Specifications
| Type | Description |
|---|---|
| Part Number | XL-1005UGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 1.0 x 0.5 x 0.40 mm |
| Outline Dimensions | 1.0 x 0.5 x 0.40 mm; condition: L/W/H |
| Luminous Color | Green; condition: transparent/water colloid package |
| RoHS Compliance | Complies with RoHS Directive; condition: environmental protection products |
| Moisture Sensitivity Level | MSL 3; condition: moisture sensitivity level |
| Maximum Power Dissipation | 70 mW; condition: Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; condition: Ta=25°C |
| Peak Forward Current | 80 mA; condition: pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; condition: Ta=25°C |
| ESD Rating | 2000 V; condition: Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; condition: Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; condition: Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; condition: Ta=25°C absolute maximum rating table |
| Luminous Intensity | 350 to 900 mcd; condition: IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 535 nm; condition: IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ; condition: IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6 to 3.3 V; condition: IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ; condition: IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; condition: 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; condition: VR=5 V, Ta=25°C |
| Brightness Bin E1 | 350 to 400 mcd; condition: IF=20 mA, brightness error ±10% |
| Brightness Bin E2 | 400 to 450 mcd; condition: IF=20 mA, brightness error ±10% |
| Brightness Bin E3 | 450 to 500 mcd; condition: IF=20 mA, brightness error ±10% |
| Brightness Bin E4 | 500 to 550 mcd; condition: IF=20 mA, brightness error ±10% |
| Brightness Bin E5 | 550 to 600 mcd; condition: IF=20 mA, brightness error ±10% |
| Brightness Bin E6 | 600 to 700 mcd; condition: IF=20 mA, brightness error ±10% |
| Brightness Bin E7 | 700 to 800 mcd; condition: IF=20 mA, brightness error ±10% |
| Brightness Bin E8 | 800 to 900 mcd; condition: IF=20 mA, brightness error ±10% |
| Voltage Bin M18-8 | 2.6 to 2.7 V; condition: IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7 to 2.8 V; condition: IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V; condition: IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V; condition: IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-3 | 3.0 to 3.1 V; condition: IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-4 | 3.1 to 3.2 V; condition: IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-5 | 3.2 to 3.3 V; condition: IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HG02 | 515 to 520 nm; condition: IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HG03 | 520 to 525 nm; condition: IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HG04 | 525 to 530 nm; condition: IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HG05 | 530 to 535 nm; condition: IF=20 mA, wavelength error ±1 nm |
| Default Test Environment Temperature | 25±5°C; condition: unless otherwise indicated |
| Working Life Test | 1000 hours; condition: continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; condition: Ta=85±5°C, RH=90 to 95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; condition: Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; condition: Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; condition: 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; condition: IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-tin Test | 260±5°C for 10±1 s, 2 times; condition: soldering temperature T.sol |
| Lead Process Reflow Profile | maximum temperature 235°C +5/-0°C for 10-15 s; condition: heat-up max 3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s; cooling max 6°C/s |
| Lead-free Reflow Profile | maximum temperature 255°C +0/-5°C for 5-10 s; condition: heat-up max 3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling max 6°C/s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; condition: immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; condition: unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm; condition: belt and disk dimensions, size unit mm |
| Hand Soldering Limit | <300°C, <3 s per terminal, one time only; condition: soldering iron power less than 30 W recommended |
| Maximum Reflow Cycles | 2 times maximum; condition: reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; condition: product recommended maximum welding temperature |
| Cleaning Condition | alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; condition: after soldering |
| Ultrasonic Cleaning Power | <=300 W; condition: pretest required to confirm no LED damage |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; condition: before opening package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; condition: after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; condition: operation after opening package |
| Baking Condition | 60±5°C for 24 hours; condition: if moisture absorbent has faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-1005UGC is a XINGLIGHT green surface-mount LED supplied in a compact 1.0 x 0.5 x 0.40 mm SMD LED package. The device uses a transparent/water colloid package and is intended for PCB-mounted green visual indication where small outline dimensions and a wide viewing angle are required.
At IF=20 mA and Ta=25°C, the LED is specified for 350 to 900 mcd luminous intensity, 515 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle. Forward voltage is specified from 2.6 to 3.3 V, with reverse current limited to <=1 µA at VR=5 V.
Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, and 5 V reverse voltage. Assembly data includes MSL 3 handling, two maximum reflow cycles, lead-free reflow peak of 255°C +0/-5°C for 5-10 s, and opened-package soldering within 168 hours at <=30°C and <=40% RH.
Key Features
- 1.0 x 0.5 x 0.40 mm SMD LED package
- Green transparent/water colloid luminous package
- 350 to 900 mcd at IF=20 mA
- 515 to 535 nm dominant wavelength range
- 525 nm typical peak wavelength
- 2.6 to 3.3 V forward voltage
- 120° typical viewing angle at IF=20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulsed conditions
- MSL 3 moisture sensitivity level
- RoHS Directive compliant environmental product
- Opened package soldering window of 168 hours
Typical Applications
- Compact PCB status indicators
- Green panel indicators
- Portable electronics indication
- Dense surface-mount assemblies
- Equipment signal lamps
- Visual mode indicators
- Small instrument displays
- Consumer device indicator lights
Procurement Notes
When requesting a quote for XL-1005UGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
LITEON
LTST-C283TGKT-5A
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
LITEON
16-213/GHC-YR1S1/3T
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
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FAQ
What package size does the XL-1005UGC use?
The XL-1005UGC uses an SMD LED package with outline dimensions of 1.0 x 0.5 x 0.40 mm. The outline dimension tolerance is specified as ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the device is specified for 350 to 900 mcd luminous intensity, 515 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.
What forward voltage range is specified for this LED?
The XL-1005UGC forward voltage is specified from 2.6 to 3.3 V at IF=20 mA and Ta=25°C. Datasheet voltage bins range from M18-8 at 2.6 to 2.7 V through M19-5 at 3.2 to 3.3 V.
What soldering limits apply after opening the package?
After opening, storage is specified at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. Reflow soldering is limited to 2 times maximum, and hand soldering is limited to <300°C for <3 s per terminal, one time only.
What storage and baking conditions are listed?
Before opening, the package should be stored at <=30°C and <=60% RH and used within 1 year. If the moisture absorbent has faded or LEDs exceeded storage time, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.