Specifications
| Type | Description |
|---|---|
| Part Number | CC2640R2F |
| Manufacturer | Texas Instruments |
| Product Type | Wireless MCU |
| Category | MCU & Processors |
| Component Type | MCU |
| Package Case | VQFN48 7.00 mm x 7.00 mm; VQFN32 5.00 mm x 5.00 mm; VQFN32 4.00 mm x 4.00 mm; DSBGA34 2.70 mm x 2.70 mm |
| CPU Core | Arm Cortex-M3 |
| Maximum Clock Speed | Up to 48 MHz |
| CoreMark Score | 142 |
| Nonvolatile Memory | 275 KB total including 128 KB in-system programmable Flash |
| System SRAM | Up to 28 KB; 20 KB ultra-low leakage SRAM plus 8 KB SRAM for cache or system RAM use |
| Wireless Standard Support | Bluetooth 5.1 Low Energy and earlier LE specifications |
| RF Frequency Band | 2.4 GHz |
| Receiver Sensitivity | -97 dBm for BLE |
| Programmable Output Power | Up to +5 dBm |
| Normal Supply Voltage Range | 1.8 to 3.8 V |
| RX Current | 5.9 mA active-mode RX |
| TX Current | 6.1 mA active-mode TX at 0 dBm |
| Standby Current | 1.1 uA with RTC running and RAM/CPU retention |
| Shutdown Current | 100 nA with wake up on external events |
| ADC Resolution | 12-bit |
| ADC Sample Rate | 200 ksamples/s |
| ADC Channels | 8-channel analog MUX |
| Communication Interfaces | UART, I2C, I2S, 2x SSI |
| Security Hardware | AES-128 module |
| GPIO Count | 31, 15, 14, or 10 GPIOs depending on package |
| Datasheet Status | request_only |
Product Overview
The Texas Instruments CC2640R2F is a Bluetooth Low Energy wireless MCU built around an Arm Cortex-M3 main CPU running up to 48 MHz. Its on-chip memory includes 275 KB total nonvolatile memory with 128 KB in-system programmable Flash, up to 28 KB system SRAM, and 2 KB ultra-low leakage SRAM for the sensor controller. Debug support is provided through 2-pin cJTAG and JTAG interfaces.
The integrated 2.4-GHz RF transceiver supports Bluetooth 5.1 Low Energy and earlier LE specifications. RF parameters include -97 dBm BLE receiver sensitivity, -103 dBm sensitivity for 125-kbps LE Coded PHY, 102 dB BLE link budget, and programmable transmitter output power up to +5 dBm. The RF interface can be configured as single-ended or differential.
For low-power systems, the device specifies 1.8 to 3.8 V normal operation or 1.7 to 1.95 V external regulator mode. Current figures include 5.9 mA RX, 6.1 mA TX at 0 dBm, 9.1 mA TX at +5 dBm, 1.1 uA standby with RTC and retention, and 100 nA shutdown with external-event wake. Package-dependent GPIO counts are 31, 15, 14, or 10.
Key Features
- Arm Cortex-M3 main CPU up to 48 MHz
- Bluetooth 5.1 Low Energy and earlier LE support
- 2.4-GHz RF transceiver with single-ended or differential interface
- -97 dBm BLE receiver sensitivity and 102 dB link budget
- Programmable RF output power up to +5 dBm
- 275 KB total nonvolatile memory with 128 KB Flash
- Up to 28 KB system SRAM plus sensor controller SRAM
- 12-bit ADC with 200 ksamples/s and 8-channel MUX
- UART, I2C, I2S, and two SSI interfaces
- AES-128 module and True Random Number Generator
- 1.1 uA standby current with RTC and retention
- Package-dependent GPIO count from 10 to 31
Typical Applications
- Bluetooth LE sensor nodes
- Battery-powered wireless endpoints
- Low-power connected peripherals
- ADC-based sensing devices
- UART or I2C peripheral bridges
- SPI-connected wireless controllers
- Bluetooth LE Coded PHY products
Procurement Notes
When requesting a quote for CC2640R2F, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.
FAQ
What CPU core is used in the CC2640R2F?
The CC2640R2F uses an Arm Cortex-M3 as the main microcontroller CPU. The main CPU clock is specified up to 48 MHz, and the device has an EEMBC CoreMark score of 142.
Which Bluetooth standards does the CC2640R2F support?
The integrated 2.4-GHz RF transceiver supports Bluetooth 5.1 Low Energy and earlier LE specifications. The device also specifies -103 dBm receiver sensitivity for the 125-kbps LE Coded PHY.
What package options are listed for the CC2640R2F?
The listed package options are VQFN48 7.00 mm x 7.00 mm, VQFN32 5.00 mm x 5.00 mm, VQFN32 4.00 mm x 4.00 mm, and DSBGA34 2.70 mm x 2.70 mm.
What low-power current values are specified for this MCU?
The CC2640R2F specifies 1.1 uA standby current with RTC running and RAM/CPU retention. Shutdown current is specified as 100 nA with wake up on external events.
How many GPIOs does the CC2640R2F provide?
GPIO count is package-dependent: 31 GPIOs on the VQFN48 package, 15 on VQFN32 (5 mm), 14 on VQFN32 (4 mm), and 10 on the DSBGA34 package.
Is the CC2640R2F available for sourcing?
Yes, the CC2640R2F is available for sourcing support. Please submit an RFQ for current pricing and availability information.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.