Specifications
| Type | Description |
|---|---|
| Part Number | EL_6N137_EL26XX |
| Manufacturer | EVERLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 8-pin DIP; options: standard DIP-8, M wide lead bend 0.4 inch spacing, S surface mount lead form, S1 low-profile surface mount lead form |
| Data Rate | 10 Mbit/s; high speed logic gate photocoupler |
| Isolation Voltage | 5000 Vrms; AC for 1 minute, RH=40-60%, input pins 1-4 shorted and output pins 5-8 shorted |
| Operating Temperature | -40 to +85 °C; absolute maximum rating |
| Storage Temperature | -55 to +125 °C; absolute maximum rating |
| Forward Current | 50 mA max; absolute maximum rating, input |
| Reverse Voltage | 5 V max; absolute maximum rating, input |
| Input Power Dissipation | 100 mW max; absolute maximum rating |
| Output Power Dissipation | 100 mW max; absolute maximum rating |
| Package Power Dissipation | 85 mW max; absolute maximum rating |
| Output Current | 50 mA max; absolute maximum rating |
| Output Voltage | 7.0 V max; absolute maximum rating |
| Supply Voltage | 7.0 V max; absolute maximum rating |
| Enable Input Voltage | VCC + 0.5 V max, not to exceed 5.5 V; absolute maximum rating |
| Soldering Temperature | 260 °C max; 10 seconds |
| Forward Voltage | 1.4 V typ, 1.8 V max; IF=10 mA, Ta=-40 to 85°C |
| Reverse Voltage | 5.0 V min; IR=10 uA, Ta=-40 to 85°C |
| Forward Voltage Temperature Coefficient | -1.8 mV/°C typ; IF=10 mA, Ta=-40 to 85°C |
| Input Capacitance | 60 pF typ; VF=0 V, f=1 MHz, Ta=-40 to 85°C |
| High Level Supply Current | 7 mA typ, 10 mA max; IF=0 mA, VE=0.5 V, VCC=5.5 V |
| Low Level Supply Current | 9 mA typ, 13 mA max; IF=10 mA, VCC=5.5 V |
| High Level Enable Current | -0.6 mA typ, -1.6 mA max; VE=2.0 V, VCC=5.5 V |
| Low Level Enable Current | -0.8 mA typ, -1.6 mA max; VE=0.5 V, VCC=5.5 V |
| High Level Enable Voltage | 2.0 V min; IF=10 mA, VCC=5.5 V |
| Low Level Enable Voltage | 0.8 V max; IF=10 mA, VCC=5.5 V; no pull-up resistor required due to internal pull-up |
| High Level Output Current | 2.1 uA typ, 100 uA max; VCC=5.5 V, VO=5.5 V, IF=250 uA, VE=2.0 V |
| Low Level Output Voltage | 0.35 V typ, 0.6 V max; VCC=5.5 V, IF=5 mA, VE=2.0 V, IOL=13 mA |
| Input Threshold Current | 2.5 mA typ, 5 mA max; VCC=5.5 V, VO=0.6 V, VE=2.0 V, IOL=13 mA |
| Propagation Delay to Output High Level | 35 ns typ, 75 ns max; VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 ohm, Ta=25°C |
| Propagation Delay to Output Low Level | 40 ns typ, 75 ns max; VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 ohm, Ta=25°C |
| Pulse Width Distortion | 5 ns typ, 35 ns max; CL=15 pF, RL=350 ohm |
| Output Rise Time | 40 ns typ; CL=15 pF, RL=350 ohm |
| Output Fall Time | 10 ns typ; CL=15 pF, RL=350 ohm |
| Enable Propagation Delay to Output High Level | 15 ns typ; IF=7.5 mA, VEH=3.5 V, CL=15 pF, RL=350 ohm |
| Enable Propagation Delay to Output Low Level | 15 ns typ; IF=7.5 mA, VEH=3.5 V, CL=15 pF, RL=350 ohm |
| Common Mode Transient Immunity at Logic High | 5000 V/us min; EL2601, IF=0 mA, VOH=2.0 V, RL=350 ohm, Ta=25°C, VCM=50 Vp-p |
| Common Mode Transient Immunity at Logic High | 10000 V/us min; EL2611, IF=0 mA, VOH=2.0 V, RL=350 ohm, Ta=25°C, VCM=400 Vp-p, Fig.14 |
| Common Mode Transient Immunity at Logic High | 20000 V/us min; EL2611, IF=0 mA, VOH=2.0 V, RL=350 ohm, Ta=25°C, VCM=400 Vp-p, Fig.15 recommended drive circuit |
| Common Mode Transient Immunity at Logic Low | 5000 V/us min; EL2601, IF=7.5 mA, VOL=0.8 V, RL=350 ohm, Ta=25°C, VCM=50 Vp-p |
| Common Mode Transient Immunity at Logic Low | 10000 V/us min; EL2611, IF=7.5 mA, VOL=0.8 V, RL=350 ohm, Ta=25°C, VCM=400 Vp-p, Fig.14 |
| Common Mode Transient Immunity at Logic Low | 20000 V/us min; EL2611, IF=7.5 mA, output condition listed as VOH=0.8 V in source table, RL=350 ohm, Ta=25°C, VCM=400 Vp-p, Fig.15 |
| Supply Bypass Capacitor | 0.1 uF or larger; connect between VCC pin 8 and GND pin 5 as close as possible to package |
| Truth Table Output | Output low; input high, enable high |
| Truth Table Output | Output high; input low, enable high |
| Truth Table Output | Output high; enable low, input high or low |
| Pin 1 | No connection; pin configuration |
| Pin 2 | Anode; pin configuration |
| Pin 3 | Cathode; pin configuration |
| Pin 4 | No connection; pin configuration |
| Pin 5 | GND; pin configuration |
| Pin 6 | Vout; pin configuration |
| Pin 7 | VE; pin configuration, enable input |
| Pin 8 | VCC; pin configuration |
| Reflow Preheat Temperature | 150 to 200 °C; Tsmin to Tsmax |
| Reflow Preheat Time | 60 to 120 seconds; Tsmin to Tsmax |
| Reflow Peak Temperature | 260 °C; IPC/JEDEC J-STD-020D reference profile |
| Reflow Times | 3 times; maximum reflow profile |
| Datasheet Status | request_only |
Product Overview
The device supports a 10 Mbit/s data rate and 5000 Vrms isolation voltage under the stated 1-minute AC test condition. Electrical limits include 50 mA maximum input forward current, 5 V maximum input reverse voltage, 7.0 V maximum output and supply voltage, and a VE limit of VCC + 0.5 V not exceeding 5.5 V. Operating temperature is -40 to +85 °C, with storage from -55 to +125 °C.
Switching characteristics include 35 ns typical propagation delay to output high level, 40 ns typical propagation delay to output low level, 5 ns typical pulse-width distortion, 40 ns typical rise time, and 10 ns typical fall time under the listed load conditions. Assembly guidance includes a 0.1 uF or larger VCC-to-GND bypass capacitor placed close to the package, 260 °C maximum soldering for 10 seconds, and a JEDEC-referenced 260 °C peak reflow profile up to 3 times.
Key Features
- 10 Mbit/s high speed logic gate photocoupler
- 5000 Vrms isolation voltage for one-minute AC test
- -40 to +85 °C operating temperature range
- 8-pin DIP with multiple lead-form options
- Enable input with defined high and low thresholds
- 35 ns typical output-high propagation delay
- 40 ns typical output-low propagation delay
- 5 ns typical pulse-width distortion
- Common-mode transient immunity up to 20000 V/us
- 0.1 uF or larger VCC bypass capacitor specified
Typical Applications
- Isolated high speed logic interfaces
- Enable-controlled digital outputs
- 5 V logic signal isolation
- Common-mode transient environments
- DIP-8 through-hole assemblies
- Surface mount lead-form assemblies
- Circuits requiring 10 Mbit/s coupling
- Boards using close VCC bypassing
Procurement Notes
When requesting a quote for EL_6N137_EL26XX, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is EL_6N137_EL26XX?
EL_6N137_EL26XX is an EVERLIGHT high speed logic gate photocoupler in the LED category. The extracted datasheet facts specify a 10 Mbit/s data rate, an 8-pin DIP package family, and defined input, output, enable, and supply pins.
What isolation rating is specified for this photocoupler?
The isolation voltage is specified as 5000 Vrms under an AC 1-minute test condition, with RH=40-60%, input pins 1-4 shorted, and output pins 5-8 shorted.
What are the main switching timing values?
At VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 ohm, and Ta=25°C, propagation delay is 35 ns typical to output high and 40 ns typical to output low, with 75 ns maximum for both.
How should the supply bypass capacitor be placed?
The datasheet facts specify a 0.1 uF or larger bypass capacitor between VCC pin 8 and GND pin 5. It should be connected as close as possible to the package.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.