CC2640 Bluetooth Low Energy Wireless MCU

Texas Instruments RF_Wireless — specifications, applications, sourcing support and RFQ.

CC2640 Bluetooth Low Energy Wireless MCU

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
CC2640
Manufacturer
Texas Instruments
Package
VQFN: RGZ 48-pin 7.00 mm x 7.00 mm; RHB 32-pin 5.00 mm x 5.00 mm; RSM 32-pin 4.00 mm x 4.00 mm
Category
RF_Wireless
Product Type
Bluetooth Low Energy wireless MCU

Quick Sourcing Note

CC2640 from Texas Instruments is an RF_Wireless Bluetooth Low Energy wireless MCU supplied in VQFN package options: RGZ 48-pin 7.00 mm x 7.00 mm, RHB 32-pin 5.00 mm x 5.00 mm, and RSM 32-pin 4.00 mm x 4.00 mm. It integrates an ARM Cortex-M3 main CPU running up to 48 MHz with 128 KB flash, 20 KB ultralow-leakage SRAM, 8 KB cache SRAM, and a 16-bit ultralow-power sensor controller. RF parameters include 2.4 GHz operation, Bluetooth Low Energy 4.2 compatibility, -97 dBm receiver sensitivity, 102 dB link budget, and programmable output power up to +5 dBm.

Specifications

TypeDescription
Part NumberCC2640
ManufacturerTexas Instruments
Product TypeBluetooth Low Energy wireless MCU
CategoryRF_Wireless
Component TypeMCU
Package CaseVQFN: RGZ 48-pin 7.00 mm x 7.00 mm; RHB 32-pin 5.00 mm x 5.00 mm; RSM 32-pin 4.00 mm x 4.00 mm
Main CPU CoreARM Cortex-M3
Maximum Clock Speed48 MHz
CoreMark Score142
Flash Memory128 KB
Cache SRAM8 KB
SRAM20 KB
Sensor Controller SRAM2 KB
Sensor Controller Architecture16-bit
RF Frequency Band2.4 GHz
Bluetooth CompatibilityBluetooth Low Energy 4.2
Receiver Sensitivity-97 dBm
Link Budget102 dB
Programmable Output Powerup to +5 dBm
RF Interfacesingle-ended or differential
Normal Operating Supply Voltage1.8 to 3.8 V
External Regulator Mode Supply Voltage1.7 to 1.95 V
RX Active Current5.9 mA
TX Active Current at 0 dBm6.1 mA
TX Active Current at +5 dBm9.1 mA
MCU Active Current61 µA/MHz
MCU Efficiency48.5 CoreMark/mA
Sensor Controller Active Current8.2 µA/MHz
Standby Current1 µA
Shutdown Current100 nA
ADC Resolution12-bit
ADC Sample Rate200 ksamples/s
ADC Channels8-channel analog MUX
GPIO Count10, 15, or 31 GPIOs
Timer Modules4 general-purpose timer modules
Security ModuleAES-128
Random Number GeneratorTrue Random Number Generator
Package OptionCC2640F128RGZ, VQFN(48), 7.00 mm x 7.00 mm
Package OptionCC2640F128RHB, VQFN(32), 5.00 mm x 5.00 mm
Package OptionCC2640F128RSM, VQFN(32), 4.00 mm x 4.00 mm
Datasheet Statusrequest_only

Product Overview

The CC2640 is a Texas Instruments Bluetooth Low Energy wireless MCU in the RF_Wireless category. Its main processor is an ARM Cortex-M3 operating up to 48 MHz, with an EEMBC CoreMark score of 142 and active-mode MCU efficiency of 48.5 CoreMark/mA. Memory resources include 128 KB in-system programmable flash, 8 KB cache SRAM, and 20 KB ultralow-leakage SRAM.

The RF transceiver operates in the 2.4 GHz band and is compatible with Bluetooth Low Energy 4.2. RF performance parameters include -97 dBm receiver sensitivity, 102 dB link budget, programmable transmitter output power up to +5 dBm, and an RF interface that can be single-ended or differential.

Peripheral and low-power functions include a 16-bit ultralow-power sensor controller with 2 KB SRAM for code and data, a 12-bit ADC at 200 ksamples/s through an 8-channel analog MUX, AES-128 security, a True Random Number Generator, GPIO counts of 10, 15, or 31 depending on package, and VQFN package options from 4.00 mm x 4.00 mm to 7.00 mm x 7.00 mm.

Key Features

  • ARM Cortex-M3 main CPU runs up to 48 MHz
  • 128 KB in-system programmable flash memory
  • 20 KB ultralow-leakage SRAM plus 8 KB cache SRAM
  • 16-bit sensor controller with 2 KB code and data SRAM
  • 2.4 GHz RF transceiver supports Bluetooth Low Energy 4.2
  • -97 dBm BLE receiver sensitivity with 102 dB link budget
  • Programmable RF output power up to +5 dBm
  • Active RX current is 5.9 mA
  • Standby current is 1 µA with RTC and retention
  • 12-bit ADC supports 200 ksamples/s through 8-channel MUX
  • AES-128 security peripheral and True Random Number Generator
  • VQFN package options include 48-pin and 32-pin variants

Typical Applications

  • Bluetooth Low Energy sensor nodes
  • 2.4 GHz wireless MCU designs
  • Low-power connected peripherals
  • Battery-powered data acquisition
  • BLE devices with ADC inputs
  • Secure wireless embedded systems
  • Compact VQFN RF modules

Procurement Notes

When requesting a quote for CC2640, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.

FAQ

What processor core does the CC2640 use?

The CC2640 uses an ARM Cortex-M3 as its main processor. The extracted datasheet facts specify a maximum main CPU clock speed of 48 MHz and an EEMBC CoreMark score of 142.

Which Bluetooth standard is supported by the CC2640 RF transceiver?

The CC2640 RF transceiver operates in the 2.4 GHz band and is specified as compatible with Bluetooth Low Energy 4.2. The same RF section lists -97 dBm receiver sensitivity and a 102 dB BLE link budget.

What memory resources are integrated in the CC2640?

The CC2640 includes 128 KB of in-system programmable flash, 8 KB of cache SRAM, and 20 KB of ultralow-leakage SRAM. Its ultralow-power sensor controller also has 2 KB of SRAM for code and data.

What package options are listed for the CC2640?

The listed package options are CC2640F128RGZ in VQFN(48) at 7.00 mm x 7.00 mm, CC2640F128RHB in VQFN(32) at 5.00 mm x 5.00 mm, and CC2640F128RSM in VQFN(32) at 4.00 mm x 4.00 mm.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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