Selected Chinese Memory Companies and Solution Providers

Direct answer and scope

This supplier landscape helps procurement, engineering and supply-chain teams discover verified Chinese memory suppliers, evaluate supplier capabilities, understand technology scope, identify potential sourcing options and prepare memory RFQ requirements. It links to the global Memory manufacturer context instead of duplicating it, and it does not establish current stock, price, lead time, authorization, export availability or part interchangeability.

Memory Supplier Categories

Static category navigation for scanning supplier roles before comparing verified records.

DRAM Manufacturers

Examples: CXMT, UniIC, Montage Technology

NAND and Storage Solution Providers

Examples: YMTC, Longsys, BIWIN, Netac, UNIM

NOR Flash and EEPROM Suppliers

Examples: GigaDevice, Puya, Fudan Microelectronics, Giantec, Dosilicon, Boya, XTX

Verified Supplier Landscape Table

Alphabetical verified supplier records only. The table emphasizes company type, product scope, application fit and sourcing relevance.

Company	Company Type	Memory Category	Technology / Product Layer	Target Applications	Sourcing Relevance
Boya Microelectronics Co. Ltd.	Fabless	SPI NOR Flash	SPI NOR Flash	Consumer, Industrial, IoT, Communications	Specialized - evidence-scoped sourcing candidate
CXMT	IDM	DRAM Manufacturer	DRAM chips and modules	Consumer, Industrial, Data Center, IoT	High - DRAM focused manufacturer
Dosilicon Co. Ltd.	Fabless	NAND, NOR Flash and specialty DRAM	NAND, NOR Flash and specialty DRAM	Consumer, Industrial, Communications, IoT	Specialized - evidence-scoped sourcing candidate
Giantec Semiconductor Corporation	Fabless	EEPROM and NOR Flash	EEPROM and NOR Flash	Automotive, Industrial, Consumer, IoT, Communications	Specialized - evidence-scoped sourcing candidate
GigaDevice Semiconductor Inc.	Fabless	NOR Flash / SLC NAND Supplier	NOR Flash, SLC NAND and cross-category MCU evidence	Industrial, Consumer, IoT, Automotive	High - cross-category Flash and MCU vendor
Montage Technology Co. Ltd.	Fabless	DDR memory-interface and module-supporting ICs	DDR memory-interface and module-supporting ICs	Data Center, Consumer, Industrial	Specialized - evidence-scoped sourcing candidate
Netac Technology Co. Ltd.	Product/solution vendor	SSD, modules, cards and portable storage	SSD, modules, cards and portable storage	Consumer, Industrial, Data Center	Specialized - evidence-scoped sourcing candidate
Puya Semiconductor (Shanghai) Co. Ltd.	Fabless	NOR Flash / EEPROM Supplier	SPI NOR Flash, EEPROM and PY32 MCU families	Industrial, Consumer, IoT, Automotive	High - NOR Flash, EEPROM and value MCU supplier
Shanghai Fudan Microelectronics Group Co. Ltd.	Fabless	NOR Flash / EEPROM / SLC NAND Supplier	EEPROM, SPI NOR, SLC NAND and application-specific MCU families	Automotive, Industrial, Security, IoT	Specialized - NVM, smart-meter and automotive MCU ecosystem
Shenzhen BIWIN Storage Technology Co. Ltd.	Mixed product/solution company	Embedded, PC, enterprise and automotive storage	Embedded, PC, enterprise and automotive storage	Consumer, Industrial, Automotive, Data Center	Specialized - evidence-scoped sourcing candidate
Shenzhen Longsys Electronics Co. Ltd.	Mixed product/solution company	Managed Storage Solution Provider	UFS, eMMC, LPDDR, SSD and memory modules	Automotive, Industrial, Consumer, Data Center	High - embedded storage solution provider
UNIM Innovation Technology Co. Ltd.	Product/solution vendor	SLC NAND, DRAM and enterprise storage	SLC NAND, DRAM and enterprise storage	Industrial, Data Center, Consumer	Specialized - evidence-scoped sourcing candidate
Wuhan Xinxin Semiconductor Manufacturing Co. Ltd.	Foundry	Specialty-memory and foundry process platform	Specialty-memory and foundry process platform	Automotive, Industrial, Consumer, Data Center	Specialized - evidence-scoped sourcing candidate
Xi'an UniIC Semiconductors Co. Ltd.	Fabless	DRAM chips, modules and memory controllers	DRAM chips, modules and memory controllers	Automotive, Consumer, Industrial, Data Center	Specialized - evidence-scoped sourcing candidate
XTX Technology Co. Ltd.	Fabless	NOR, NAND and managed NAND	NOR, NAND and managed NAND	Consumer, Industrial, Communications, IoT, Automotive	Specialized - evidence-scoped sourcing candidate
Yangtze Memory Technologies Co. Ltd.	IDM	NAND Manufacturer	3D NAND, packaged NAND, UFS, eMMC and SSD	Consumer, Communications, Data Center	High - 3D NAND and managed-storage supplier

Company evidence cards

Each card separates official company disclosure, LDeepAI buyer analysis and official source links.

Boya Microelectronics Co. Ltd.

Fabless

SPI NOR FlashNOR Flash

Company disclosure

Official materials identify Boya Microelectronics Co. Ltd. as a Fabless company in the Memory landscape, with public product scope including SPI NOR Flash.

LDeepAI buyer note

Use this record for SPI NOR Flash screening across Consumer, Industrial, IoT, Communications. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

CXMT

IDM

DRAM chips and modulesDRAM

Company disclosure

Official materials identify CXMT as a IDM company in the Memory landscape, with public product scope including DDR5 chips and modules, LPDDR5/5X, DDR4 chips and modules, LPDDR4X.

LDeepAI buyer note

Use this record for DRAM chips and modules screening across Consumer, Industrial, Data Center, IoT. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Dosilicon Co. Ltd.

Fabless

NAND, NOR Flash and specialty DRAMNANDNOR FlashDRAM

Company disclosure

Official materials identify Dosilicon Co. Ltd. as a Fabless company in the Memory landscape, with public product scope including SPI NAND, parallel NAND, SPI NOR, LPDDR.

LDeepAI buyer note

Use this record for NAND, NOR Flash and specialty DRAM screening across Consumer, Industrial, Communications, IoT. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Giantec Semiconductor Corporation

Fabless

EEPROM and NOR FlashEEPROMNOR Flash

Company disclosure

Official materials identify Giantec Semiconductor Corporation as a Fabless company in the Memory landscape, with public product scope including EEPROM, NOR Flash, VCM driver, NFC.

LDeepAI buyer note

Use this record for EEPROM and NOR Flash screening across Automotive, Industrial, Consumer, IoT, Communications. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

GigaDevice Semiconductor Inc.

Fabless

NOR Flash and SLC NANDNOR FlashNAND

Company disclosure

Official materials identify GigaDevice Semiconductor Inc. as a Fabless company in the Memory and MCU landscape, with public product scope including GD32 MCU, NOR Flash, SLC NAND, DRAM.

LDeepAI buyer note

Use this record for NOR Flash and SLC NAND screening across Industrial, Consumer, IoT, Automotive. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Montage Technology Co. Ltd.

Fabless

DDR memory-interface and module-supporting ICsMemory Interface

Company disclosure

Official materials identify Montage Technology Co. Ltd. as a Fabless company in the Memory landscape, with public product scope including DDR memory interface, RCD, data buffer, CKD, SPD Hub, temperature sensor, PMIC.

LDeepAI buyer note

Use this record for DDR memory-interface and module-supporting ICs screening across Data Center, Consumer, Industrial. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Netac Technology Co. Ltd.

Product/solution vendor

SSD, modules, cards and portable storageNANDDRAM

Company disclosure

Official materials identify Netac Technology Co. Ltd. as a Product/solution vendor company in the Memory landscape, with public product scope including SSD, DRAM modules, memory cards, USB storage.

LDeepAI buyer note

Use this record for SSD, modules, cards and portable storage screening across Consumer, Industrial, Data Center. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Puya Semiconductor (Shanghai) Co. Ltd.

Fabless

SPI NOR Flash and EEPROMNOR FlashEEPROM

Company disclosure

Official materials identify Puya Semiconductor (Shanghai) Co. Ltd. as a Fabless company in the Memory and MCU landscape, with public product scope including SPI NOR Flash, SPI and I2C EEPROM, PY32 MCU, VCM driver.

LDeepAI buyer note

Use this record for SPI NOR Flash and EEPROM screening across Industrial, Consumer, IoT, Automotive. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Shanghai Fudan Microelectronics Group Co. Ltd.

Fabless

EEPROM, SPI NOR Flash and SLC NANDEEPROMNOR FlashNAND

Company disclosure

Official materials identify Shanghai Fudan Microelectronics Group Co. Ltd. as a Fabless company in the MCU and Memory landscape, with public product scope including automotive MCU, smart-meter MCU, low-power MCU, EEPROM, SPI NOR, SLC NAND.

LDeepAI buyer note

Use this record for EEPROM, SPI NOR Flash and SLC NAND screening across Automotive, Industrial, Security, IoT. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Shenzhen BIWIN Storage Technology Co. Ltd.

Mixed product/solution company

Embedded, PC, enterprise and automotive storageNANDDRAM

Company disclosure

Official materials identify Shenzhen BIWIN Storage Technology Co. Ltd. as a Mixed product/solution company company in the Memory landscape, with public product scope including ePOP, eMMC, UFS, SSD, DRAM modules.

LDeepAI buyer note

Use this record for Embedded, PC, enterprise and automotive storage screening across Consumer, Industrial, Automotive, Data Center. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Shenzhen Longsys Electronics Co. Ltd.

Mixed product/solution company

Embedded storage, SSD and modulesNANDDRAM

Company disclosure

Official materials identify Shenzhen Longsys Electronics Co. Ltd. as a Mixed product/solution company company in the Memory landscape, with public product scope including UFS, eMMC, LPDDR, SSD, memory modules.

LDeepAI buyer note

Use this record for Embedded storage, SSD and modules screening across Automotive, Industrial, Consumer, Data Center. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

UNIM Innovation Technology Co. Ltd.

Product/solution vendor

SLC NAND, DRAM and enterprise storageNANDDRAM

Company disclosure

Official materials identify UNIM Innovation Technology Co. Ltd. as a Product/solution vendor company in the Memory landscape, with public product scope including SLC NAND, DRAM, enterprise SSD and storage solutions.

LDeepAI buyer note

Use this record for SLC NAND, DRAM and enterprise storage screening across Industrial, Data Center, Consumer. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Wuhan Xinxin Semiconductor Manufacturing Co. Ltd.

Foundry

Specialty-memory and foundry process platformNOR FlashSpecialty Memory

Company disclosure

Official materials identify Wuhan Xinxin Semiconductor Manufacturing Co. Ltd. as a Foundry company in the Memory landscape, with public product scope including NOR Flash and specialty-memory process platforms.

LDeepAI buyer note

Use this record for Specialty-memory and foundry process platform screening across Automotive, Industrial, Consumer, Data Center. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Xi'an UniIC Semiconductors Co. Ltd.

Fabless

DRAM chips, modules and memory controllersDRAMMemory Controllers

Company disclosure

Official materials identify Xi'an UniIC Semiconductors Co. Ltd. as a Fabless company in the Memory landscape, with public product scope including DDR3, DDR4, LPDDR4X, modules, embedded DRAM, memory controller.

LDeepAI buyer note

Use this record for DRAM chips, modules and memory controllers screening across Automotive, Consumer, Industrial, Data Center. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

XTX Technology Co. Ltd.

Fabless

NOR, NAND and managed NANDNOR FlashNAND

Company disclosure

Official materials identify XTX Technology Co. Ltd. as a Fabless company in the Memory and MCU landscape, with public product scope including SPI NOR, SPI NAND, parallel NAND, eMMC, SD NAND, 8-bit MCU, 32-bit MCU.

LDeepAI buyer note

Use this record for NOR, NAND and managed NAND screening across Consumer, Industrial, Communications, IoT, Automotive. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

Yangtze Memory Technologies Co. Ltd.

IDM

3D NAND, packaged NAND, embedded memory and SSDNAND

Company disclosure

Official materials identify Yangtze Memory Technologies Co. Ltd. as a IDM company in the Memory landscape, with public product scope including 3D NAND wafers and packaged chips, enterprise SSD, client SSD, UFS, eMMC.

LDeepAI buyer note

Use this record for 3D NAND, packaged NAND, embedded memory and SSD screening across Consumer, Communications, Data Center. Keep chip, module, managed-storage, interface and finished-product layers separate before an RFQ.

Official sources

DRAM companies

Use this grouping as a technical orientation layer. It does not imply equivalence between companies or products.

CXMT

Visible layer: DRAM chips and modules

Applications: Consumer, Industrial, Data Center, IoT

Evidence scope: IATF 16949 management-system certification stated; no exact automotive part qualification reviewed.

Montage Technology Co. Ltd.

Visible layer: DDR memory-interface and module-supporting ICs

Applications: Data Center, Consumer, Industrial

Evidence scope: Not reviewed / no evidence recorded

Xi'an UniIC Semiconductors Co. Ltd.

Visible layer: DRAM chips, modules and memory controllers

Applications: Automotive, Consumer, Industrial, Data Center

Evidence scope: Official LPDDR4X page states automotive application; exact qualification is not established.

NAND and managed-storage companies

Use this grouping as a technical orientation layer. It does not imply equivalence between companies or products.

Netac Technology Co. Ltd.

Visible layer: SSD, modules, cards and portable storage

Applications: Consumer, Industrial, Data Center

Evidence scope: Not reviewed / no evidence recorded

Shenzhen BIWIN Storage Technology Co. Ltd.

Visible layer: Embedded, PC, enterprise and automotive storage

Applications: Consumer, Industrial, Automotive, Data Center

Evidence scope: Official materials show automotive product positioning; exact certification evidence requires part-level review.

Shenzhen Longsys Electronics Co. Ltd.

Visible layer: Embedded storage, SSD and modules

Applications: Automotive, Industrial, Consumer, Data Center

Evidence scope: Automotive UFS product families and operating scope documented; exact certification must be checked by part.

UNIM Innovation Technology Co. Ltd.

Visible layer: SLC NAND, DRAM and enterprise storage

Applications: Industrial, Data Center, Consumer

Evidence scope: Not reviewed / no evidence recorded

Yangtze Memory Technologies Co. Ltd.

Visible layer: 3D NAND, packaged NAND, embedded memory and SSD

Applications: Consumer, Communications, Data Center

Evidence scope: ISO 9001 and IATF 16949 quality-management systems stated; no exact automotive part qualification reviewed.

NOR Flash and EEPROM companies

Use this grouping as a technical orientation layer. It does not imply equivalence between companies or products.

Boya Microelectronics Co. Ltd.

Visible layer: SPI NOR Flash

Applications: Consumer, Industrial, IoT, Communications

Evidence scope: Not reviewed / no evidence recorded

Dosilicon Co. Ltd.

Visible layer: NAND, NOR Flash and specialty DRAM

Applications: Consumer, Industrial, Communications, IoT

Evidence scope: Not reviewed / no evidence recorded

Giantec Semiconductor Corporation

Visible layer: EEPROM and NOR Flash

Applications: Automotive, Industrial, Consumer, IoT, Communications

Evidence scope: Official catalog separates automotive-grade EEPROM and NOR Flash; exact part documents remain required.

GigaDevice Semiconductor Inc.

Visible layer: NOR Flash and SLC NAND

Applications: Industrial, Consumer, IoT, Automotive

Evidence scope: Automotive-specific MCU families exist; exact-part qualification must be reviewed separately.

Puya Semiconductor (Shanghai) Co. Ltd.

Visible layer: SPI NOR Flash and EEPROM

Applications: Industrial, Consumer, IoT, Automotive

Evidence scope: Named Flash and EEPROM product groups include AEC-Q100 evidence; exact-part documents remain required.

Shanghai Fudan Microelectronics Group Co. Ltd.

Visible layer: EEPROM, SPI NOR Flash and SLC NAND

Applications: Automotive, Industrial, Security, IoT

Evidence scope: FM33LG0xxA automotive MCU page states AEC-Q100 qualification; exact product evidence scope retained.

Wuhan Xinxin Semiconductor Manufacturing Co. Ltd.

Visible layer: Specialty-memory and foundry process platform

Applications: Automotive, Industrial, Consumer, Data Center

Evidence scope: IATF 16949 system certification is stated; no exact memory product qualification reviewed.

XTX Technology Co. Ltd.

Visible layer: NOR, NAND and managed NAND

Applications: Consumer, Industrial, Communications, IoT, Automotive

Evidence scope: Automotive application categories are published; exact-part qualification requires separate review.

Automotive and industrial evidence boundaries

Evidence labels identify the scope of official support. A company-level quality system or process document is not the same as exact product qualification.

Exact product/family evidence available

Use official source links on each card to confirm what product, family, process or application scope the label supports.

Company/process evidence only

Use official source links on each card to confirm what product, family, process or application scope the label supports.

General automotive application claim only

Use official source links on each card to confirm what product, family, process or application scope the label supports.

Not reviewed / no evidence recorded

Use official source links on each card to confirm what product, family, process or application scope the label supports.

Company type and manufacturing-model explanation

Keep raw memory, packaged memory, managed embedded storage, modules and SSD products separate.

CXMT DRAM and YMTC NAND solve different technical problems.
Raw or packaged NAND is not the same evidence layer as eMMC, UFS or SSD.
GigaDevice, Puya and Fudan NOR/EEPROM records are not DRAM or NAND substitutes.
Longsys product/solution and packaging roles must not be treated as wafer fabrication.
Company quality-system evidence is not exact automotive part evidence.

Buyer qualification checklist

Prepare these fields before using the RFQ path.

exact manufacturer and part number
memory technology and product layer
density or capacity, organization and interface
package and pinout
speed, grade and operating-temperature range
host/controller/firmware dependency
endurance, retention and workload where applicable
lifecycle, PCN/EOL and change-control evidence
automotive or industrial qualification evidence where required
lot, date code, traceability and inspection documents
delivery country and export/compliance review
alternatives accepted and engineering requalification boundary

Prepare a Memory RFQ

Share exact manufacturer and part number, memory technology and product layer, density or capacity, interface, package, grade, host dependency, traceability needs, quantity, schedule, destination and accepted alternative boundaries.

Summit RFQ

Selected Chinese Memory Companies and Solution Providers FAQ

Are these all Chinese memory companies?

No. This pilot renders only verified records in the shared dataset. It is not an exhaustive inventory of every China-based Memory company.

What is the difference between a memory manufacturer and storage solution provider?

A memory manufacturer record may support wafer, die or packaged-chip activity, while a storage solution provider may combine controller, firmware, module, SSD, packaging or test roles. The table keeps those product layers separate.

Does inclusion mean stock or authorization is confirmed?

No. Inclusion means official Memory evidence was reviewed. Current stock, lead time, authorization and transaction status still require separate channel checks.

How is automotive evidence checked?

Automotive evidence is shown as exact product/family evidence, company or family claim, or not reviewed. A company-level system certificate is not treated as exact-part qualification.

Can products from different companies be treated as alternatives?

No. Alternatives require exact part, interface, package, grade, firmware, lifecycle and buyer validation evidence.

How often are records reviewed?

These records were reviewed through 2026-07-20 and should be checked quarterly or after major product, filing, PCN/EOL or quality-document changes.

Can inclusion in this supplier landscape guarantee stock availability or direct replacement?

No. Inclusion means the company and product scope have been reviewed through publicly available evidence. Actual sourcing decisions require validation of exact part number, availability, authorized channel status, technical compatibility, and quality and traceability requirements. LDeepAI supports supplier evaluation and sourcing coordination based on specific project requirements.

Can LDeepAI help source components from these companies?

Yes. LDeepAI supports semiconductor sourcing, supplier evaluation and alternative component assessment through China's electronic component supply network.