Specifications
| Type | Description |
|---|---|
| Part Number | TPS51620_DDR5-PMIC |
| Manufacturer | Texas Instruments |
| Product Type | LDO Regulator |
| Category | Power Management |
| Component Type | Power_IC |
| Package Case | RHA 40 VQFN, 6 mm x 6 mm, 0.5 mm pitch, 1 mm max height |
| Target Application | Power IMVP Mobile Processors; requires Intel CNDA disclosure agreement |
| Disclosure Requirement | Current CNDA Agreement with Intel required for end user access/use |
| Contact for More Information | IMVP@list.ti.com for Intel CNDA / IMVP information |
| TPS51620RHAR Package Type | VQFN |
| TPS51620RHAR Package Drawing | RHA |
| TPS51620RHAR Pin Count | 40 pins |
| TPS51620RHAR Standard Pack Quantity | 2500 units |
| TPS51620RHAR Reel Diameter | 330.0 mm |
| TPS51620RHAR Reel Width W1 | 16.4 mm |
| TPS51620RHAR Tape Cavity A0 | 6.3 mm |
| TPS51620RHAR Tape Cavity B0 | 6.3 mm |
| TPS51620RHAR Tape Cavity K0 | 1.1 mm |
| TPS51620RHAR Tape Pitch P1 | 12.0 mm |
| TPS51620RHAR Carrier Tape Width W | 16.0 mm |
| TPS51620RHAR Pin 1 Quadrant | Q2 |
| TPS51620RHAT Package Type | VQFN |
| TPS51620RHAT Package Drawing | RHA |
| TPS51620RHAT Pin Count | 40 pins |
| TPS51620RHAT Standard Pack Quantity | 250 units |
| TPS51620RHAT Reel Diameter | 180.0 mm |
| TPS51620RHAT Reel Width W1 | 16.4 mm |
| TPS51620RHAT Tape Cavity A0 | 6.3 mm |
| TPS51620RHAT Tape Cavity B0 | 6.3 mm |
| TPS51620RHAT Tape Cavity K0 | 1.1 mm |
| TPS51620RHAT Tape Pitch P1 | 12.0 mm |
| TPS51620RHAT Carrier Tape Width W | 16.0 mm |
| TPS51620RHAT Pin 1 Quadrant | Q2 |
| TPS51620RHAR Box Length | 367.0 mm |
| TPS51620RHAR Box Width | 367.0 mm |
| TPS51620RHAR Box Height | 38.0 mm |
| TPS51620RHAT Box Length | 210.0 mm |
| TPS51620RHAT Box Width | 185.0 mm |
| TPS51620RHAT Box Height | 35.0 mm |
| Package Family | RHA 40 VQFN |
| Package Maximum Height | 1 mm max |
| Package Body Size | 6 mm x 6 mm |
| Package Pitch | 0.5 mm |
| Package Material Description | Plastic quad flatpack, no-lead |
| Datasheet Status | request_only |
Product Overview
TPS51620_DDR5-PMIC from Texas Instruments is classified under Power_Management and described in the extracted datasheet facts as an IMVP mobile processor power IC. Its stated target application is power for IMVP mobile processors, and the available information notes that use or access requires a current Intel CNDA disclosure agreement.
The package information identifies the device with the RHA 40 VQFN package family. The package is a plastic quad flatpack, no-lead construction with 40 pins, a 6 mm x 6 mm body, 0.5 mm pitch, and 1 mm maximum height. This package data applies to the generic RHA 40 VQFN package view.
Two ordering options are listed: TPS51620RHAR and TPS51620RHAT. Both use VQFN package type, RHA package drawing, 40 pins, 6.3 mm A0 and B0 tape cavities, 1.1 mm K0 cavity, 12.0 mm P1 tape pitch, 16.0 mm carrier tape width, and Q2 pin-1 quadrant orientation. TPS51620RHAR is packaged in 2500-unit tape-and-reel format on a 330.0 mm reel, while TPS51620RHAT is packaged in 250-unit tape-and-reel format on a 180.0 mm reel.
Key Features
- IMVP mobile processor power IC from Texas Instruments
- Targeted for power IMVP mobile processors
- Current Intel CNDA agreement required for access
- RHA 40 VQFN package family
- 40-pin VQFN package with RHA drawing
- 6 mm x 6 mm package body size
- 0.5 mm package pitch and 1 mm maximum height
- Plastic quad flatpack no-lead package material
- TPS51620RHAR supplied in 2500-unit reel format
- TPS51620RHAT supplied in 250-unit reel format
Typical Applications
- Power IMVP mobile processors
- Intel CNDA-controlled IMVP designs
- RHA 40 VQFN board assemblies
- Tape-and-reel production handling
- IMVP technical information requests
Procurement Notes
When requesting a quote for TPS51620_DDR5-PMIC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.
FAQ
What is the target application for TPS51620_DDR5-PMIC?
The extracted datasheet facts identify TPS51620_DDR5-PMIC as an IMVP mobile processor power IC for power IMVP mobile processors. Access or use is conditioned on a current Intel CNDA disclosure agreement.
What package is listed for TPS51620_DDR5-PMIC?
The listed package case is RHA 40 VQFN. The package has 40 pins, a 6 mm x 6 mm body size, 0.5 mm pitch, 1 mm maximum height, and plastic quad flatpack no-lead construction.
How do TPS51620RHAR and TPS51620RHAT packing options differ?
Both options use VQFN, RHA drawing, 40 pins, and Q2 pin-1 orientation. TPS51620RHAR is a 2500-unit reel with 330.0 mm reel diameter, while TPS51620RHAT is a 250-unit reel with 180.0 mm reel diameter.
Where is CNDA or IMVP information requested?
The extracted facts list IMVP@list.ti.com as the contact for Intel CNDA and IMVP information. The disclosure requirement states that a current CNDA Agreement with Intel is required for end user access or use.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.