XL-3014SURC-02FJ Red SMD LED

XINGLIGHT Electronic Component — specifications, applications, sourcing support and RFQ.

XL-3014SURC-02FJ Red SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-3014SURC-02FJ
Manufacturer
XINGLIGHT
Package
3014 SMD LED, 3.0 x 1.4 x 0.8 mm
Category
LED
Product Type
Red SMD LED

Quick Sourcing Note

XL-3014SURC-02FJ from XINGLIGHT is a red SMD LED in a 3014 package measuring 3.0 x 1.4 x 0.8 mm with transparent colloid. It is an Electronic Component intended for SMT automatic production and infrared reflow soldering processes. Key electrical and optical parameters include 1.8-2.4 V forward voltage, 60 mA continuous forward current, 1150-1800 mcd luminous intensity, 615-630 nm dominant wavelength, and 120° typical viewing angle at IF=60 mA and Ta=25°C. The device is RoHS compliant, rated MSL 2a-3, and supports operation from -40 to +85°C.

Specifications

TypeDescription
Part NumberXL-3014SURC-02FJ
ManufacturerXINGLIGHT
Product TypeRed SMD LED
CategoryLED
Package/Case3014 SMD LED, 3.0 x 1.4 x 0.8 mm
Component TypeLED
Package Dimensions3.0 x 1.4 x 0.8 mm
Emitted ColorRed
Lens/Colloid ColorTransparent colloid
RoHS ComplianceComplies with RoHS Directive
Moisture Sensitivity LevelMSL 2a-3
Maximum Power Dissipation200 mW, Ta=25°C
Maximum Continuous Forward Current60 mA, Ta=25°C
Peak Forward Current120 mA, pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C
Maximum Reverse Voltage5 V, Ta=25°C
ESD Rating2000 V, Ta=25°C
Operating Temperature Range-40 to +85°C
Storage Temperature Range-40 to +85°C
Lead Soldering Temperature/Time260°C for ≤6 s
Luminous Intensity1150-1800 mcd, IF=60 mA, Ta=25°C
Dominant Wavelength615-630 nm, IF=60 mA, Ta=25°C
Peak Wavelength625 nm typ, IF=60 mA, Ta=25°C
Forward Voltage1.8-2.4 V, IF=60 mA, Ta=25°C
Viewing Angle120° typ, 2θ1/2, IF=60 mA, Ta=25°C
Half Wave Width20 nm typ, IF=60 mA, Ta=25°C
Reverse Current≤5 µA, VR=5 V, Ta=25°C
Brightness Bin F21150-1300 mcd, IF=60 mA
Brightness Bin F31300-1450 mcd, IF=60 mA
Brightness Bin F41450-1600 mcd, IF=60 mA
Brightness Bin F51600-1800 mcd, IF=60 mA
Voltage Bin N12-71.8-2.0 V, IF=60 mA
Voltage Bin N12-82.0-2.2 V, IF=60 mA
Voltage Bin N12-92.2-2.4 V, IF=60 mA
Wavelength Bin HR01615-620 nm, IF=60 mA
Wavelength Bin HR02620-625 nm, IF=60 mA
Wavelength Bin HR03625-630 nm, IF=60 mA
Test Environment Temperature25±5°C unless otherwise indicated
Working Life Test1000 hours, continuous lighting at maximum rated current at room temperature; datasheet also states test at 20 mA
High Temperature High Humidity Storage Test240 hours, Ta=85±5°C, RH=90-95%
High Temperature Storage Test1000 hours, Ta=85±5°C
Low Temperature Storage Test1000 hours, Ta=-40±5°C
Cold and Hot Cycle Test100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles, IR reflow in-board 2 times; 100±5°C to -40±5°C, 20 min each
Anti-tin Test260±5°C, 10±1 s, 2 times
Lead Reflow ProfilePeak 235°C +5/-0°C, 10-15 s at peak; ramp ≤3°C/s from 183°C to peak; 125±25°C ≤120 s; above 183°C for 60-150 s; cooling ≤6°C/s
Lead-Free Reflow ProfilePeak 255°C +0/-5°C, 5-10 s at peak; ramp ≤3°C/s from 217°C to peak; 175±25°C ≤180 s; above 217°C for 60-120 s; cooling ≤6°C/s
Weldability Test235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area
Outline Dimension Tolerance±0.25 mm unless otherwise noted
Tape/Reel Dimension Tolerance±0.1 mm for belt and disk dimensions
Hand Soldering RecommendationSoldering iron <30 W, temperature <300°C, <3 s per terminal, one time only; recommended only for repair/rework
Maximum Reflow Count2 times maximum
Recommended Maximum Welding Temperature240±5°C for 6 s
Cleaning ConditionAlcohol cleaning under 30°C for 3 minutes or 50°C for 30 seconds after soldering
Ultrasonic Cleaning Power≤300 W; pretest required before cleaning
Unopened Storage Condition≤30°C, ≤60% RH, use within 1 year
Opened Storage Condition≤30°C, ≤40% RH, solder within 168 hours / 7 days
Recommended Workshop Condition≤30°C, ≤60% RH
Baking Condition60±5°C for 24 hours if moisture absorbent material has faded or storage time exceeded
PackagingMoisture-proof anti-electrostatic package with moisture absorbent material
Production CompatibilitySuitable for SMT automatic production
Soldering Process CompatibilitySuitable for infrared reflow soldering process
Datasheet Statusrequest_only

Product Overview

The XL-3014SURC-02FJ is a XINGLIGHT red SMD LED supplied in a compact 3014 package with 3.0 x 1.4 x 0.8 mm outline dimensions and transparent colloid. Its optical output is specified at IF=60 mA and Ta=25°C, with luminous intensity from 1150 to 1800 mcd, dominant wavelength from 615 to 630 nm, and a 625 nm typical peak wavelength.

Electrical ratings include 200 mW maximum power dissipation, 60 mA maximum continuous forward current, 120 mA peak forward current under the stated pulse condition, 5 V maximum reverse voltage, and 2000 V ESD rating. The device operates and stores across -40 to +85°C, with reverse current limited to ≤5 µA at VR=5 V.

For assembly, the datasheet identifies SMT automatic production and infrared reflow soldering compatibility. Handling data includes MSL 2a-3, two maximum reflow cycles, specified lead and lead-free reflow profiles, alcohol cleaning limits, and defined storage and baking conditions for moisture control.

Key Features

  • Red SMD LED in compact 3014 package
  • 3.0 x 1.4 x 0.8 mm outline dimensions
  • Transparent colloid with red emitted color
  • 1150-1800 mcd luminous intensity at 60 mA
  • 615-630 nm dominant wavelength range
  • 1.8-2.4 V forward voltage at 60 mA
  • 120° typical viewing angle
  • MSL 2a-3 moisture sensitivity level
  • RoHS Directive compliance stated
  • Suitable for SMT automatic production

Typical Applications

  • Red status indication
  • SMT board-level indicators
  • Infrared reflow assembled boards
  • Compact red signal lighting
  • Moisture-controlled LED assembly
  • Transparent-colloid red LED designs

Procurement Notes

When requesting a quote for XL-3014SURC-02FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What type of component is XL-3014SURC-02FJ?

XL-3014SURC-02FJ is a XINGLIGHT red SMD LED in a 3014 package. The datasheet gives 3.0 x 1.4 x 0.8 mm outline dimensions and identifies the emitted color as red with transparent colloid.

What are the main optical specifications at 60 mA?

At IF=60 mA and Ta=25°C, the datasheet specifies 1150-1800 mcd luminous intensity, 615-630 nm dominant wavelength, 625 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.

What electrical limits should be checked for this LED?

The listed ratings include 200 mW maximum power dissipation, 60 mA maximum continuous forward current, 120 mA peak forward current under the stated pulse condition, 5 V maximum reverse voltage, and 1.8-2.4 V forward voltage at 60 mA.

What assembly conditions are specified for XL-3014SURC-02FJ?

The part is suitable for SMT automatic production and infrared reflow soldering. The datasheet lists lead and lead-free reflow profiles, two maximum reflow cycles, a 260°C lead soldering limit for ≤6 seconds, and hand soldering only for repair or rework.

How should opened packages be stored before soldering?

After opening, storage is specified at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition is ≤30°C and ≤60% RH, and baking is 60±5°C for 24 hours when required.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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