XL-2214SYGC Yellow-Green SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-2214SYGC Yellow-Green SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-2214SYGC
Manufacturer
XINGLIGHT
Package
SMD LED, 2.2 x 1.4 x 1.35 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-2214SYGC from XINGLIGHT is a yellow-green SMD LED in a 2.2 x 1.4 x 1.35 mm package with transparent colloid. It is specified for 80-120 mcd luminous intensity at IF=20mA and Ta=25°C, with a 565-575 nm dominant wavelength, 572 nm typical peak wavelength, and 120 deg typical viewing angle. Electrical limits include 1.8-2.4 V forward voltage at 20 mA, 50 mW power dissipation, and 20 mA forward current. The SMD format and optical output suit compact indicator, status, panel, keypad, and signal-lighting applications.

Specifications

TypeDescription
Part NumberXL-2214SYGC
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package CaseSMD LED, 2.2 x 1.4 x 1.35 mm
Package Dimensions2.2 x 1.4 x 1.35 mm; L/W/H
Luminous ColorYellow green; transparent colloid
Colloid / LensTransparent colloid; yellow-green light
Moisture Sensitivity LevelMSL 3
RoHS ComplianceComplied with RoHS Directive
Power Dissipation50 mW; Ta=25°C absolute maximum rating
Peak Forward Current80 mA; 1/10 duty cycle, 0.1 ms pulse width, Ta=25°C
Forward Current20 mA; Ta=25°C absolute maximum rating
Electrostatic Discharge2000 V; Ta=25°C absolute maximum rating
Operating Temperature Range-40°C to +85°C; absolute maximum rating
Storage Temperature Range-40°C to +85°C; absolute maximum rating
Lead Soldering Temperature260°C for <=6 s; absolute maximum rating
Luminous Intensity80-120 mcd; IF=20mA, Ta=25°C
Dominant Wavelength565-575 nm; IF=20mA, Ta=25°C
Peak Wavelength572 nm typ; IF=20mA, Ta=25°C
Viewing Angle120 deg typ; 2θ1/2, IF=20mA, Ta=25°C
Forward Voltage1.8-2.4 V; IF=20mA, Ta=25°C
Reverse Current1 µA max; VR=5V, Ta=25°C
Brightness Bin D280-120 mcd; IF=20mA
Brightness Bin D3120-150 mcd; IF=20mA
Brightness Bin D4150-180 mcd; IF=20mA
Voltage Bin N12-71.8-2.0 V; IF=20mA
Voltage Bin N12-82.0-2.2 V; IF=20mA
Voltage Bin N12-92.2-2.4 V; IF=20mA
Wavelength Bin HYG03565-567.5 nm; IF=20mA
Wavelength Bin HYG04567.5-570 nm; IF=20mA
Wavelength Bin HYG05570-572.5 nm; IF=20mA
Wavelength Bin HYG06572.5-575 nm; IF=20mA
Default Test Environment Temperature25±5°C; unless otherwise indicated
Room Temperature Life Test1000 hrs, 22 samples, 0 failures; Ta=25±5°C, IF=20mA, JIS7021:B4 / JIS7021:B10
High Temperature Storage Test1000 hrs, 22 samples, 0 failures; Ta=85±5°C, MIL-STD-202:210A / MIL-STD-750:2031
Low Temperature Storage Test1000 hrs, 22 samples, 0 failures; Ta=-35±5°C, JIS7021:B12
High Temperature / Humidity Test1000 hrs, 22 samples, 0 failures; Ta=85±5°C, RH=85%, JIS7021:B11 / MIL-STD-202:103D
Cold / Heat Strike Test100 cycles, 22 samples, 0 failures; -10±5°C to 100±5°C, 30 min / 5 min / 5 min, JIS7021:B4 / MIL-STD-202:107D / MIL-STD-750:1026
Cold and Heat Cycle Test100 cycles, 22 samples, 0 failures; -35°C to 25°C to 85°C to -35°C, 5 min / 5 min / 30 min / 5 min / 30 min / 5 min, JIS7021:A3 / MIL-STD-202:107D / MIL-STD-705:105E
Reliability Judging Criterion - Forward VoltageInitial data x 1.1 max; VF, IF=20mA
Reliability Judging Criterion - Reverse Current1 µA max; IR, VR=5V
Reliability Judging Criterion - Luminous IntensityInitial data x 0.7 min; IV, IF=20mA
Outline Dimension Tolerance±0.25 mm; unless otherwise noted
Tape and Reel Dimensional Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W; hand soldering recommended only for repair/rework
Hand Soldering Temperature<300°C; each terminal once only, less than 3 s
Maximum Reflow Count2 times max; reflow soldering
Recommended Maximum Reflow Temperature240±5°C for 6 s; product recommended maximum welding temperature
Cleaning With AlcoholUnder 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest required to confirm no LED damage
Unopened Storage Condition<=30°C, <60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package
Opened Storage Condition<=30°C, <40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition<=30°C, <60% RH; operation after package opening
Baking Condition60±5°C for 24 hours; if desiccant failed or storage time exceeded
Datasheet Statusrequest_only

Product Overview

The XL-2214SYGC is a XINGLIGHT yellow-green SMD LED built in a 2.2 x 1.4 x 1.35 mm surface-mount package. The device uses a transparent colloid lens/colloid structure for yellow-green light output and is listed as compliant with the RoHS Directive. Its moisture sensitivity level is MSL 3, so storage and assembly controls are relevant during production handling.

At IF=20mA and Ta=25°C, the LED is specified for 80-120 mcd luminous intensity, 565-575 nm dominant wavelength, 572 nm typical peak wavelength, 120 deg typical viewing angle, and 1.8-2.4 V forward voltage. Absolute maximum ratings include 50 mW power dissipation, 20 mA forward current, 80 mA peak forward current under pulsed conditions, and -40°C to +85°C operating and storage temperature ranges.

Assembly guidance includes a 260°C lead soldering temperature limit for no more than 6 seconds, reflow soldering up to 2 times, and a recommended maximum reflow condition of 240±5°C for 6 seconds. Typical use cases include compact visual indication, status LEDs, panel markers, keypads, and yellow-green signal points.

Key Features

  • 2.2 x 1.4 x 1.35 mm SMD LED package
  • Yellow-green output with transparent colloid construction
  • 80-120 mcd luminous intensity at IF=20mA
  • 565-575 nm dominant wavelength at IF=20mA
  • 572 nm typical peak wavelength at IF=20mA
  • 120 deg typical viewing angle at IF=20mA
  • 1.8-2.4 V forward voltage at IF=20mA
  • 20 mA absolute maximum forward current rating
  • -40°C to +85°C operating temperature range
  • MSL 3 moisture sensitivity classification
  • RoHS Directive compliance stated in datasheet
  • Reflow soldering allowed up to 2 times

Typical Applications

  • Yellow-green status indicators
  • Compact panel indicators
  • Keypad backlight points
  • Portable device indicators
  • Control board signal lights
  • Equipment front-panel markers
  • Small SMD visual alerts

Procurement Notes

When requesting a quote for XL-2214SYGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for the XL-2214SYGC LED?

The XL-2214SYGC uses an SMD LED package with dimensions of 2.2 x 1.4 x 1.35 mm. The outline dimension tolerance is ±0.25 mm unless otherwise noted in the datasheet.

What optical output does XL-2214SYGC provide at 20 mA?

At IF=20mA and Ta=25°C, the device is specified for yellow-green output, 80-120 mcd luminous intensity, 565-575 nm dominant wavelength, 572 nm typical peak wavelength, and a 120 deg typical viewing angle.

What are the main electrical ratings for XL-2214SYGC?

The datasheet lists 50 mW power dissipation, 20 mA forward current, 80 mA peak forward current under 1/10 duty cycle and 0.1 ms pulse width, 1.8-2.4 V forward voltage at 20 mA, and 1 µA maximum reverse current at VR=5V.

What soldering limits apply to this SMD LED?

The absolute maximum lead soldering temperature is 260°C for no more than 6 seconds. For reflow soldering, the datasheet allows a maximum of 2 cycles and recommends a maximum reflow temperature of 240±5°C for 6 seconds.

How should XL-2214SYGC be stored after opening?

After opening the package, storage should be at <=30°C and <40% RH, with soldering completed within 168 hours or 7 days. The recommended workshop condition after package opening is <=30°C and <60% RH.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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