Specifications
| Type | Description |
|---|---|
| Part Number | CC1310 |
| Manufacturer | Texas Instruments |
| Product Type | Sub-1 GHz wireless MCU |
| Category | Microcontroller |
| Component Type | MCU |
| Package Case | VQFN-48 7.00 mm x 7.00 mm; VQFN-32 5.00 mm x 5.00 mm; VQFN-32 4.00 mm x 4.00 mm |
| CPU Core | Arm Cortex-M3 |
| Maximum CPU Clock Speed | 48 MHz |
| CoreMark Score | 142 |
| ULPBench Score | 158 |
| Flash Memory | 32 KB, 64 KB, or 128 KB |
| Cache SRAM | 8 KB |
| Ultra-Low-Leakage SRAM | 20 KB |
| Debug Interface | 2-pin cJTAG and JTAG |
| OTA Update Support | Supported |
| Sensor Controller Architecture | 16-bit |
| Sensor Controller SRAM | 2 KB |
| Supply Voltage Range | 1.8 V to 3.8 V |
| RX Current | 5.4 mA |
| TX Current | 13.4 mA |
| MCU Active Current | 2.5 mA; 51 uA/MHz |
| MCU Efficiency | 48.5 CoreMark/mA |
| Sensor Controller Active Current | 0.4 mA + 8.2 uA/MHz |
| Sensor Controller Sampling Current | 0.95 uA |
| Standby Current | 0.7 uA |
| Shutdown Current | 185 nA |
| Receiver Sensitivity, Long-Range Mode | -124 dBm |
| Receiver Sensitivity, 50 kbps Mode | -110 dBm |
| Adjacent Channel Selectivity | 56 dB |
| Blocking Performance | 90 dB |
| Programmable Output Power | Up to +15 dBm |
| RF Interface | Single-ended or differential |
| Supported Frequency Bands | 315, 433, 470, 500, 779, 868, 915, and 920 MHz |
| Channel Spacing Support | 50 kHz to 5 MHz |
| GPIO Count | 10, 15, or 30 GPIOs |
| Timer Modules | 4 general-purpose timer modules; 8 x 16-bit or 4 x 32-bit timers |
| ADC Resolution and Speed | 12-bit, 200 ksamples/s |
| Serial Interfaces | UART, 2 x SSI, I2C, I2S |
| Security Hardware | AES-128 security module |
| Random Number Generator | True random number generator |
| Capacitive Touch Support | 8 buttons |
| Radio Controller Core | Arm Cortex-M0 |
| On-Chip Converter | Internal DC/DC converter |
| Package Option | CC1310F128RGZ, VQFN-48, 7.00 mm x 7.00 mm |
| Package Option | CC1310F128RHB, VQFN-32, 5.00 mm x 5.00 mm |
| Package Option | CC1310F128RSM, VQFN-32, 4.00 mm x 4.00 mm |
| Datasheet Status | request_only |
Product Overview
The Texas Instruments CC1310 is a Sub-1 GHz wireless MCU built around an Arm Cortex-M3 main microcontroller CPU running up to 48 MHz. The device includes 32 KB, 64 KB, or 128 KB in-system programmable flash options, 8 KB cache SRAM usable as general-purpose RAM, and 20 KB ultra-low-leakage SRAM for retention. Debug support is provided through 2-pin cJTAG and JTAG, and over-the-air update capability is supported.
For low-power wireless operation, the CC1310 combines the main MCU with a dedicated Arm Cortex-M0 radio controller for low-level RF protocol commands. RF parameters include 5.4 mA receive current, 13.4 mA transmit current at +10 dBm, receiver sensitivity down to -124 dBm in long-range mode, and programmable output power up to +15 dBm. Supported frequency bands include 315, 433, 470, 500, 779, 868, 915, and 920 MHz.
The device supports package-dependent GPIO counts of 10, 15, or 30 GPIOs and package formats including VQFN-48 and VQFN-32. Integrated peripherals include timers, a 12-bit ADC, UART, SSI, I2C, I2S, AES-128 hardware, a true random number generator, capacitive touch support, and an internal DC/DC converter for the integrated power system.
Key Features
- Arm Cortex-M3 main CPU running up to 48 MHz
- 32 KB, 64 KB, or 128 KB flash options
- 8 KB cache SRAM usable as general-purpose RAM
- 20 KB ultra-low-leakage SRAM for retention
- Dedicated Arm Cortex-M0 radio controller for RF commands
- Receiver sensitivity down to -124 dBm in long-range mode
- Programmable RF output power up to +15 dBm
- 12-bit ADC with 200 ksamples/s conversion speed
- UART, SSI, I2C, and I2S serial interfaces
- AES-128 security module and true random number generator
Typical Applications
- Sub-1 GHz ISM systems
- Short-range device systems
- Low-power wireless systems
- Long-range RF sensor nodes
- Capacitive touch interfaces
- ADC-based sensor sampling
- Wireless designs needing OTA updates
- AES-128 secured wireless control
Procurement Notes
When requesting a quote for CC1310, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.
FAQ
What CPU core does the CC1310 use?
The CC1310 uses an Arm Cortex-M3 as the main microcontroller CPU. The main CPU operates up to 48 MHz and is paired with a dedicated Arm Cortex-M0 radio controller for low-level RF protocol commands.
Which memory options are available on the CC1310?
The CC1310 supports 32 KB, 64 KB, or 128 KB in-system programmable flash options. It also includes 8 KB cache SRAM that can be used as general-purpose RAM and 20 KB ultra-low-leakage SRAM.
What RF bands does the CC1310 support?
The CC1310 supports 315, 433, 470, 500, 779, 868, 915, and 920 MHz bands for ISM and SRD systems. Channel spacing support is specified from 50 kHz to 5 MHz.
What package options are listed for the CC1310?
Listed package options include CC1310F128RGZ in VQFN-48 at 7.00 mm x 7.00 mm, CC1310F128RHB in VQFN-32 at 5.00 mm x 5.00 mm, and CC1310F128RSM in VQFN-32 at 4.00 mm x 4.00 mm.
What development tools support the CC1310 wireless MCU?
The CC1310 is supported by Code Composer Studio and IAR Embedded Workbench. TI offers the CC1310 LaunchPad development kit (LAUNCHXL-CC1310) for prototyping and software development with the SimpleLink SDK.
Is the CC1310 recommended for new designs in battery-powered wireless sensor applications?
Yes, the CC1310 remains in active production by Texas Instruments and is well-suited for battery-powered wireless sensor nodes due to its sub-1 GHz radio and ultra-low-power SRAM retention.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.