA, this is a pulsed value. For continuous operation, strictly limit the current to 20mA. Pulses above 20mA must be short-duration and low-duty-cycle to prevent thermal runaway.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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