CC1352R Multi-band Wireless MCU

Texas Instruments Microcontroller — specifications, applications, sourcing support and RFQ.

CC1352R Multi-band Wireless MCU

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
CC1352R
Manufacturer
Texas Instruments
Package
VQFN-48, 7.00 mm x 7.00 mm body
Category
Microcontroller
Product Type
Multi-band wireless MCU

Quick Sourcing Note

CC1352R from Texas Instruments is a multi-band wireless MCU in the Microcontroller category, supplied in a VQFN-48 package with a 7.00 mm x 7.00 mm body. It integrates a 48-MHz Arm Cortex-M4F system CPU, 352 KB in-system programmable flash, 256 KB ROM for protocols and library functions, and 80 KB ultra-low leakage SRAM with parity protection. The device supports Sub-1 GHz and 2.4 GHz RF operation, Bluetooth 5.2 Low Energy and earlier LE specifications, and IEEE 802.15.4 PHY and MAC. It is suited to wireless MCU designs using low-power sensing, capacitive sensing, secure communication, and ISM/SRD band operation.

Specifications

TypeDescription
Part NumberCC1352R
ManufacturerTexas Instruments
Product TypeMulti-band wireless MCU
CategoryMicrocontroller
Component TypeMCU
Package CaseVQFN-48, 7.00 mm x 7.00 mm body
Main CPU48-MHz Arm Cortex-M4F processor; System CPU
CoreMark Score148; EEMBC CoreMark benchmark
Flash Memory352 KB; In-system programmable flash
ROM256 KB; For protocols and library functions
Cache SRAM8 KB; Alternatively available as general-purpose RAM
Ultra-Low Leakage SRAM80 KB; SRAM protected by parity
Sensor Controller SRAM4 KB; Ultra-low power sensor controller
Debug Interface2-pin cJTAG and JTAG; Debugging support
Supply Voltage Range1.8 V to 3.8 V; Recommended operating supply range stated in features
Package GPIO Count28 GPIOs; 7 mm x 7 mm RGZ VQFN48 package
General-Purpose Timers4 x 32-bit or 8 x 16-bit; Peripheral feature set
ADC Resolution and Rate12-bit, 200 kSamples/s, 8 channels; Peripheral ADC
Comparators2 comparators with internal reference DAC; 1 continuous-time comparator and 1 ultra-low-power comparator
UART Interfaces2 x UART; Serial peripherals
SSI Interfaces2 x SSI; Supports SPI, MICROWIRE, and TI modes
Cryptographic AcceleratorAES 128-bit and 256-bit; Hardware cryptographic accelerator
Public Key AcceleratorECC and RSA; Hardware public key acceleration
SHA AcceleratorSHA2 full suite up to SHA-512; Hardware SHA2 accelerator
Random Number GeneratorTrue random number generator; TRNG peripheral
Capacitive Sensing ChannelsUp to 8 channels; Capacitive sensing peripheral
Active RX Current, 868 MHz5.8 mA; 3.6 V, 868 MHz
Active RX Current, 2.4 GHz6.9 mA; 3.0 V, 2.4 GHz
Active TX Current at 0 dBm, 868 MHz8.0 mA; 3.6 V, 868 MHz
Active TX Current at 0 dBm, 2.4 GHz7.1 mA; 3.0 V, 2.4 GHz
Active TX Current at +14 dBm24.9 mA; 868 MHz
Active MCU Current2.9 mA, 60 uA/MHz; 48 MHz CoreMark, 3.6 V
Sensor Controller Low-Power Current30.1 uA; 2 MHz, running infinite loop
Sensor Controller Active Current808 uA; 24 MHz, running infinite loop
Standby Current0.85 uA; RTC on, 80 KB RAM and CPU retention
Shutdown Current150 nA; Wakeup on external events
RF BandsSub-1 GHz and 2.4 GHz; Multi-band RF transceiver
Supported Bluetooth VersionBluetooth 5.2 Low Energy and earlier LE specifications; Radio protocol support
IEEE 802.15.4 SupportIEEE 802.15.4 PHY and MAC; Radio protocol support
PTA Coexistence3-wire, 2-wire, 1-wire; Coexistence mechanisms
Receiver Sensitivity, Long-Range Mode-121 dBm; SimpleLink long-range mode
Receiver Sensitivity, 50 kbps-110 dBm; 50 kbps
Receiver Sensitivity, Bluetooth LE Coded PHY-105 dBm; Bluetooth 125-kbps LE Coded PHY
Maximum Sub-1 GHz Output Power+14 dBm; With temperature compensation
Maximum 2.4 GHz Output Power+5 dBm; With temperature compensation
Supported ISM/SRD Bands169, 433, 470 to 510, 868, 902 to 928, and 2400 to 2480 MHz; ISM and SRD systems
Minimum Receive BandwidthDown to 4 kHz; ISM and SRD systems
2.4 GHz TX Current at Maximum Power9.6 mA; +5 dBm transmit power at 2.4 GHz
Industrial High-Temperature Standby Current5 uA; 85°C standby current
Sensor Controller ADC Sampling Current1 uA system current; 1-Hz ADC sampling example
Orderable Part NumberCC1352R1F3RGZ; Device information table
Datasheet Statusrequest_only

Product Overview

The CC1352R is a Texas Instruments multi-band wireless MCU built around a 48-MHz Arm Cortex-M4F system CPU with a 148 CoreMark score. Memory resources include 352 KB of in-system programmable flash, 256 KB ROM for protocols and library functions, 8 KB cache SRAM that can alternatively be used as general-purpose RAM, and 80 KB ultra-low leakage SRAM protected by parity.

The device combines MCU peripherals with a multi-band RF transceiver. It supports Sub-1 GHz and 2.4 GHz bands, Bluetooth 5.2 Low Energy and earlier LE specifications, IEEE 802.15.4 PHY and MAC, and 3-wire, 2-wire, or 1-wire PTA coexistence. Supported ISM/SRD bands include 169, 433, 470 to 510, 868, 902 to 928, and 2400 to 2480 MHz.

For assembly, the listed package is a VQFN-48 with a 7.00 mm x 7.00 mm body, and the 7 mm x 7 mm RGZ VQFN48 package provides 28 GPIOs. The peripheral set includes timers, ADC, comparators, UART, SSI, cryptographic acceleration, public key acceleration, SHA2 acceleration, TRNG, capacitive sensing, and low-power sensor controller operation.

Key Features

  • 48-MHz Arm Cortex-M4F system CPU
  • 352 KB in-system programmable flash memory
  • 256 KB ROM for protocols and library functions
  • Sub-1 GHz and 2.4 GHz RF transceiver
  • Bluetooth 5.2 Low Energy radio protocol support
  • IEEE 802.15.4 PHY and MAC support
  • 12-bit ADC with 200 kSamples/s and 8 channels
  • AES, ECC, RSA, SHA2, and TRNG hardware support
  • 0.85 uA standby current with RTC and retention
  • VQFN-48 package with 28 GPIOs

Typical Applications

  • Bluetooth Low Energy wireless nodes
  • IEEE 802.15.4 network devices
  • Sub-1 GHz ISM systems
  • 2.4 GHz ISM systems
  • Low-power sensor controller designs
  • Capacitive sensing interfaces
  • Secure embedded wireless communication
  • PTA coexistence wireless products

Procurement Notes

When requesting a quote for CC1352R, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.

FAQ

What processor core does the CC1352R use?

The CC1352R uses a 48-MHz Arm Cortex-M4F processor as its system CPU. The extracted datasheet facts list a 148 score for the EEMBC CoreMark benchmark.

Which RF bands and protocols are supported by CC1352R?

The CC1352R includes a multi-band RF transceiver supporting Sub-1 GHz and 2.4 GHz operation. Protocol support includes Bluetooth 5.2 Low Energy and earlier LE specifications, plus IEEE 802.15.4 PHY and MAC.

What memory resources are integrated in the CC1352R?

The device includes 352 KB of in-system programmable flash, 256 KB ROM for protocols and library functions, 8 KB cache SRAM alternatively available as general-purpose RAM, 80 KB ultra-low leakage SRAM, and 4 KB sensor controller SRAM.

What package and GPIO count are listed for this device?

The listed package is VQFN-48 with a 7.00 mm x 7.00 mm body. The extracted facts specify 28 GPIOs for the 7 mm x 7 mm RGZ VQFN48 package.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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