TPS51206 DDR Termination Regulator

Texas Instruments Power_Management — specifications, applications, sourcing support and RFQ.

TPS51206 DDR Termination Regulator

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
TPS51206_DDR-Termination
Manufacturer
Texas Instruments
Package
10-pin WSON/SON (DSQ), 2.00 mm x 2.00 mm body
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

TPS51206_DDR-Termination is a Power_Management DDR termination regulator record listed under Texas Instruments, with extracted datasheet manufacturer identification from Texas Instruments. The device is a sink/source VTT regulator with a buffered VTTREF reference for DDR2, DDR3, DDR3L, and DDR4 memory power rails. It uses a 10-pin WSON/SON (DSQ) package with a 2.00 mm x 2.00 mm body. Key parameters include 3.1 V to 6.5 V VDD operation, 0.5 V to 0.9 V VTT range, VTT equal to VDDQSNS/2, 2 A peak sink/source capability, S3/S5 power-state control, and -40°C to 105°C free-air operating range.

Specifications

TypeDescription
Part NumberTPS51206_DDR-Termination
ManufacturerTexas Instruments
Product TypeLDO Regulator
CategoryPower Management
Package/Case10-pin WSON/SON (DSQ), 2.00 mm x 2.00 mm body
Base Part NumberTPS51206
Datasheet ManufacturerTexas Instruments
Regulator FunctionSink/source DDR termination regulator with VTTREF buffered reference
Supported DDR StandardsDDR2, DDR3, DDR3L, DDR4
Supply Voltage3.1 V min, 6.5 V max
Supported Supply Rails3.3 V rail and 5 V rail
VLDOIN Input Voltage RangeVTT + 0.4 V to 3.5 V
VLDOIN Recommended Input Voltage-0.1 V min, 3.5 V max
VTT Output Voltage Range0.5 V to 0.9 V
VTT Output VoltageVDDQSNS / 2
VTT Peak Sink/Source Current2 A peak sink and source
VTT Source Current Limit2 A
VTT Source Current Limit ConditionVDDQSNS = 1.8 V, VTT = VTTSNS = 0.7 V
VTT Sink Current Limit2 A
VTT Sink Current Limit ConditionVDDQSNS = 1.8 V, VTT = VTTSNS = 1.1 V
VTT Output Accuracy±20 mV
VTT Output Tolerance-20 mV min, 20 mV max; |IVTT| <= 10 mA, 1.4 V <= VDDQSNS <= 1.8 V
VTT Output Tolerance-30 mV min, 30 mV max; |IVTT| < 1 A, 1.4 V <= VDDQSNS <= 1.8 V
VTT Output Tolerance-40 mV min, 40 mV max; |IVTT| < 2 A, 1.4 V <= VDDQSNS <= 1.8 V
VTT Output Tolerance-20 mV min, 20 mV max; |IVTT| <= 10 mA, 1.2 V <= VDDQSNS <= 1.4 V
VTT Output Tolerance-30 mV min, 30 mV max; |IVTT| < 1 A, 1.2 V <= VDDQSNS <= 1.4 V
VTT Output Tolerance-40 mV min, 40 mV max; |IVTT| < 1.5 A, 1.2 V <= VDDQSNS < 1.4 V
VTT Output Capacitor10 µF or greater MLCC required; no maximum limit
VTTREF Output VoltageVDDQSNS / 2
VTTREF AccuracyVDDQ / 2 ±1%
VTTREF Output Voltage Tolerance49% min, 51% max of VDDQSNS; |IVTTREF| <= 10 mA, 1.5 V <= VDDQSNS <= 1.8 V
VTTREF Output Voltage Tolerance48.75% min, 51.25% max of VDDQSNS; |IVTTREF| <= 10 mA, 1.2 V <= VDDQSNS < 1.5 V
VTTREF Output Voltage Tolerance49% min, 51% max of VDDQSNS; |IVTTREF| <= 100 µA, 1.2 V <= VDDQSNS <= 1.8 V
VTTREF Source Current10 mA
VTTREF Source Current ConditionVDDQSNS = 1.8 V, VTTREF = 0 V
VTTREF Sink Current10 mA
VTTREF Sink Current ConditionVDDQSNS = 0 V, VTTREF = 1.8 V
VTTREF Capacitor0.22 µF to 1 µF MLCC
VTTREF Capacitor ConditionRequired for stability; VTTREF pin cannot be open
S3/S5 Power State SupportHigh-Z in S3; soft-stop/discharge in S4 and S5
VDD Supply Current in S0170 µA typ
VDD Supply Current in S0 ConditionTA = 25°C, VDDQSNS = 1.8 V, no load, S3 = S5 = 5 V
VDD Supply Current in S380 µA typ
VDD Supply Current in S3 ConditionTA = 25°C, VDDQSNS = 1.8 V, no load, S3 = 0 V, S5 = 5 V
VDD Shutdown Current1 µA typ
VDD Shutdown Current ConditionTA = 25°C, VDDQSNS = 1.8 V, no load, S3 = S5 = 0 V
VLDOIN Supply Current in S05 µA typ
VLDOIN Supply Current in S0 ConditionTA = 25°C, VLDOIN = 1.8 V, no load, S3 = S5 = 5 V
VLDOIN Supply Current in S35 µA typ
VLDOIN Supply Current in S3 ConditionTA = 25°C, VLDOIN = 1.8 V, no load, S3 = 0 V, S5 = 5 V
VLDOIN Shutdown Current5 µA typ
VLDOIN Shutdown Current ConditionTA = 25°C, VLDOIN = 1.8 V, no load, S3 = S5 = 0 V
VTT Leakage Current5 µA typ
VTT Leakage Current ConditionTA = 25°C, VTT = VTTREF, S3 = 0 V, S5 = 5 V
VTTSNS Input Bias Current-0.1 µA min, 0.1 µA max
VTTSNS Input Bias Current ConditionS3 = 5 V, S5 = 5 V, VTTSNS = VTTREF
VTTSNS Leakage Current-0.1 µA min, 0.1 µA max
VTTSNS Leakage Current ConditionS3 = 0 V, S5 = 5 V, VTTSNS = VTTREF
VTT Discharge Current7 mA typ
VTT Discharge Current ConditionTA = 25°C, VTT = 0.5 V, S3 = S5 = VDDQSNS = 0 V
VTTREF Discharge Current1.3 mA typ
VTTREF Discharge Current ConditionTA = 25°C, S3 = S5 = 0 V, VTTREF = 0.5 V
VDDQSNS Input Current30 µA typ
VDDQSNS Input Current ConditionVDDQSNS = 1.8 V
VDD UVLO Wakeup Threshold2.67 V min, 2.90 V typ, 3.00 V max
VDD UVLO Hysteresis0.2 V typ
S3/S5 Low-Level Voltage0.5 V max
S3/S5 High-Level Voltage1.8 V min
S3/S5 Hysteresis Voltage0.3 V typ
S3/S5 Input Leakage Current-1 µA min, 1 µA max
Operating Free-Air Temperature-40°C min, 105°C max
Operating Junction Temperature-40°C min, 150°C max
Storage Temperature-55°C min, 150°C max
Overtemperature Shutdown150°C typ
Overtemperature Shutdown ConditionEnsured by design, not production tested
Overtemperature Hysteresis10°C typ
Overtemperature Hysteresis ConditionEnsured by design, not production tested
ESD Rating HBM±2000 V
ESD Rating HBM ConditionHuman-body model per ANSI/ESDA/JEDEC JS-001
ESD Rating CDM±500 V
ESD Rating CDM ConditionCharged-device model per JEDEC JESD22-C101
Junction-to-Ambient Thermal Resistance70.3°C/W
Junction-to-Ambient Thermal Resistance ConditionDSQ WSON, 10 pins
Junction-to-Case Top Thermal Resistance46.3°C/W
Junction-to-Case Top Thermal Resistance ConditionDSQ WSON, 10 pins
Junction-to-Board Thermal Resistance33.8°C/W
Junction-to-Board Thermal Resistance ConditionDSQ WSON, 10 pins
Junction-to-Case Bottom Thermal Resistance16.3°C/W
Junction-to-Case Bottom Thermal Resistance ConditionDSQ WSON, 10 pins
Thermal PadSolder to ground plane for increased thermal performance
Datasheet Statusrequest_only

Product Overview

TPS51206_DDR-Termination is classified as a Power_IC DDR termination regulator for memory power systems. The extracted datasheet facts identify the base part as TPS51206 and describe a sink/source DDR termination regulator with a buffered VTTREF reference for DDR2, DDR3, DDR3L, and DDR4 applications.

The regulator operates from a 3.1 V to 6.5 V VDD supply and supports 3.3 V and 5 V rails. VTT is regulated at VDDQSNS/2, with a 0.5 V to 0.9 V output range and 2 A peak sink/source capability. VTTREF is also VDDQSNS/2 and is specified for 10 mA source and sink current.

The package is a 10-pin WSON/SON (DSQ) with a 2.00 mm x 2.00 mm body. The VTT pin requires a 10 µF or greater MLCC, VTTREF requires a 0.22 µF to 1 µF MLCC, and the thermal pad is specified for soldering to the ground plane to improve thermal performance.

Key Features

  • Sink/source DDR termination regulator with buffered VTTREF reference
  • Supports DDR2, DDR3, DDR3L, and DDR4 memory rails
  • Operates from 3.1 V to 6.5 V VDD
  • Supports 3.3 V and 5 V supply rails
  • VTT output range is 0.5 V to 0.9 V
  • VTT and VTTREF track VDDQSNS divided by two
  • 2 A peak VTT sink and source capability
  • S3 high-Z and S4/S5 soft-stop discharge support
  • 10-pin 2 mm x 2 mm WSON/SON DSQ package
  • Thermal pad specified for soldering to ground plane

Typical Applications

  • DDR2 memory termination
  • DDR3 memory termination
  • DDR3L memory termination
  • DDR4 memory termination
  • VTT bus power supplies
  • Memory power supply rails
  • S3 and S5 power-state systems
  • 3.3 V rail systems
  • 5 V rail systems

Procurement Notes

When requesting a quote for TPS51206_DDR-Termination, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What is the regulated VTT output voltage?

The extracted electrical characteristics specify VTT as VDDQSNS divided by two. The listed VTT termination output voltage range is 0.5 V to 0.9 V.

Which DDR memory standards are supported?

The extracted facts list DDR2, DDR3, DDR3L, and DDR4 support for memory power supplies and the VTT bus.

What output capacitors are required for stability?

The VTT pin requires a 10 µF or greater MLCC with no maximum limit. The VTTREF pin requires a 0.22 µF to 1 µF MLCC and cannot be left open.

What package is specified for this regulator?

The package is specified as a 10-pin WSON/SON DSQ package with a 2.00 mm x 2.00 mm body. Thermal data is listed for the DSQ WSON 10-pin package.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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