Memory & Storage Part Number Directory

Browse memory and storage part pages, including DRAM, SRAM, NAND Flash, NOR Flash, eMMC, UFS, DDR and LPDDR components.

23 published Memory & Storage part numbers

Browse memory and storage part pages, including DRAM, SRAM, NAND Flash, NOR Flash, eMMC, UFS, DDR and LPDDR components. Buyers can review part numbers by product type, open detail pages, and submit RFQ requests for sourcing support.

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Browse Memory & Storage Types

Part numbers are grouped by product type so buyers can review matching models without a single oversized table.

Serial EEPROM

Browse Serial EEPROM part pages in the Memory & Storage category.

8 parts
Part NumberManufacturerPackageAction
24LC256Microchip8-lead PDIP, SOIC, SOIJ, DFN, TDFN, TSSOP, MSOP; CS package also shown for 24AA256 onlyDetailsRFQ
24LC512Microchip8-lead PDIP, SOIJ, SOIC, TSSOP, DFN; 14-lead TSSOPDetailsRFQ
25LC1024Microchip Technology8-lead PDIP (P), 8-lead SOIJ (SM), 8-lead DFN (MF)DetailsRFQ
AT24C08NATMEL8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP MLP 2x3, 5-lead SOT23, 8-lead TSSOP, 8-ball dBGA2DetailsRFQ
AT24C64BAtmel8-lead TSSOPDetailsRFQ
AT24C256Atmel8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, 8-lead SAP, 8-ball dBGA2DetailsRFQ
AT24C256_AT24C512ATMEL8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead MAP, 8-lead TSSOP, 8-lead SAP, 8-ball dBGA2; dimensions not provided in supplied textDetailsRFQ
LMK61E2Texas InstrumentsSIA QFM, 8-pin, 7.00 mm x 5.00 mmDetailsRFQ

DRAM

Browse DRAM part pages in the Memory & Storage category.

6 parts
Part NumberManufacturerPackageAction
9400_NVMe_Enterprise_SSDMicronU.3/U.2 2.5-inch, 15mm; 100.45 x 70.10 x 15.00 mmDetailsRFQ
K4B4G1646ESAMSUNG96-ball FBGA, lead-free and halogen-free; dimensions not shown in provided excerptDetailsRFQ
K4F6E3S4HM-TF(H)CLSamsung200FBGA, 10 x 15DetailsRFQ
Kioxia_BiCS_IndustrialKioxia132-BGA PackageDetailsRFQ
M321R4GA3BB6_DDR5-RDIMMSAMSUNG288-pin DIMMDetailsRFQ
M321R8GA0BB0_DDR5-LRDIMMSamsung288-pin Registered DIMM; DDR5 SDRAM components in 82FBGA; module height 31.25 mm ±0.15 mmDetailsRFQ

eMMC

Browse eMMC part pages in the Memory & Storage category.

2 parts
Part NumberManufacturerPackageAction
klm8g1geuf-b04pSAMSUNGNot specifiedDetailsRFQ
KLMAG1JETD-B041SAMSUNG153FBGA, 11.5 mm x 13 mm x 0.8 mmDetailsRFQ

DDR4 SDRAM

Browse DDR4 SDRAM part pages in the Memory & Storage category.

1 part
Part NumberManufacturerPackageAction
H5AG36EXNDX017N_SKhynixSK hynix96ball FBGA; dimensions not provided in supplied pagesDetailsRFQ

Enterprise SSD

Browse Enterprise SSD part pages in the Memory & Storage category.

1 part
Part NumberManufacturerPackageAction
Micron 9400 SeriesMicronU.3/U.2 2.5-inch, 15 mm, SFF-8639; 100.45 x 70.10 x 15.00 mm; mass <235 gDetailsRFQ

iNAND Embedded Flash Drive eMMC 5.1 HS400

Browse iNAND Embedded Flash Drive eMMC 5.1 HS400 part pages in the Memory & Storage category.

1 part
Part NumberManufacturerPackageAction
SDINBDG4-64G-XISanDisk11.5x13x1.2 mmDetailsRFQ

LPDDR4

Browse LPDDR4 part pages in the Memory & Storage category.

1 part
Part NumberManufacturerPackageAction
K4F6E3S4HB-KHCL02VSAMSUNG200FBGA, 10 x 15DetailsRFQ

Memory Module

Browse Memory Module part pages in the Memory & Storage category.

1 part
Part NumberManufacturerPackageAction
Ultrastar-HC580-HDD_WesternDigitalWestern Digital3.5-inch data center HDD; 26.1 mm z-height; 101.6 (+/-0.25) x 147 mm; 670 g maxDetailsRFQ

NOR Flash

Browse NOR Flash part pages in the Memory & Storage category.

1 part
Part NumberManufacturerPackageAction
W25Q128JV-WinbondWinbond8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 8-pad WSON 6x5 mm, 8-pad WSON 8x6 mm, 24-ball TFBGA 8x6 mm, 24-ball WLCSPDetailsRFQ

SSD

Browse SSD part pages in the Memory & Storage category.

1 part
Part NumberManufacturerPackageAction
Samsung SSD 970 EVOSamsungM.2 2280, max 80.15 x 22.15 x 2.38 mmDetailsRFQ

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Memory & Storage Part Number Directory FAQ

What is the Memory & Storage Part Number Directory?

It is a structured directory of published Memory & Storage part pages supported by LDeepAI.

Yes. Buyers can submit the part number, manufacturer, package, quantity, delivery country and application requirements for sourcing review.

No. The directory provides part information and sourcing support. Stock, sample availability, MOQ and lead time must be confirmed case by case through RFQ.

Yes. LDeepAI can help review possible alternatives based on package, function and key specifications. Final validation should be completed by the buyer's engineering and quality team.