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XL-DZ304SURSYGD SMD LED — Technical Specifications & Design Guide

The XL-DZ304SURSYGD from XINGLIGHT is a LED designed for indicator and backlight applications. This technical guide helps design engineers and procurement teams evaluate the component for board integration, assess con...

XL-DZ304SURSYGD SMD LED — Technical Specifications & Design Guide

📌 Product Overview

The XINGLIGHT XL-DZ304SURSYYG is a dual-color Light Emitting Diode (LED) specifically engineered for surface mount technology (SMT) integration. 📦 It features a compact 10.0 x 9.0 x 4.5mm package with Red and Yellow-Green chips, utilizing water-clear colloids to optimize light transmission and visual indication.

Targeting industrial IoT, storage servers, and medical instrumentation, this component balances luminous intensity with energy efficiency. 💡 Its design prioritizes fast startup times and high visibility (45° viewing angle), making it suitable for status indicators on converter units and communication equipment where clear, long-life optical feedback is critical.

🎯 Typical Applications

Based on the device's robust operating temperature range (-40℃ to +85℃) and MSL Level 2 classification, the XL-DZ304SURSYYG is ideally suited for the following scenarios:

  • IoT & Status Indication: 📡 Visual feedback for network connectivity and operational states in smart devices.
  • Medical & Instruments: 🩺 Indicator lights for electronic testing equipment and medical panels requiring high reliability.
  • Storage Servers: 🔍 HDD activity or power status LEDs in data center hardware.
  • Industrial Converters: 🏭 Signal visualization for power conversion units and communication modules.

📊 Key Technical Specifications

💡 The table below outlines the electro-optical characteristics under standard test conditions (Ta=25℃), allowing engineers to evaluate luminous efficacy and voltage requirements for driver circuit design.

ParameterSymbolRed (R) ValueYellow-Green (YG) ValueUnitTest Conditions
Luminous IntensityIv500 (Typ)100 (Typ)mcdIF = 20mA
Dominant Wavelengthλd620 ~ 625565 ~ 575nmIF = 20mA
Forward VoltageVF1.8 ~ 2.41.8 ~ 2.6VIF = 20mA
Viewing Angle2Ø1/24545DegIF = 20mA
Reverse CurrentIR≤ 5≤ 5μAVR = 5V

⚠️ Absolute Maximum Ratings & Process Limits

⚡ Exceeding these parameters may cause permanent device failure. Design margins must account for these limits to ensure thermal management and electrical stability during power surges or soldering processes.

ParameterSymbolRed (R)Yellow-Green (YG)UnitNotes
Max Power DissipationPD5050mWDerate above 25°C ambient
Max Forward CurrentIF2020mAContinuous DC operation
Peak Forward CurrentIFP8080mAPulse width ≤ 10ms
Max Reverse VoltageVR55V
ESD SusceptibilityESD20002000VHuman Body Model (HBM)
Operating Temp.TOPR-40 ~ +85-40 ~ +85
Storage Temp.TSTR-40 ~ +85-40 ~ +85

📦 Package, Dimensions & Assembly Notes

The component utilizes an industry-standard EIA-compliant package with moisture-proof and anti-electrostatic foil bag packaging (MSL 2). 🔒 Key physical and assembly specifications are detailed below:

  • Dimensions: 10.0mm (L) x 9.0mm (W) x 4.5mm (H) with a tolerance of ±0.25mm unless noted.
  • Soldering: Manual or Wave Soldering is not recommended due to plastic package limitations. 🔥 Use IR Reflow with a peak temperature of 260℃ for ≤6 seconds.
  • Mechanical Integrity: Leads withstand 2.5N load (0°~ 90° bend). Ensure PCB layout accounts for the 4.5mm height to avoid mechanical interference in enclosures.
  • Shelf Life: Proper storage in the provided moisture-proof bags is critical to maintain MSL 2 compliance and prevent thermal degradation during reflow.

📈 Sourcing & Supply Considerations

For procurement teams and supply chain managers, verifying the consistency of optical bins is crucial for visual uniformity in mass production. 🚨 XINGLIGHT offers specific grading for brightness (A1-A7), voltage (N12/N13), and wavelength (HR/HYG codes) to match strict BOM requirements.

When sourcing the XL-DZ304SURSYYG, confirm the required bin codes with your distributor to ensure color consistency across batches. 🤝 Verify authenticity by requesting full traceability documentation and ensure stock is rotated to respect the component's long operating life specifications.

❓ Frequently Asked Questions

Q: What is the forward voltage requirement for the Yellow-Green chip?
A: The Yellow-Green (YG) chip typically requires a forward voltage (VF) between 1.8V and 2.6V at 20mA. Designers should select the appropriate bin code (e.g., N12-7 vs N13-1) to match the driver circuit's voltage headroom.

Q: Can this LED be used in high-temperature automotive environments?
A: While the operating range extends to +85℃, this model is not explicitly classified as Automotive Grade (AEC-Q102) in the provided sheet. It is optimized for industrial IoT and medical devices within the -40℃ to +85℃ range.

Q: What does MSL Level 2 mean for my assembly line?
A: Moisture Sensitivity Level 2 means the components can be exposed to the ambient environment (≤30°C/60%RH) for up to one year before soldering. After opening the moisture-proof bag, if not used within 168 hours (7 days), baking may be required prior to reflow.

Q: How is the brightness graded for bulk orders?
A: Brightness is binned based on Luminous Intensity (Iv). Codes range from A1 (50-100 mcd) to A7 (700-900 mcd). For uniform panel lighting, ensure all units in a single BOM batch share the same brightness code.

Q: Is the Red/Green light independently controllable?
A: The datasheet refers to "RedGreen" colloids and lists separate electrical parameters (R/YG) for current and power dissipation, implying a multi-die structure. However, confirm the pin-out configuration (Common Anode vs. Common Cathode) with the mechanical drawing before PCB layout.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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