Specifications
| Type | Description |
|---|---|
| Part Number | XL-IRM638T-TR2 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD epoxy resin semi-circular spherical package, 5.0 x 4.0 x 4.0 mm |
| Supply Voltage Absolute Maximum | 6.0 V; Ta=25°C |
| Operating Ambient Temperature | -20°C to +85°C; Ta=25°C absolute maximum ratings |
| Storage Ambient Temperature | -40°C to +125°C; Ta=25°C absolute maximum ratings |
| Wave Soldering Condition | 260°C, <=6 s; Tsol |
| Manual Soldering Condition | 300°C, 3 s; Tsol |
| Working Current | 0.4 min, 0.5 typ, 0.7 max mA; VDD=5 V, Ta=25°C |
| Receive Distance at 0 Degrees | 15 min, 20 typ m; Ta=25°C |
| Receive Distance at Left 35 Degrees | 5 min m; Ta=25°C |
| Receive Distance at Right 35 Degrees | 5 min m; Ta=25°C |
| Carrier Frequency | 37.9 typ kHz; Ta=25°C |
| BPF Width | 6 typ kHz; Ta=25°C |
| Low Level Output Voltage | 250 max mV; Isink=2.0 mA |
| High Level Output Voltage | 4.5 min, 5.0 max V; VCC=5 V |
| Output Pulse Width Low | 400 min, 600 typ, 800 max us; Burst wave, Vin=500 uVp-p |
| Output Pulse Width High | 400 min, 800 max us; Burst wave, Vin=50 mVp-p |
| Minimum Pulse Width | 350 min us; Vin=50 mVp-p |
| Minimum Interval | 450 min us; Vin=50 mVp-p |
| Encoding Pause Time | 45 min us; Vin=50 mVp-p |
| Recommended Supply Voltage | 2.7 min, 5.5 max V; Recommended usage conditions |
| Recommended Input Frequency | 37.9 typ kHz; Recommended usage conditions |
| Recommended Operating Temperature | 25°C typ; Recommended usage conditions |
| Receive Distance Grade L1 | 6 min, 8 max m; ICC=0.5 mA |
| Receive Distance Grade L2 | 10 min, 15 max m; ICC=0.5 mA |
| Receive Distance Grade L3 | 15 min, 20 max m; ICC=0.5 mA |
| Working Voltage Grade V1 | 2.5 min, 5.5 max V; ICC=0.5 mA |
| Working Voltage Grade V2 | 2.7 min, 5.5 max V; ICC=0.5 mA |
| Working Current Grade I1 | 0.3 min, 0.5 max mA; VDD=5 V |
| Working Current Grade I2 | 0.4 min, 0.7 max mA; VDD=5 V |
| Output Logic Compatibility | TTL and CMOS compatible, active low; Product characteristics |
| Dimensional Tolerance | ±0.25 mm; Unless otherwise specified |
| Datasheet Status | request_only |
Product Overview
The XL-IRM638T-TR2 is a XINGLIGHT infrared remote receiver module categorized under LED components. It uses an SMD epoxy resin semi-circular spherical package with 5.0 x 4.0 x 4.0 mm dimensions and a general dimensional tolerance of ±0.25 mm unless otherwise specified.
Electrical operation is centered on a 37.9 kHz typical carrier or recommended input frequency. Recommended supply voltage is 2.7 V minimum to 5.5 V maximum, while the absolute maximum supply voltage is 6.0 V at Ta=25°C. At VDD=5 V and Ta=25°C, working current is specified as 0.4 mA minimum, 0.5 mA typical, and 0.7 mA maximum.
The receiver output is TTL and CMOS compatible with active-low logic. Output limits include 250 mV maximum low-level output voltage at Isink=2.0 mA and 4.5 V minimum to 5.0 V maximum high-level output voltage at VCC=5 V. Assembly limits include 260°C for up to 6 s wave soldering and 300°C for 3 s manual soldering.
Key Features
- Infrared remote receiver module for 37.9 kHz signals
- Recommended supply range from 2.7 V to 5.5 V
- 6.0 V absolute maximum supply voltage at Ta=25°C
- 0.5 mA typical working current at VDD=5 V
- 20 m typical receive distance at 0 degrees
- 5 m minimum receive distance at left or right 35 degrees
- TTL and CMOS compatible active-low output
- 250 mV maximum low-level output at 2.0 mA sink
- SMD epoxy resin semi-circular spherical package
- Wave soldering rated 260°C for up to 6 s
Typical Applications
- Infrared remote control receivers
- 37.9 kHz IR signal detection
- TTL-compatible receiver interfaces
- CMOS-compatible receiver interfaces
- Active-low output control circuits
- SMD infrared receiver assemblies
- Remote input modules
Procurement Notes
When requesting a quote for XL-IRM638T-TR2, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of component is XL-IRM638T-TR2?
XL-IRM638T-TR2 is an XINGLIGHT infrared remote receiver module in the LED category. The extracted datasheet facts describe it as a sensor with TTL and CMOS compatible active-low output.
What supply voltage range is recommended for this module?
The recommended supply voltage is 2.7 V minimum to 5.5 V maximum. The absolute maximum supply voltage is listed separately as 6.0 V at Ta=25°C.
What carrier frequency does XL-IRM638T-TR2 use?
The typical carrier frequency is 37.9 kHz at Ta=25°C. The recommended input frequency is also specified as 37.9 kHz typical under recommended usage conditions.
What receive distance is specified at zero degrees?
At Ta=25°C, the receive distance at 0 degrees is specified as 15 m minimum and 20 m typical. Grade L3 receive distance is listed as 15 m minimum to 20 m maximum at ICC=0.5 mA.
What package is used for XL-IRM638T-TR2?
The device uses an SMD epoxy resin semi-circular spherical package measuring 5.0 x 4.0 x 4.0 mm. Unless otherwise specified, the dimensional tolerance is ±0.25 mm.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
