Specifications
| Type | Description |
|---|---|
| Part Number | XL-1005UGC-A |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 1.0 mm x 0.5 mm x 0.40 mm |
| Outline Dimensions | 1.0 x 0.5 x 0.40 mm; L/W/H |
| Luminous Color | High Green; transparent/water colloid |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level stated as 3 levels |
| RoHS Compliance | Complied with RoHS Directive; environmental protection products |
| Maximum Power Dissipation | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; absolute maximum rating table |
| Luminous Intensity | 550 to 1450 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 535 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6 to 3.3 V; IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin E5 | 550 to 600 mcd; IF=20 mA |
| Brightness Bin E6 | 600 to 700 mcd; IF=20 mA |
| Brightness Bin E7 | 700 to 800 mcd; IF=20 mA |
| Brightness Bin E8 | 800 to 900 mcd; IF=20 mA |
| Brightness Bin E9 | 900 to 1000 mcd; IF=20 mA |
| Brightness Bin F1 | 1000 to 1150 mcd; IF=20 mA |
| Brightness Bin F2 | 1150 to 1300 mcd; IF=20 mA |
| Brightness Bin F3 | 1300 to 1450 mcd; IF=20 mA |
| Brightness Tolerance | ±10%; brightness grading |
| Voltage Bin M18-8 | 2.6 to 2.7 V; IF=20 mA |
| Voltage Bin M18-9 | 2.7 to 2.8 V; IF=20 mA |
| Voltage Bin M19-1 | 2.8 to 2.9 V; IF=20 mA |
| Voltage Bin M19-2 | 2.9 to 3.0 V; IF=20 mA |
| Voltage Bin M19-3 | 3.0 to 3.1 V; IF=20 mA |
| Voltage Bin M19-4 | 3.1 to 3.2 V; IF=20 mA |
| Voltage Bin M19-5 | 3.2 to 3.3 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HG02 | 515 to 520 nm; IF=20 mA |
| Wavelength Bin HG03 | 520 to 525 nm; IF=20 mA |
| Wavelength Bin HG04 | 525 to 530 nm; IF=20 mA |
| Wavelength Bin HG05 | 530 to 535 nm; IF=20 mA |
| Wavelength Tolerance | ±1 nm; wavelength grading |
| Reliability Test Temperature Condition | 25±5°C; unless otherwise indicated test environment temperature |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; IR-Reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR-Reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; lead process infrared reflow welding |
| Lead-Free Process Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; lead-free infrared reflow welding |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions, size unit mm |
| Hand Soldering Iron Power | <30 W; manual welding recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Soldering Cycles | 2 times; reflow soldering guidance |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Condition | <=30°C for 3 min or <=50°C for 30 s; alcohol solvent cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended to confirm no LED damage |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; operation/workshop environment |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent fades or LEDs exceed storage time |
| Datasheet Status | request_only |
Product Overview
The XL-1005UGC-A is a XINGLIGHT high brightness green SMD LED supplied in a compact 1.0 x 0.5 x 0.40 mm package. The datasheet identifies the luminous color as High Green with transparent/water colloid construction, making it suitable for compact surface-mount indicator and display designs requiring green emission within a small footprint.
Electrical and optical specifications are provided at IF=20 mA and Ta=25°C. The device has a luminous intensity range of 550 to 1450 mcd, a dominant wavelength of 515 to 535 nm, a typical peak wavelength of 525 nm, and a typical viewing angle of 120°. Forward voltage is graded from 2.6 to 3.3 V, with reverse current limited to <=1 µA at VR=5 V.
Assembly guidance includes MSL 3 handling, up to two reflow soldering cycles, hand soldering below 300°C for less than 3 seconds per terminal, and opened-package soldering within 168 hours at <=30°C and <=40% RH.
Key Features
- 1.0 x 0.5 x 0.40 mm SMD LED package
- High Green luminous color with transparent/water colloid construction
- 550 to 1450 mcd luminous intensity at 20 mA
- 515 to 535 nm dominant wavelength range
- 2.6 to 3.3 V forward voltage range
- 120° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulsed conditions
- -40 to +85°C operating temperature range
- MSL 3 moisture sensitivity handling requirement
- RoHS Directive compliance stated in datasheet
- Opened packages require soldering within 168 hours
Typical Applications
- Compact green status indicators
- Surface-mount display backlighting
- Portable equipment indicators
- Control panel signal lamps
- Consumer electronics indicators
- Space-constrained PCB assemblies
- Wide-angle green indication
- Reflow-assembled LED boards
Procurement Notes
When requesting a quote for XL-1005UGC-A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size is used by XL-1005UGC-A?
XL-1005UGC-A uses an SMD LED package with outline dimensions of 1.0 x 0.5 x 0.40 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 550 to 1450 mcd luminous intensity, 515 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.
What forward voltage range does this green LED specify?
The forward voltage range is 2.6 to 3.3 V at IF=20 mA and Ta=25°C. The datasheet also provides voltage bins from M18-8 through M19-5, covering 2.6 to 3.3 V in 0.1 V steps.
What current limits apply to XL-1005UGC-A?
The maximum continuous forward current is 20 mA at Ta=25°C. The peak forward current is 80 mA when pulse width is <=0.1 ms and duty cycle is <=1/10 at Ta=25°C.
How should opened packages be stored before soldering?
After opening the package, storage should be <=30°C and <=40% RH, and the LEDs should be soldered within 168 hours, or 7 days. If storage time is exceeded, the listed baking condition is 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.