Specifications
| Type | Description |
|---|---|
| Part Number | XL0453 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP8, DIP8-M, SMD8 |
| Data Rate | 1 MBit/s; Feature specification |
| Output Type | Open-collector output; Feature specification |
| Isolation Voltage | 5000 Vrms; Feature specification |
| Operating Temperature | -40 to +100 °C; Feature specification |
| Package Options | DIP8, DIP8-M, SMD8; Mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; Mechanical data |
| DC/Average Forward Input Current | 25 mA; TA=25°C unless otherwise specified |
| Peak Forward Input Current | 50 mA; 50% duty cycle, 1 ms pulse width, TA=25°C |
| Reverse Voltage | 5 V; TA=25°C unless otherwise specified |
| Peak Transient Input Current | 1 A; Pulse width <=1 µs, 300 pps |
| Input Power Dissipation | 45 mW; TA=25°C unless otherwise specified |
| Supply Voltage | -0.5 to 30 V; TA=25°C unless otherwise specified |
| Output Current | 8 mA; TA=25°C unless otherwise specified |
| Peak Output Current | 16 mA; TA=25°C unless otherwise specified |
| Output Power Dissipation | 100 mW; TA=25°C unless otherwise specified |
| Output Voltage | -0.5 to 20 V; TA=25°C unless otherwise specified |
| Emitter-Base Reverse Voltage | 5 V; TA=25°C unless otherwise specified |
| Base Current | 5 mA; TA=25°C unless otherwise specified |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute |
| Storage Temperature Range | -55 to +125 °C; Thermal characteristics |
| Soldering Temperature | 260 °C; For 10 seconds |
| Forward Voltage | Typ 1.45 V, Max 1.7 V; IF=16 mA, TA=25°C |
| Reverse Breakdown Input Voltage | Min 5 V, Typ 20 V; IR=10 µA, TA=25°C |
| Diode Temperature Coefficient | Typ -1.6 mV/°C; IF=16 mA, TA=25°C |
| High Level Supply Current | Max 1 µA; VCC=15 V, IF=0 mA, VO=open, TA=25°C |
| High Level Supply Current | Max 2 µA; VCC=15 V, IF=0 mA, VO=open, TA=0 to 70°C |
| Low Level Supply Current | Typ 50 µA, Max 200 µA; VCC=15 V, IF=16 mA, VO=open, TA=25°C |
| High Level Output Current | Typ 0.001 µA, Max 0.5 µA; VCC=5.5 V, VO=5.5 V, IF=0 mA, TA=25°C |
| High Level Output Current | Typ 0.005 µA, Max 1 µA; VCC=15 V, VO=15 V, IF=0 mA, TA=25°C |
| High Level Output Current | Max 50 µA; VCC=15 V, VO=15 V, IF=0 mA, TA=0 to 70°C |
| Low Level Output Voltage | Typ 0.1 V, Max 0.4 V; VCC=4.5 V, IF=16 mA, IO=3 mA, TA=25°C |
| Current Transfer Ratio | Min 19%, Typ 24%, Max 50%; VCC=4.5 V, VO=0.4 V, IF=16 mA, TA=25°C |
| Isolation Voltage | Min 5000 VRMS; RH <50%, TA=25°C, I-I-O <=50 µA |
| Isolation Resistance | Typ 1×10^12 Ω; VIO=500 V, TA=25°C |
| Floating Capacitance | Typ 0.6 pF; f=1 MHz, TA=25°C |
| Propagation Delay Time to Output High Level | Typ 600 ns, Max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Propagation Delay Time to Output Low Level | Typ 200 ns, Max 800 ns; TA=-40 to +85°C, VCC=5 V, IF=16 mA, RL=1.9 kΩ |
| Common Mode Transient Immunity at Output High Level | Min 1000 V/µs; RL=1.9 kΩ, TA=25°C, IF=0 mA, |VCM|=10 V peak, CL=15 pF |
| Common Mode Transient Immunity at Output Low Level | Min 1000 V/µs; RL=1.9 kΩ, TA=25°C, IF=16 mA, |VCM|=10 V peak, CL=15 pF |
| Reflow Preheat Temperature | 150 to 200 °C; Reflow soldering profile |
| Reflow Preheat Time | 60 to 120 s; Reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; Reflow soldering profile |
| Reflow Time Above Liquidus | 60 to 150 s; Temperature above TL |
| Reflow Peak Temperature | 260 °C; Reflow soldering profile |
| Reflow Peak Time | 30 s; Time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL |
| Reflow Cycles | No more than 3 times; Recommended reflow soldering |
| Wave Soldering Peak Temperature | 260 °C; Wave soldering profile |
| Wave Soldering Peak Time | 10 s; Time within peak temperature |
| Hand Soldering Iron Temperature | 360 °C +5 °C; Within 3 s, for product rework or sample testing |
| DIP8 Shipping Quantity | 45 pcs/tube; Tube packing, 500 mm tube |
| DIP8-M Shipping Quantity | 45 pcs/tube; Tube packing, 500 mm tube |
| SMD8 Shipping Quantity | 1000 pcs/reel; Reel packing, 330 mm reel |
| Datasheet Status | request_only |
Product Overview
The XL0453 is a XINGLIGHT high speed optocoupler in the LED category. It combines an input LED with an open-collector output and is specified for a 1 MBit/s data rate. The device provides 5000 Vrms isolation, with isolation resistance of typ 1×10^12 Ω at VIO=500 V and floating capacitance of typ 0.6 pF at 1 MHz.
Package options include DIP8, DIP8-M, and SMD8. The molding compound is rated UL 94V-0, and the operating temperature range is -40 to +100 °C. Absolute maximum and electrical characteristics include 25 mA DC/average forward input current, 5 V reverse voltage, -0.5 to 30 V supply voltage, and -0.5 to 20 V output voltage.
Switching data includes typ 600 ns and max 800 ns propagation delay to output high level, and typ 200 ns and max 800 ns propagation delay to output low level, measured at VCC=5 V, IF=16 mA, and RL=1.9 kΩ. Assembly data covers reflow, wave soldering, and hand soldering limits for production or rework use.
Key Features
- 1 MBit/s high speed optocoupler data rate
- Open-collector output for isolated signal coupling
- 5000 Vrms isolation voltage rating
- -40 to +100 °C operating temperature range
- DIP8, DIP8-M, and SMD8 package options
- UL 94V-0 molding compound flammability rating
- Typ 600 ns propagation delay to output high
- Typ 200 ns propagation delay to output low
- Min 1000 V/µs common mode transient immunity
- SMD8 supplied as 1000 pcs per reel
Typical Applications
- Isolated digital signal transfer
- Open-collector logic interface isolation
- High speed control signal coupling
- Low capacitance isolation barriers
- DIP8 through-hole optocoupler designs
- SMD8 reflow-assembled isolation circuits
Procurement Notes
When requesting a quote for XL0453, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What product type is the XL0453?
The XL0453 is identified as a XINGLIGHT high speed optocoupler in the LED category. It has an open-collector output and is specified for a 1 MBit/s data rate.
What package options are specified for XL0453?
The datasheet facts list DIP8, DIP8-M, and SMD8 package options. DIP8 and DIP8-M shipping quantities are 45 pcs per 500 mm tube, while SMD8 is supplied as 1000 pcs per 330 mm reel.
What isolation rating does XL0453 provide?
XL0453 is specified with 5000 Vrms isolation voltage. Electrical characteristics also list minimum 5000 VRMS isolation under RH <50%, TA=25°C, and I-I-O <=50 µA test conditions.
What are the XL0453 switching delay specifications?
At TA=-40 to +85°C, VCC=5 V, IF=16 mA, and RL=1.9 kΩ, propagation delay to output high is typ 600 ns and max 800 ns. Propagation delay to output low is typ 200 ns and max 800 ns.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.