43 published Memory & Storage part numbers
Browse memory and storage part pages, including DRAM, SRAM, NAND Flash, NOR Flash, eMMC, UFS, DDR and LPDDR components. Buyers can review part numbers by product type, open detail pages, and submit RFQ requests for sourcing support.
Browse Memory & Storage Types
Published part pages are grouped by product type so buyers can review matching models without a single oversized table.
DRAM
Browse DRAM part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| 9400_NVMe_Enterprise_SSD | Micron | U.3/U.2 2.5-inch, 15mm; 100.45 x 70.10 x 15.00 mm | View DetailsRFQ |
| AT24C256 | Atmel | 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, 8-lead SAP, 8-ball dBGA2 | View DetailsRFQ |
| K4B4G1646E | SAMSUNG | 96-ball FBGA, lead-free and halogen-free; dimensions not shown in provided excerpt | View DetailsRFQ |
| K4F6E3S4HM-TF(H)CL | Samsung | 200FBGA, 10 x 15 | View DetailsRFQ |
| Kioxia_BiCS_Industrial | Kioxia | 132-BGA Package | View DetailsRFQ |
| Kioxia_CM6_ProductBrief | Kioxia | 2.5-inch, 15 mm Z-height; 15.0 mm +0/-0.5 mm thickness, 69.85 mm ±0.25 mm width, 100.45 mm max length | View DetailsRFQ |
| Kioxia_eMMC_ProductBrief | Kioxia | 153-ball BGA; 11.5 x 13 mm standard package, 11 x 10 mm 4GB package option; listed packages include 11 x 10 x 0.8 mm, 11.5 x 13 x 0.8 mm, 11.5 x 13 x 1.0 mm, 11.5 x 13 x 1.2 mm | View DetailsRFQ |
| Kioxia_TH58_BiCS_Datasheet | Kioxia | WSON8, P-WSON8-0608-1.27-003 | View DetailsRFQ |
| KLMAG1JETD-B041 | SAMSUNG | 153FBGA, 11.5 mm x 13 mm x 0.8 mm | View DetailsRFQ |
| KLMAG1JETD-B041 | Samsung | 153FBGA, 11.5 mm x 13 mm x 0.8 mm | View DetailsRFQ |
| M321R4GA3BB6_DDR5-RDIMM | SAMSUNG | 288-pin DIMM | View DetailsRFQ |
| M321R8GA0BB0_DDR5-LRDIMM | Samsung | 288-pin Registered DIMM; DDR5 SDRAM components in 82FBGA; module height 31.25 mm ±0.15 mm | View DetailsRFQ |
| Micron_3D_NAND_Flyer | Micron | Die, BGA, TSOP; MLC TSOP 48-pin SDP/DDP; BGA132 SDP/DDP/QDP/8DP/16DP; TLC BGA132 SDP/DDP/3DP/QDP/8DP/16DP | View DetailsRFQ |
| Micron_9400_TechBrief | Micron | Not specified | View DetailsRFQ |
| Samsung_eMMC_Brochure | Samsung | FBGA QDP / BGA package; listed sizes include 11x10x0.8 mm, 11.5x13x0.8 mm, 11.5x13x1.0 mm, 11.5x13x1.2 mm, 11.5x13x1.4 mm | View DetailsRFQ |
| Samsung_eMMC_Brochure | Samsung | FBGA QDP / BGA package; listed package sizes include 11.5x13x0.8 mm, 11.5x13x1.0 mm, 11.5x13x1.2 mm, 11.5x13x1.4 mm, and 11x10x0.8 mm | View DetailsRFQ |
| Samsung_eMMC_FullDatasheet | Samsung | 153FBGA, 11.5 mm x 13 mm x 0.8 mm for 8GB/16GB/32GB; 11.5 mm x 13 mm x 1.0 mm for 64GB | View DetailsRFQ |
| Samsung_eMMC_FullDatasheet | Samsung | 153FBGA, 11.5 mm x 13 mm x 0.8 mm for 8GB/16GB/32GB; 11.5 mm x 13 mm x 1.0 mm for 64GB | View DetailsRFQ |
Digital temperature sensor
Browse Digital temperature sensor part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| TMP75 | Texas Instruments | 8-pin SOIC 4.90 mm × 3.91 mm; 8-pin VSSOP 3.00 mm × 3.00 mm | View DetailsRFQ |
| TMP114 | Texas Instruments | 4-pin PicoStar (DSBGA/YMT), 0.76 mm × 0.76 mm, 0.15 mm height | View DetailsRFQ |
| TMP116 | Texas Instruments | DRV WSON-6, 2.00 mm x 2.00 mm | View DetailsRFQ |
| TMP117 | Texas Instruments | WSON (6) 2.00 mm × 2.00 mm; DSBGA (6) 1.53 mm × 1.00 mm | View DetailsRFQ |
| TMP119 | Texas Instruments | YBG, 6-pin DSBGA, 0.95 mm × 1.488 mm | View DetailsRFQ |
| TMP275 | Texas Instruments | SOIC-8, 4.90 mm x 3.91 mm; VSSOP-8, 3.00 mm x 3.00 mm | View DetailsRFQ |
| TMP1075 | Texas Instruments | SOIC-8 (D) 4.90 mm x 6.00 mm; VSSOP-8 (DGK) 3.00 mm x 4.90 mm; WSON-8 (DSG) 2.00 mm x 2.00 mm; SOT563-6 (DRL/TMP1075N) 1.60 mm x 1.60 mm | View DetailsRFQ |
Serial EEPROM
Browse Serial EEPROM part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| 24LC256 | Microchip | 8-lead PDIP, SOIC, SOIJ, DFN, TDFN, TSSOP, MSOP; CS package also shown for 24AA256 only | View DetailsRFQ |
| 24LC512 | Microchip | 8-lead PDIP, SOIJ, SOIC, TSSOP, DFN; 14-lead TSSOP | View DetailsRFQ |
| 25LC1024 | Microchip Technology | 8-lead PDIP (P), 8-lead SOIJ (SM), 8-lead DFN (MF) | View DetailsRFQ |
| AT24C64B | Atmel | 8-lead TSSOP | View DetailsRFQ |
eMMC
Browse eMMC part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| klm8g1geuf-b04p | SAMSUNG | Not specified | View DetailsRFQ |
| KLMAG1JETD-B041 | SAMSUNG | 153FBGA, 11.5 mm x 13 mm x 0.8 mm | View DetailsRFQ |
Humidity and temperature sensor
Browse Humidity and temperature sensor part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| HDC2010 | Texas Instruments | DSBGA/WLCSP 6-bump, 1.5 mm × 1.5 mm × 0.675 mm nominal | View DetailsRFQ |
| HDC2080 | Texas Instruments | WSON (DMB), 6-pin, 3.00 mm × 3.00 mm body | View DetailsRFQ |
NOR Flash
Browse NOR Flash part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| AT24C256_AT24C512 | ATMEL | 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead MAP, 8-lead TSSOP, 8-lead SAP, 8-ball dBGA2; dimensions not provided in supplied text | View DetailsRFQ |
| W25Q128JV-Winbond | Winbond | 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 8-pad WSON 6x5 mm, 8-pad WSON 8x6 mm, 24-ball TFBGA 8x6 mm, 24-ball WLCSP | View DetailsRFQ |
DDR4 SDRAM
Browse DDR4 SDRAM part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| H5AG36EXNDX017N_SKhynix | SK hynix | 96ball FBGA; dimensions not provided in supplied pages | View DetailsRFQ |
EEPROM
Browse EEPROM part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| AT24C08N | ATMEL | 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3, 5-lead SOT23, 8-lead TSSOP, 8-ball dBGA2 | View DetailsRFQ |
Enterprise SSD
Browse Enterprise SSD part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| Micron 9400 Series | Micron | U.3/U.2 2.5-inch, 15 mm, SFF-8639; 100.45 x 70.10 x 15.00 mm; mass <235 g | View DetailsRFQ |
iNAND Embedded Flash Drive eMMC 5.1 HS400
Browse iNAND Embedded Flash Drive eMMC 5.1 HS400 part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| SDINBDG4-64G-XI | SanDisk | 11.5x13x1.2 mm | View DetailsRFQ |
Infrared thermopile temperature sensor
Browse Infrared thermopile temperature sensor part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| TMP006 | Texas Instruments | 8-pin DSBGA (YZF), 1.60 mm x 1.60 mm x 0.625 mm | View DetailsRFQ |
LPDDR4
Browse LPDDR4 part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| K4F6E3S4HB-KHCL02V | SAMSUNG | 200FBGA, 10 x 15 | View DetailsRFQ |
Memory Module
Browse Memory Module part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| Ultrastar-HC580-HDD_WesternDigital | Western Digital | 3.5-inch data center HDD; 26.1 mm z-height; 101.6 (+/-0.25) x 147 mm; 670 g max | View DetailsRFQ |
SSD
Browse SSD part pages in the Memory & Storage category.
| Part Number | Manufacturer | Package | Action |
|---|---|---|---|
| Samsung SSD 970 EVO | Samsung | M.2 2280, max 80.15 x 22.15 x 2.38 mm | View DetailsRFQ |
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Memory & Storage Part Number Directory FAQ
What is the Memory & Storage Part Number Directory?
It is a structured directory of published Memory & Storage part pages supported by LDeepAI.
Can I request a Memory & Storage quote by part number?
Yes. Buyers can submit the part number, manufacturer, package, quantity, delivery country and application requirements for sourcing review.
Are all listed parts in stock?
No. The directory provides part information and sourcing support. Stock, sample availability, MOQ and lead time must be confirmed case by case through RFQ.
Can LDeepAI help find alternatives?
Yes. LDeepAI can help review possible alternatives based on package, function and key specifications. Final validation should be completed by the buyer's engineering and quality team.