Specifications
| Type | Description |
|---|---|
| Part Number | XL-2835UYC-02FJ |
| Manufacturer | XINGLIGHT |
| Product Type | Yellow surface-mount LED |
| Category | LED |
| Package/Case | 2835 SMD LED, 2.8 x 3.5 x 0.8 mm |
| Package Dimensions | 2.8 x 3.5 x 0.8 mm |
| Dimension Tolerance | ±0.25 mm |
| Emitted Color | Yellow |
| Lens / Colloid Color | Water clear / transparent colloid |
| RoHS Compliance | Complies with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 200 mW at Ta=25°C |
| Maximum Continuous Forward Current | 60 mA at Ta=25°C |
| Peak Forward Current | 200 mA, pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V, antistatic ability; ESD model not specified |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C, ≤6 s |
| Luminous Intensity | 1450 to 1800 mcd at IF=60 mA, Ta=25°C |
| Dominant Wavelength | 585 to 595 nm at IF=60 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ. at IF=60 mA, Ta=25°C |
| Forward Voltage | 1.8 to 2.4 V at IF=60 mA, Ta=25°C |
| Viewing Angle | 120° typ., 2θ1/2, IF=60 mA, Ta=25°C |
| Half Wave Width | 20 nm typ. at IF=60 mA, Ta=25°C |
| Reverse Current | ≤5 μA at VR=5 V, Ta=25°C |
| Brightness Bin F4 | 1450 to 1600 mcd at IF=60 mA |
| Brightness Bin F5 | 1600 to 1800 mcd at IF=60 mA |
| Voltage Bin N12-7 | 1.8 to 2.0 V at IF=60 mA |
| Voltage Bin N12-8 | 2.0 to 2.2 V at IF=60 mA |
| Voltage Bin N12-9 | 2.2 to 2.4 V at IF=60 mA |
| Dominant Wavelength Bin HY03 | 585 to 587.5 nm at IF=60 mA |
| Dominant Wavelength Bin HY04 | 587.5 to 590 nm at IF=60 mA |
| Dominant Wavelength Bin HY05 | 590 to 592.5 nm at IF=60 mA |
| Dominant Wavelength Bin HY06 | 592.5 to 595 nm at IF=60 mA |
| Test Environment Temperature | 25±5°C unless otherwise indicated |
| Recommended Reflow Count | Maximum 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Hand Soldering Iron Power | <30 W, recommended only for repair/rework |
| Hand Soldering Temperature | <300°C, each terminal once, <3 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C, peak for 5-10 s, J-STD-020C |
| Lead-Free Reflow Time Above Liquidus | 60 to 120 s above 217°C, heat-up max 3°C/s, cooling max 6°C/s |
| Lead Reflow Peak Temperature | 235°C +5/-0°C, peak for 10-15 s, J-STD-020C |
| Lead Reflow Time Above Liquidus | 60 to 150 s above 183°C, heat-up max 3°C/s, cooling max 6°C/s |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year |
| Opened Storage Condition | ≤30°C, <10% RH, solder within 168 hours |
| Baking Condition | 60±5°C for 24 hours |
| Recommended Packaging | EIA standard packaging |
| Process Compatibility | Suitable for SMT automatic production and infrared reflow soldering |
| Datasheet Status | request_only |
Product Overview
XL-2835UYC-02FJ is a XINGLIGHT yellow surface-mount LED built in a 2835 SMD LED package. The package outline is 2.8 x 3.5 x 0.8 mm with a ±0.25 mm general dimension tolerance unless otherwise noted. The LED has yellow emission and uses a water-clear transparent colloid structure.
At IF=60 mA and Ta=25°C, the device is specified for 1450 to 1800 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 1.8 to 2.4 V forward voltage, 120° typical viewing angle, and 20 nm typical half wave width. Absolute maximum ratings include 200 mW power dissipation, 60 mA continuous forward current, 200 mA peak forward current under the stated pulse condition, and 5 V maximum reverse voltage.
Assembly data identifies compatibility with SMT automatic production and infrared reflow soldering. Moisture handling is MSL 3, with unopened storage at ≤30°C and <60% RH for use within 1 year, and opened storage at ≤30°C and <10% RH with soldering within 168 hours.
Key Features
- Yellow surface-mount LED in 2835 SMD package
- 2.8 x 3.5 x 0.8 mm outline dimensions
- Water-clear transparent colloid for yellow emission
- 1450 to 1800 mcd at IF=60 mA
- 585 to 595 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage range
- 120° typical viewing angle at IF=60 mA
- 60 mA maximum continuous forward current
- 200 mW maximum power dissipation at Ta=25°C
- MSL 3 moisture sensitivity classification
- RoHS Directive compliance stated in datasheet
- Compatible with SMT automatic production and infrared reflow
Typical Applications
- Yellow status indicators
- Surface-mount indicator panels
- SMT signal indication assemblies
- Yellow display backlighting points
- Infrared reflow LED assemblies
- Compact electronic component indicators
- RoHS-compliant LED assemblies
Procurement Notes
When requesting a quote for XL-2835UYC-02FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package does XL-2835UYC-02FJ use?
XL-2835UYC-02FJ uses a 2835 SMD LED package with outline dimensions of 2.8 x 3.5 x 0.8 mm. The datasheet states a ±0.25 mm dimension tolerance unless otherwise noted.
What are the main optical ratings for this LED?
At IF=60 mA and Ta=25°C, the LED is specified for 1450 to 1800 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, and a 120° typical viewing angle.
What soldering process is listed for XL-2835UYC-02FJ?
The datasheet states the part is suitable for SMT automatic production and infrared reflow soldering. Recommended reflow count is a maximum of 2 times, with product recommendation of 240±5°C for 6 seconds.
What moisture handling requirements are specified?
The device is rated MSL 3. After opening the package, storage should be ≤30°C and <10% RH, and soldering should be completed within 168 hours. Baking is specified as 60±5°C for 24 hours when required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.