Specifications
| Type | Description |
|---|---|
| Part Number | XL0453-G |
| Manufacturer | XINGLIGHT |
| Product Type | High speed optocoupler |
| Category | Optocouplers |
| Package Case | SOP6-W, SOP6-P |
| Data Rate | 1 MBit/s; Feature specification |
| Case | SOP6-W, SOP6-P; Mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; Mechanical data |
| Terminals | Matte tin-plated leads; Solderability per MIL-STD-202, Method 208 |
| Package Shipping Quantity | 1000 pcs/Tape & Reel; Part number XL0453P, package SOP6-P |
| Marking Code | XL0453; Part number XL0453P, package SOP6-P |
| Forward Current | 25 mA max; TA=25°C unless otherwise specified |
| Peak Forward Current | 50 mA max; 50% duty cycle, 1 ms pulse width; TA=25°C unless otherwise specified |
| Emitter Reverse Voltage | 5 V max; TA=25°C unless otherwise specified |
| Transient Current Peak | 1 A max; ≤1 µs pulse width, 300 pps; TA=25°C unless otherwise specified |
| Input Power Dissipation | 45 mW max; TA=25°C unless otherwise specified |
| Supply Voltage | -0.5 to 30 V; TA=25°C unless otherwise specified |
| Output Current | 8 mA max; TA=25°C unless otherwise specified |
| Peak Output Current | 16 mA max; TA=25°C unless otherwise specified |
| Collector Output Power Dissipation | 100 mW max; TA=25°C unless otherwise specified |
| Output Voltage | -0.5 to 20 V; TA=25°C unless otherwise specified |
| Emitter-Base Reverse Voltage | 5 V max; TA=25°C unless otherwise specified |
| Base Current | 5 mA max; TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature | -40 to +85 °C; Thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; Thermal characteristics |
| Soldering Temperature | 260 °C; For 10 seconds |
| Forward Voltage | typ 1.45 V, max 1.7 V; IF=16 mA, TA=25°C unless otherwise specified |
| Reverse Breakdown Input Voltage | min 5 V, typ 20 V; IR=10 µA, TA=25°C unless otherwise specified |
| Diode Temperature Coefficient | typ -1.6 mV/°C; IF=10 mA, TA=25°C unless otherwise specified |
| High Level Supply Current | max 1 µA; VCC=15 V, IF=0 mA, VO=open, TA=25°C unless otherwise specified |
| High Level Supply Current | max 2 µA; VCC=15 V, IF=0 mA, VO=open, TA=0 to 70°C |
| Low Level Supply Current | typ 120 µA, max 200 µA; VCC=15 V, IF=16 mA, VO=open, TA=25°C unless otherwise specified |
| High Level Output Current | typ 0.001 µA, max 0.5 µA; IF=0 mA, VO=5.5 V, VCC=5.5 V, TA=25°C unless otherwise specified |
| High Level Output Current | typ 0.005 µA, max 1 µA; IF=0 mA, VO=15 V, VCC=15 V, TA=25°C unless otherwise specified |
| High Level Output Current | max 50 µA; TA=0 to 70°C |
| Low Level Output Voltage | typ 0.1 V, max 0.4 V; VCC=4.5 V, IF=16 mA, IO=3 mA, TA=25°C unless otherwise specified |
| Low Level Output Voltage | min 0.1 V, max 0.5 V; VCC=4.5 V, IF=16 mA, IO=2.4 mA, TA=25°C unless otherwise specified |
| Current Transfer Ratio | min 19%, typ 24%, max 88%; IF=16 mA, VCC=4.5 V, VO=0.4 V, TA=25°C unless otherwise specified |
| Current Transfer Ratio | min 15%, typ 25%; IF=16 mA, VCC=4.5 V, VO=0.5 V, TA=25°C unless otherwise specified |
| Isolation Resistance | typ 1×10^12 Ω; VIO=500 Vdc, 40 to 60% RH, TA=25°C unless otherwise specified |
| Floating Capacitance | typ 0.6 pF; f=1 MHz, TA=25°C unless otherwise specified |
| Propagation Delay Time to Output High Level | typ 150 ns, max 800 ns; TA=25°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output High Level | max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level | typ 200 ns, max 800 ns; TA=25°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level | max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic High | min 5000 V/µs; TA=25°C, IF=0 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Common Mode Transient Immunity at Logic Low | min 5000 V/µs; TA=25°C, IF=16 mA, |VCM|=10 V peak, CL=15 pF, RL=1.9 kΩ |
| Reflow Preheat Temperature | 150 to 200 °C; Reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; Reflow soldering profile |
| Reflow Peak Temperature | 260 °C; Reflow soldering profile; no more than three times |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s; Product rework or sample testing |
| Packing Quantity | 1000 pcs/reel, 2000 pcs/box, 10000 pcs/carton; SOP6 reel packing |
| Datasheet Status | request_only |
Product Overview
The XL0453-G is a XINGLIGHT high speed optocoupler documented for SOP6-W and SOP6-P package cases. Its core timing specification is a 1 MBit/s data rate, with propagation delay values of 150 ns typical to output high and 200 ns typical to output low under 25 °C, 5 V VCC, 16 mA input current, and 1.9 kΩ load conditions.
Isolation and interface behavior are central to the device data. The datasheet lists 5000 Vrms isolation voltage for 1 minute at 40 to 60% RH, 1×10^12 Ω typical isolation resistance at 500 Vdc, and 0.6 pF typical floating capacitance at 1 MHz. Common-mode transient immunity is specified at 5000 V/µs minimum for both logic-high and logic-low test states.
For board assembly, the device uses UL 94V-0 molding compound and matte tin-plated leads with solderability per MIL-STD-202, Method 208. Reflow guidance includes 150 to 200 °C preheat, 60 to 120 s preheat time, and 260 °C peak temperature, no more than three times.
Key Features
- 1 MBit/s data rate for high speed optocoupler operation
- SOP6-W and SOP6-P package case options
- 5000 Vrms isolation voltage for one minute
- 5000 V/µs minimum common-mode transient immunity
- 150 ns typical propagation delay to output high
- 200 ns typical propagation delay to output low
- -40 to +85 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 solderability
- 260 °C reflow peak temperature, maximum three cycles
Typical Applications
- Isolated 1 MBit/s signal transfer
- SOP6 optocoupler board assemblies
- Logic interfaces requiring 5000 Vrms isolation
- Circuits needing 5000 V/µs CMTI
- Digital isolation over -40 to +85 °C
- Reflow-assembled electronic components
Procurement Notes
When requesting a quote for XL0453-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For optocoupler and isolation sourcing, isolation voltage, CTR or output type, package, creepage distance, temperature grade, agency approvals and soldering conditions should be verified before approval.
FAQ
What type of device is XL0453-G?
XL0453-G is identified in the extracted datasheet facts as a XINGLIGHT high speed optocoupler in the Electronic Component category. The listed case options are SOP6-W and SOP6-P.
What data rate is specified for XL0453-G?
The datasheet facts specify a 1 MBit/s data rate for XL0453-G. Timing data also lists propagation delay to output high at 150 ns typical and output low at 200 ns typical under the stated 25 °C test condition.
What isolation rating does XL0453-G provide?
The extracted facts list 5000 Vrms isolation voltage measured with 40 to 60% RH and AC applied for 1 minute. Isolation resistance is listed as 1×10^12 Ω typical at 500 Vdc.
What soldering profile is listed for XL0453-G?
The reflow profile lists 150 to 200 °C preheat temperature, 60 to 120 seconds preheat time, and 260 °C peak temperature. The extracted facts state the 260 °C reflow peak is no more than three times.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.