Specifications
| Type | Description |
|---|---|
| Part Number | XL-2214SYGC |
| Manufacturer | XINGLIGHT |
| Product Type | yellow green SMD LED |
| Category | LED |
| Package / Case | SMD LED, 2.2 x 1.4 x 1.35 mm |
| Outline Dimensions | 2.2 x 1.4 x 1.35 mm; L/W/H |
| Luminous Color and Colloid | yellow green light / transparent colloid |
| Moisture Sensitivity Level | MSL 3 |
| Power Dissipation | 50 mW; Ta=25°C |
| Peak Forward Current | 80 mA; 1/10 duty cycle, 0.1 ms pulse width, Ta=25°C |
| Forward Current | 20 mA; Ta=25°C |
| Electrostatic Discharge | 2000 V; Ta=25°C |
| Operating Temperature Range | -40°C to +85°C |
| Storage Temperature Range | -40°C to +85°C |
| Lead Soldering Temperature | 260°C, <= 6 s |
| Luminous Intensity | Min 80 mcd, Typ --, Max 120 mcd; IF=20mA, Ta=25°C |
| Dominant Wavelength | Min 565 nm, Typ -, Max 575 nm; IF=20mA, Ta=25°C |
| Peak Wavelength | Typ 572 nm; IF=20mA, Ta=25°C |
| Viewing Angle | Typ 120 deg; IF=20mA, Ta=25°C |
| Forward Voltage | Min 1.8 V, Typ --, Max 2.4 V; IF=20mA, Ta=25°C |
| Reverse Current | Max 1 uA; VR=5V, Ta=25°C |
| Brightness Bin D2 | 80-120 mcd; IF=20mA |
| Brightness Bin D3 | 120-150 mcd; IF=20mA |
| Brightness Bin D4 | 150-180 mcd; IF=20mA |
| Voltage Bin N12-7 | 1.8-2.0 V; IF=20mA |
| Voltage Bin N12-8 | 2.0-2.2 V; IF=20mA |
| Voltage Bin N12-9 | 2.2-2.4 V; IF=20mA |
| Dominant Wavelength Bin HYG03 | 565-567.5 nm; IF=20mA |
| Dominant Wavelength Bin HYG04 | 567.5-570 nm; IF=20mA |
| Dominant Wavelength Bin HYG05 | 570-572.5 nm; IF=20mA |
| Dominant Wavelength Bin HYG06 | 572.5-575 nm; IF=20mA |
| Test Environment Temperature | 25±5°C; Unless otherwise indicated |
| Room Temperature Life Test | 1000 hrs, Qty 22, Fail Qty 0; Ta=25°C±5°C, IF=20mA; JIS7021:B4 / JIS7021:B10 |
| High Temperature Storage Test | 1000 hrs, Qty 22, Fail Qty 0; Ta=85°C±5°C; MIL-STD-202:210A / MIL-STD-750:2031 |
| Low Temperature Storage Test | 1000 hrs, Qty 22, Fail Qty 0; Ta=-35°C±5°C; JIS7021:B12 |
| High Temperature Humidity Test | 1000 hrs, Qty 22, Fail Qty 0; Ta=85°C±5°C, RH=85%; JIS7021:B11 / MIL-STD-202:103D |
| Cold/Heat Strike Test | 100 cycles, Qty 22, Fail Qty 0; -10°C±5°C to 100°C±5°C; 30 min / 5 min / 5 min; JIS7021:B4 / MIL-STD-202:107D / MIL-STD-750:1026 |
| Cold and Heat Cycle Test | 100 cycles, Qty 22, Fail Qty 0; -35°C to 25°C to 85°C to -35°C; 5 min / 30 min / 5 min / 30 min / 5 min; JIS7021:A3 / MIL-STD-202:107D / MIL-STD-705:105E |
| Reliability Judging Criterion - Forward Voltage | Max Initial Data x 1.1; IF=20mA |
| Reliability Judging Criterion - Reverse Current | Max 1 uA; VR=5V |
| Reliability Judging Criterion - Luminous Intensity | Min Initial Data x 0.7; IF=20mA |
| Dimension Tolerance | ±0.25 mm; Unless otherwise noted |
| Belt and Disk Dimension Tolerance | ±0.1 mm; Dimensions in mm |
| Hand Soldering Iron Power | Less than 30 W; Hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | Under 300°C; Each LED terminal less than 3 seconds, one time only |
| Reflow Soldering Count | Maximum 2 times; Pb-free reflow soldering guideline |
| Recommended Maximum Welding Temperature | 240±5°C / 6 s; Reflow soldering |
| Cleaning Condition | Under 30°C for 3 minutes or 50°C for 30 seconds; Alcohol solvent after soldering |
| Ultrasonic Cleaning Power | Not higher than 300 W; Pretest required before cleaning |
| Unopened Storage Condition | <=30°C, <=60%RH, use within 1 year; Before opening package |
| Opened Storage Condition | <=30°C, <=40%RH, solder within 168 hours (7 days); After opening package |
| Recommended Workshop Condition | <=30°C, <=60%RH; Product operation/workshop condition |
| Baking Condition | 60±5°C for 24 hours; If moisture absorbent faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-2214SYGC is a XINGLIGHT yellow green SMD LED built in a 2.2 x 1.4 x 1.35 mm package with transparent colloid. At IF=20mA and Ta=25°C, the device is specified with 80 to 120 mcd luminous intensity, 565 to 575 nm dominant wavelength, 572 nm typical peak wavelength, and a typical viewing angle of 120 degrees. The forward voltage range is 1.8 to 2.4 V at IF=20mA, with reverse current limited to 1 uA maximum at VR=5V. Supply chain support includes technical documentation and sourcing assistance for procurement teams requiring this specific yellow-green SMD LED variant for product development or volume production requirements. The component is designed to meet industry-standard specifications for yellow-green LEDs in similar package categories, providing reliable performance for indicator and display applications requiring yellow-green LED functionality in compact form factors suitable for automated PCB assembly processes.
Key Features
- 2.2 x 1.4 x 1.35 mm SMD LED package
- Yellow green light with transparent colloid construction
- MSL 3 moisture sensitivity level specified
- 20 mA forward current rating at Ta=25°C
- 50 mW power dissipation at Ta=25°C
- 565 to 575 nm dominant wavelength range
- 80 to 120 mcd luminous intensity at IF=20mA
- 1.8 to 2.4 V forward voltage range
- 120 degree typical viewing angle at IF=20mA
- Reflow soldering allowed up to two times
Typical Applications
- Yellow green status indicators
- Compact SMD panel indicators
- Wide-angle signal lamps
- 20 mA indicator circuits
- Reflow-assembled electronics
- Transparent colloid LED designs
Related Technical Articles
FAQ
What package size is used by XL-2214SYGC?
XL-2214SYGC uses an SMD LED package with outline dimensions of 2.2 x 1.4 x 1.35 mm. The listed dimension tolerance is ±0.25 mm unless otherwise noted.
What optical output is specified for this LED?
At IF=20mA and Ta=25°C, the LED is specified for 80 to 120 mcd luminous intensity, 565 to 575 nm dominant wavelength, 572 nm typical peak wavelength, and a 120 degree typical viewing angle.
What electrical limits apply at the standard test condition?
At Ta=25°C, the datasheet lists 20 mA forward current, 50 mW power dissipation, and 80 mA peak forward current under 1/10 duty cycle with 0.1 ms pulse width.
What storage handling is specified after opening?
After opening the package, storage is specified at <=30°C and <=40%RH, with soldering within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if needed.