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XL-DZ304SURSYGD SMD LED — Technical Specifications & Design Guide

The XL-DZ304SURSYGD from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the component for board integration, assess con...

XL-DZ304SURSYGD SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XINGLIGHT XL-DZ304SURSYYG is a dual-color Light Emitting Diode (LED) specifically engineered for surface mount technology (SMT) integration. 📦 It features a compact 10.0 x 9.0 x 4.5mm package with Red and Yellow-Green chips, utilizing water-clear colloids to optimize light transmission and visual indication.

Targeting industrial IoT, storage servers, and medical instrumentation, this component balances luminous intensity with energy efficiency. 💡 Its design prioritizes fast startup times and high visibility (45° viewing angle), making it suitable for status indicators on converter units and communication equipment where clear, long-life optical feedback is critical.

🎯 Typical Applications

Based on the device's robust operating temperature range (-40℃ to +85℃) and MSL Level 2 classification, the XL-DZ304SURSYYG is ideally suited for the following scenarios:

  • IoT & Status Indication: 📡 Visual feedback for network connectivity and operational states in smart devices.
  • Medical & Instruments: 🩺 Indicator lights for electronic testing equipment and medical panels requiring high reliability.
  • Storage Servers: 🔍 HDD activity or power status LEDs in data center hardware.
  • Industrial Converters: 🏭 Signal visualization for power conversion units and communication modules.

📊 Key Technical Specifications

💡 The table below outlines the electro-optical characteristics under standard test conditions (Ta=25℃), allowing engineers to evaluate luminous efficacy and voltage requirements for driver circuit design.

ParameterSymbolRed (R) ValueYellow-Green (YG) ValueUnitTest Conditions
Luminous IntensityIv500 (Typ)100 (Typ)mcdIF = 20mA
Dominant Wavelengthλd620 ~ 625565 ~ 575nmIF = 20mA
Forward VoltageVF1.8 ~ 2.41.8 ~ 2.6VIF = 20mA
Viewing Angle2Ø1/24545DegIF = 20mA
Reverse CurrentIR≤ 5≤ 5μAVR = 5V

⚠️ Absolute Maximum Ratings & Process Limits

⚡ Exceeding these parameters may cause permanent device failure. Design margins must account for these limits to ensure thermal management and electrical stability during power surges or soldering processes.

ParameterSymbolRed (R)Yellow-Green (YG)UnitNotes
Max Power DissipationPD5050mWDerate above 25°C ambient
Max Forward CurrentIF2020mAContinuous DC operation
Peak Forward CurrentIFP8080mAPulse width ≤ 10ms
Max Reverse VoltageVR55V
ESD SusceptibilityESD20002000VHuman Body Model (HBM)
Operating Temp.TOPR-40 ~ +85-40 ~ +85
Storage Temp.TSTR-40 ~ +85-40 ~ +85

📦 Package, Dimensions & Assembly Notes

The component utilizes an industry-standard EIA-compliant package with moisture-proof and anti-electrostatic foil bag packaging (MSL 2). 🔒 Key physical and assembly specifications are detailed below:

  • Dimensions: 10.0mm (L) x 9.0mm (W) x 4.5mm (H) with a tolerance of ±0.25mm unless noted.
  • Soldering: Manual or Wave Soldering is not recommended due to plastic package limitations. 🔥 Use IR Reflow with a peak temperature of 260℃ for ≤6 seconds.
  • Mechanical Integrity: Leads withstand 2.5N load (0°~ 90° bend). Ensure PCB layout accounts for the 4.5mm height to avoid mechanical interference in enclosures.
  • Shelf Life: Proper storage in the provided moisture-proof bags is critical to maintain MSL 2 compliance and prevent thermal degradation during reflow.

📈 Sourcing & Supply Considerations

For procurement teams and supply chain managers, verifying the consistency of optical bins is crucial for visual uniformity in mass production. 🚨 XINGLIGHT offers specific grading for brightness (A1-A7), voltage (N12/N13), and wavelength (HR/HYG codes) to match strict BOM requirements.

When sourcing the XL-DZ304SURSYYG, confirm the required bin codes with your distributor to ensure color consistency across batches. 🤝 Verify authenticity by requesting full traceability documentation and ensure stock is rotated to respect the component's long operating life specifications.

❓ Frequently Asked Questions

Q: What is the forward voltage requirement for the Yellow-Green chip?
A: The Yellow-Green (YG) chip typically requires a forward voltage (VF) between 1.8V and 2.6V at 20mA. Designers should select the appropriate bin code (e.g., N12-7 vs N13-1) to match the driver circuit's voltage headroom.

Q: Can this LED be used in high-temperature automotive environments?
A: While the operating range extends to +85℃, this model is not explicitly classified as Automotive Grade (AEC-Q102) in the provided sheet. It is optimized for industrial IoT and medical devices within the -40℃ to +85℃ range.

Q: What does MSL Level 2 mean for my assembly line?
A: Moisture Sensitivity Level 2 means the components can be exposed to the ambient environment (≤30°C/60%RH) for up to one year before soldering. After opening the moisture-proof bag, if not used within 168 hours (7 days), baking may be required prior to reflow.

Q: How is the brightness graded for bulk orders?
A: Brightness is binned based on Luminous Intensity (Iv). Codes range from A1 (50-100 mcd) to A7 (700-900 mcd). For uniform panel lighting, ensure all units in a single BOM batch share the same brightness code.

Q: Is the Red/Green light independently controllable?
A: The datasheet refers to "RedGreen" colloids and lists separate electrical parameters (R/YG) for current and power dissipation, implying a multi-die structure. However, confirm the pin-out configuration (Common Anode vs. Common Cathode) with the mechanical drawing before PCB layout.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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