Specifications
| Type | Description |
|---|---|
| Part Number | XL0630 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Other |
| Package Case | SOP8; package outline dimensions referenced in mm but numeric dimensions not provided in text |
| Data Rate | 10 MBit/s; feature statement |
| Isolation Voltage | 3750 Vrms; feature statement, input to output |
| Operating Temperature | -40 to +100 °C; feature statement |
| Case | SOP8; mechanical data |
| Molding Compound Flammability Rating | UL 94V-0; mechanical data |
| Terminal Finish | Matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Package Shipping Quantity | 1000 pcs/Tape & Reel; part number XL063XP, SOP8 |
| Marking Code | XL063X; part number XL063XP |
| Forward Current | Max 50 mA; maximum ratings, TA=25°C unless otherwise specified |
| Reverse Voltage | Max 5 V; maximum ratings, TA=25°C unless otherwise specified |
| Input Power Dissipation | Max 45 mW; maximum ratings, TA=25°C unless otherwise specified |
| Collector Output Power Dissipation | Max 100 mW; maximum ratings, TA=25°C unless otherwise specified |
| Output Current | Max 50 mA; maximum ratings, TA=25°C unless otherwise specified |
| Output Voltage | Max 7.0 V; maximum ratings, TA=25°C unless otherwise specified |
| Supply Voltage | Max 7.0 V; maximum ratings, max 1 minute, TA=25°C unless otherwise specified |
| Isolation Voltage | 3750 Vrms; 40 to 60% RH, AC for 1 minute |
| Operating Temperature | -40 to +100 °C; thermal characteristics |
| Storage Temperature Range | -55 to +125 °C; thermal characteristics |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | Typ 1.4 V, Max 1.8 V; IF=10 mA, TA=25°C unless otherwise specified |
| Reverse Breakdown Voltage | Min 5 V; IR=10 µA, TA=25°C unless otherwise specified |
| Temperature Coefficient of Forward Voltage | Typ 1.8 mV/°C; IF=10 mA, TA=25°C unless otherwise specified |
| Input Capacitance | Typ 60 pF; VF=0, f=1 MHz, TA=25°C unless otherwise specified |
| High Level Supply Current | Typ 13 mA, Max 18 mA; IF=0 mA, VE=0.5 V, VCC=5.5 V |
| Low Level Supply Current | Typ 15 mA, Max 21 mA; IF=10 mA, VE=0.5 V, VCC=5.5 V |
| High Level Output Current | Max 100 µA; VCC=5.5 V, VO=5.5 V, IF=250 µA |
| Low Level Output Voltage | Max 0.6 V; VCC=5.5 V, IF=5 mA, ICL=13 mA |
| Input Threshold Current | Max 5 mA; VCC=5.5 V, VO=0.6 V, IOL=13 mA |
| Propagation Delay Time to Output High Level | Max 100 ns; TA=-40°C to 85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω, TA=25°C |
| Propagation Delay Time to Output Low Level | Max 100 ns; TA=-40°C to 85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω, TA=25°C |
| Pulse Width Distortion | Max 35 ns; TA=-40°C to 85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω |
| Output Rise Time | Typ 40 ns; TA=-40°C to 85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω |
| Output Fall Time | Typ 10 ns; TA=-40°C to 85°C, VCC=5 V, IF=7.5 mA, CL=15 pF, RL=350 Ω |
| Common Mode Transient Immunity at Logic High | Min 5000 V/µs; XL0630, IF=0 mA, VOH(min)=2.0 V, RL=350 Ω, TA=25°C, |VCM|=1 kV |
| Common Mode Transient Immunity at Logic High | Min 10000 V/µs; XL0631, IF=0 mA, VOH(min)=2.0 V, RL=350 Ω, TA=25°C, |VCM|=1 kV |
| Common Mode Transient Immunity at Logic Low | Min 5000 V/µs; XL0630, IF=7.5 mA, VOL(max)=0.8 V, RL=350 Ω, TA=25°C, |VCM|=1 kV |
| Common Mode Transient Immunity at Logic Low | Min 10000 V/µs; XL0631, IF=7.5 mA, VOL(max)=0.8 V, RL=350 Ω, TA=25°C, |VCM|=1 kV |
| Reflow Preheat Temperature | Min 150 °C, Max 200 °C; reflow soldering profile |
| Reflow Preheat Time | Min 60 s, Max 120 s; reflow soldering profile |
| Reflow Ramp-Up Rate | Max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering profile |
| Reflow Time Above Liquidus | Min 60 s, Max 150 s; above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering profile |
| Reflow Time Near Peak | Max 30 s; Tc between TP-5 and TP |
| Reflow Ramp-Down Rate | Max 6 °C/s; TP to TL |
| Reflow Cycle Limit | No more than 3 times; recommended temperatures and times |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature |
| Wave Soldering Heating Rate During Preheat | Typical 1 to 2 °C/s, Max 4 °C/s; wave soldering profile feature |
| Wave Soldering Final Preheat Temperature | ~130 °C; wave soldering profile feature |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; wave soldering profile feature |
| Wave Soldering Time Within Peak Temperature | 10 s; wave soldering profile feature |
| Wave Soldering Ramp-Down Rate | Max 5 °C/s; wave soldering profile feature |
| Hand Soldering Iron Temperature | 360 °C +5°C within 3 s; only for product rework or sample testing |
| Packing Quantity Per Reel | 1000 pcs/reel; SOP8 reel, diameter 330 mm |
| Packing Quantity Per Box | 2 reels/box; 2000 pcs/box; SOP8 reel packing |
| Packing Quantity Per Carton | 10 boxes/carton; 20000 pcs/carton; SOP8 reel packing |
| Antistatic Bag Specification | 450 x 390 x 0.1 mm; SOP8 packing |
| Box Specification | 340 x 60 x 340 mm; SOP8 packing |
| Carton Specification | 620 x 360 x 365 mm; SOP8 packing |
| Guard Band | 200 mm min; SOP8 packing |
| Document Validity | Valid until Dec 31, 2026; attention note |
| Datasheet Status | request_only |
Product Overview
The XINGLIGHT XL0630 is identified as a high speed optocoupler in the LED category. It uses an SOP8 case, with package outline dimensions referenced in millimeters but without numeric dimensions in the extracted text. The datasheet lists a 10 MBit/s data rate and 3750 Vrms isolation voltage between input and output, including a 40 to 60% RH AC 1-minute isolation condition.
Electrical ratings include 50 mA maximum forward current, 5 V maximum reverse voltage, 45 mW maximum input power dissipation, 100 mW maximum collector output power dissipation, and 7.0 V maximum output and supply voltage ratings. At IF=10 mA, forward voltage is listed as 1.4 V typical and 1.8 V maximum. Switching specifications include 100 ns maximum propagation delay to output high or low, 35 ns maximum pulse width distortion, 40 ns typical rise time, and 10 ns typical fall time.
Assembly data covers reflow, wave soldering, and hand-soldering limits. The device is supplied in SOP8 tape-and-reel packaging at 1000 pcs/reel, with box and carton packing quantities specified for sourcing and handling workflows.
Key Features
- 10 MBit/s high speed optocoupler data rate
- 3750 Vrms input-to-output isolation voltage
- SOP8 case with matte tin-plated leads
- -40 to +100 °C operating temperature range
- UL 94V-0 molding compound flammability rating
- 100 ns maximum propagation delay to output high
- 100 ns maximum propagation delay to output low
- 35 ns maximum pulse width distortion
- 5000 V/µs minimum XL0630 common mode transient immunity
- 1000 pcs per SOP8 tape-and-reel package
Typical Applications
- Isolated high-speed logic signaling
- Digital interface isolation
- SOP8 optocoupler assemblies
- 5 V logic isolation circuits
- Tape-and-reel production assembly
- Reflow soldered control boards
Procurement Notes
When requesting a quote for XL0630, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What data rate is specified for XL0630?
The extracted datasheet facts list XL0630 as a high speed optocoupler with a 10 MBit/s data rate. This is presented as a feature statement for the device.
What isolation voltage does XL0630 provide?
XL0630 is specified with 3750 Vrms isolation voltage. The facts identify this as input-to-output isolation and also list a 40 to 60% RH AC 1-minute test condition.
What package is used for XL0630?
The package case is SOP8. The extracted data notes that package outline dimensions are referenced in millimeters, but numeric package outline dimensions were not provided in the text.
What soldering limits are listed for XL0630?
The facts include 260 °C soldering temperature for 10 seconds, 260 °C reflow peak temperature, 260 °C wave soldering peak temperature, and a hand-soldering iron condition of 360 °C +5°C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.