Specifications
| Type | Description |
|---|---|
| Part Number | XL4N35-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP6 / SMD6; package outline dimensions referenced in mm but numeric dimensions not provided in text |
| Current Transfer Ratio | min 100 %; IF=10 mA, VCE=10 V |
| Isolation Voltage | 5000 Vrms; input to output; 40-60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted |
| Operating Temperature | -55 to +100 °C; ambient operating range |
| Package Options | DIP6, SMD6; case/package types |
| Molding Compound Flammability | UL 94V-0; mechanical data |
| Terminal Finish | matte tin-plated leads; solderability per MIL-STD-202, Method 208 |
| Forward Current | 60 mA; maximum rating, TA=25°C unless otherwise specified |
| Forward Peak Current | 1 A; pulse width <=1 us, duty ratio 0.001; TA=25°C unless otherwise specified |
| Reverse Voltage | 6 V; input maximum rating, TA=25°C unless otherwise specified |
| Input Power Dissipation | 100 mW; maximum rating, TA=25°C unless otherwise specified |
| Collector Power Dissipation | 300 mW; output maximum rating, TA=25°C unless otherwise specified |
| Collector Current | 100 mA; output maximum rating, TA=25°C unless otherwise specified |
| Collector-Base Voltage | 70 V; output maximum rating, TA=25°C unless otherwise specified |
| Collector-Emitter Voltage | 30 V; output maximum rating, TA=25°C unless otherwise specified |
| Emitter-Collector Voltage | 7 V; output maximum rating, TA=25°C unless otherwise specified |
| Total Power Dissipation | 350 mW; thermal characteristic, TA=25°C unless otherwise specified |
| Storage Temperature Range | -55 to +125 °C; thermal characteristic |
| Soldering Temperature | 260 °C; for 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.5 V; IF=10 mA, TA=25°C unless otherwise specified |
| Reverse Current | max 10 uA; VR=3 V, TA=25°C unless otherwise specified |
| Input Capacitance | typ 50 pF; V=0 V, f=1 kHz, TA=25°C unless otherwise specified |
| Collector Dark Current | max 50 nA; VCE=10 V, TA=25°C unless otherwise specified |
| Collector-Base Breakdown Voltage | min 70 V; IB=0.1 mA, IF=0, TA=25°C unless otherwise specified |
| Collector-Emitter Breakdown Voltage | min 30 V; IC=0.1 mA, IF=0, TA=25°C unless otherwise specified |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=0.01 mA, IF=0, TA=25°C unless otherwise specified |
| Collector-Emitter Saturation Voltage | typ 0.3 V; IF=50 mA, IC=2 mA, TA=25°C unless otherwise specified |
| Isolation Resistance | min 5*10^10 ohm, typ 10^11 ohm; DC 500 V, 40-60% RH, TA=25°C unless otherwise specified |
| Isolation Capacitance | typ 1 pF, max 2.5 pF; V=0, f=1 MHz, TA=25°C unless otherwise specified |
| Response Time Rise | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C unless otherwise specified |
| Response Time Fall | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C unless otherwise specified |
| Reflow Preheat Temperature | min 150 °C, max 200 °C; recommended reflow soldering profile |
| Reflow Preheat Time | min 60 s, max 120 s; recommended reflow soldering profile |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; recommended reflow soldering profile |
| Reflow Time Above Liquidus | min 60 s, max 150 s; time above TL |
| Reflow Peak Temperature | 260 °C; recommended reflow soldering profile |
| Reflow Time Near Peak | max 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Reflow Cycle Limit | no more than 3 times; recommended reflow soldering |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s; wave soldering profile feature as printed |
| Wave Soldering Heating Rate During Preheat | typ 1-2 °C/s, max 4 °C/s; wave soldering profile |
| Wave Soldering Final Preheat Temperature | ~130 °C; Ts, wave soldering profile |
| Wave Soldering Preheat Time | >60 s; 25°C to Ts |
| Wave Soldering Peak Temperature | 260 °C; Tp, wave soldering profile |
| Wave Soldering Time Within Peak Temperature | 10 s; tp, wave soldering profile |
| Wave Soldering Ramp-Down Rate | max 5 °C/s; wave soldering profile |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; for product rework or sample testing only |
| DIP6 Shipping Quantity | 65 pcs/tube; ordering information |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel; ordering information |
| DIP6 Carton Quantity | 32500 pcs/carton; packing summary; 65 pcs/tube, 3250 pcs/box |
| SMD6 Carton Quantity | 20000 pcs/carton; packing summary; 1000 pcs/reel, 2000 pcs/box |
| Datasheet Status | request_only |
Product Overview
The XL4N35-G is a XINGLIGHT phototransistor optocoupler in the LED category. It is specified with an input LED and phototransistor output structure, supporting optical coupling where input-to-output isolation is required. The datasheet lists a 5000 Vrms isolation voltage under 40-60% RH AC test conditions for one minute, with input pins shorted together and output pins shorted together.
Electrical characteristics include a minimum current transfer ratio of 100% at IF=10 mA and VCE=10 V, forward voltage of 1.2 V typical and 1.5 V maximum at IF=10 mA, and collector dark current limited to 50 nA maximum at VCE=10 V. Output ratings include 100 mA collector current, 70 V collector-base voltage, and 30 V collector-emitter voltage.
Package choices are DIP6 and SMD6, with matte tin-plated leads and UL 94V-0 molding compound flammability. Assembly information includes reflow peak temperature of 260 °C, wave soldering peak temperature of 260 °C, and hand soldering at 360 °C +5 °C within 3 seconds for rework or sample testing only.
Key Features
- Phototransistor optocoupler in DIP6 and SMD6 packages
- Minimum 100% CTR at IF=10 mA, VCE=10 V
- 5000 Vrms input-to-output isolation voltage rating
- -55 to +100 °C ambient operating temperature range
- UL 94V-0 molding compound flammability rating
- Matte tin-plated leads per MIL-STD-202 Method 208
- Typical 3 us rise and fall response times
- Reflow and wave soldering peak temperature of 260 °C
- DIP6 tube and SMD6 tape-and-reel shipping options
Typical Applications
- Input-to-output signal isolation
- Microcontroller input isolation
- Industrial control interfaces
- Power supply feedback isolation
- Logic signal coupling
- DIP6 through-hole assemblies
- SMD6 surface-mount assemblies
Procurement Notes
When requesting a quote for XL4N35-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What type of device is the XL4N35-G?
The XL4N35-G is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts identify DIP6 and SMD6 package options and specify input LED, output transistor, isolation, transfer ratio, and response-time parameters.
What isolation rating is specified for XL4N35-G?
The datasheet facts list 5000 Vrms input-to-output isolation, tested at 40-60% relative humidity with AC applied for one minute. The condition shorts pins 1, 2, and 3 together and pins 4, 5, and 6 together.
What current transfer ratio does XL4N35-G provide?
The current transfer ratio is specified as 100% minimum under the stated condition of IF=10 mA and VCE=10 V. This value should be interpreted with the datasheet test condition, not as a general value across all operating points.
Which package and packing options are listed?
The extracted facts list DIP6 and SMD6 package options. DIP6 shipping is 65 pieces per tube, with 32500 pieces per carton. SMD6 shipping is 1000 pieces per tape and reel, with 20000 pieces per carton.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.