Specifications
| Type | Description |
|---|---|
| Part Number | XL0453-G |
| Manufacturer | XINGLIGHT |
| Product Type | High speed optocoupler |
| Category | Optocouplers |
| Package Case | SOP6-W, SOP6-P |
| Data Rate | 1 MBit/s; Feature specification |
| Case | SOP6-W, SOP6-P; Mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; Mechanical data |
| Terminals | Matte tin-plated leads; Solderability per MIL-STD-202, Method 208 |
| Package Shipping Quantity | 1000 pcs/Tape & Reel; Part number XL0453P, package SOP6-P |
| Marking Code | XL0453; Part number XL0453P, package SOP6-P |
| Forward Current | 25 mA max; TA=25°C unless otherwise specified |
| Peak Forward Current | 50 mA max; 50% duty cycle, 1 ms pulse width; TA=25°C unless otherwise specified |
| Emitter Reverse Voltage | 5 V max; TA=25°C unless otherwise specified |
| Transient Current Peak | 1 A max; ≤1 µs pulse width, 300 pps; TA=25°C unless otherwise specified |
| Input Power Dissipation | 45 mW max; TA=25°C unless otherwise specified |
| Supply Voltage | -0.5 to 30 V; TA=25°C unless otherwise specified |
| Output Current | 8 mA max; TA=25°C unless otherwise specified |
| Peak Output Current | 16 mA max; TA=25°C unless otherwise specified |
| Collector Output Power Dissipation | 100 mW max; TA=25°C unless otherwise specified |
| Output Voltage | -0.5 to 20 V; TA=25°C unless otherwise specified |
| Emitter-Base Reverse Voltage | 5 V max; TA=25°C unless otherwise specified |
| Base Current | 5 mA max; TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature | -40 to +85 °C; Thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; Thermal characteristics |
| Soldering Temperature | 260 °C; For 10 seconds |
| Forward Voltage | typ 1.45 V, max 1.7 V; IF=16 mA, TA=25°C unless otherwise specified |
| Reverse Breakdown Input Voltage | min 5 V, typ 20 V; IR=10 µA, TA=25°C unless otherwise specified |
| Diode Temperature Coefficient | typ -1.6 mV/°C; IF=10 mA, TA=25°C unless otherwise specified |
| High Level Supply Current | max 1 µA; VCC=15 V, IF=0 mA, VO=open, TA=25°C unless otherwise specified |
| High Level Supply Current | max 2 µA; VCC=15 V, IF=0 mA, VO=open, TA=0 to 70°C |
| Low Level Supply Current | typ 120 µA, max 200 µA; VCC=15 V, IF=16 mA, VO=open, TA=25°C unless otherwise specified |
| High Level Output Current | typ 0.001 µA, max 0.5 µA; IF=0 mA, VO=5.5 V, VCC=5.5 V, TA=25°C unless otherwise specified |
| High Level Output Current | typ 0.005 µA, max 1 µA; IF=0 mA, VO=15 V, VCC=15 V, TA=25°C unless otherwise specified |
| High Level Output Current | max 50 µA; TA=0 to 70°C |
| Low Level Output Voltage | typ 0.1 V, max 0.4 V; VCC=4.5 V, IF=16 mA, IO=3 mA, TA=25°C unless otherwise specified |
| Low Level Output Voltage | min 0.1 V, max 0.5 V; VCC=4.5 V, IF=16 mA, IO=2.4 mA, TA=25°C unless otherwise specified |
| Current Transfer Ratio | min 19%, typ 24%, max 88%; IF=16 mA, VCC=4.5 V, VO=0.4 V, TA=25°C unless otherwise specified |
| Current Transfer Ratio | min 15%, typ 25%; IF=16 mA, VCC=4.5 V, VO=0.5 V, TA=25°C unless otherwise specified |
| Isolation Resistance | typ 1×10^12 Ω; VIO=500 Vdc, 40 to 60% RH, TA=25°C unless otherwise specified |
| Floating Capacitance | typ 0.6 pF; f=1 MHz, TA=25°C unless otherwise specified |
| Propagation Delay Time to Output High Level | typ 150 ns, max 800 ns; TA=25°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output High Level | max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level | typ 200 ns, max 800 ns; TA=25°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level | max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic High | min 5000 V/µs; TA=25°C, IF=0 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic Low | min 5000 V/µs; TA=25°C, IF=16 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Reflow Preheat Temperature | 150 to 200 °C; Reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; Reflow soldering profile |
| Reflow Peak Temperature | 260 °C; Reflow soldering profile; no more than three times |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; Product rework or sample testing |
| Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 10000 pcs/carton; SOP6 reel packing |
| Datasheet Status | request_only |
Product Overview
The XL0453-G is a XINGLIGHT high speed optocoupler documented for SOP6-W and SOP6-P package cases. Its core timing specification is a 1 MBit/s data rate, with propagation delay values of 150 ns typical to output high and 200 ns typical to output low under 25 °C, 5 V VCC, 16 mA input current, and 1.9 kΩ load conditions.
Isolation and interface behavior are central to the device data. The datasheet lists 5000 Vrms isolation voltage for 1 minute at 40 to 60% RH, 1×10^12 Ω typical isolation resistance at 500 Vdc, and 0.6 pF typical floating capacitance at 1 MHz. Common-mode transient immunity is specified at 5000 V/µs minimum for both logic-high and logic-low test states.
For board assembly, the device uses UL 94V-0 molding compound and matte tin-plated leads with solderability per MIL-STD-202, Method 208. Reflow guidance includes 150 to 200 °C preheat, 60 to 120 s preheat time, and 260 °C peak temperature, no more than three times.
Key Features
- 1 MBit/s data rate for high speed optocoupler operation
- SOP6-W and SOP6-P package case options
- 5000 Vrms isolation voltage for one minute
- 5000 V/µs minimum common-mode transient immunity
- 150 ns typical propagation delay to output high
- 200 ns typical propagation delay to output low
- -40 to +85 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 solderability
- 260 °C reflow peak temperature, maximum three cycles
Typical Applications
- Isolated 1 MBit/s signal transfer
- SOP6 optocoupler board assemblies
- Logic interfaces requiring 5000 Vrms isolation
- Circuits needing 5000 V/µs CMTI
- Digital isolation over -40 to +85 °C
- Reflow-assembled electronic components
FAQ
What type of device is XL0453-G?
XL0453-G is identified in the extracted datasheet facts as a XINGLIGHT high speed optocoupler in the Electronic Component category. The listed case options are SOP6-W and SOP6-P.
What data rate is specified for XL0453-G?
The datasheet facts specify a 1 MBit/s data rate for XL0453-G. Timing data also lists propagation delay to output high at 150 ns typical and output low at 200 ns typical under the stated 25 °C test condition.
What isolation rating does XL0453-G provide?
The extracted facts list 5000 Vrms isolation voltage measured with 40 to 60% RH and AC applied for 1 minute. Isolation resistance is listed as 1×10^12 Ω typical at 500 Vdc.
What soldering profile is listed for XL0453-G?
The reflow profile lists 150 to 200 °C preheat temperature, 60 to 120 seconds preheat time, and 260 °C peak temperature. The extracted facts state the 260 °C reflow peak is no more than three times.