Specifications
| Type | Description |
|---|---|
| Part Number | Samsung_eMMC_FullDatasheet |
| Manufacturer | Samsung |
| Product Type | DRAM |
| Category | Memory & Storage |
| Memory Standard Compatibility | eMMC 5.1; condition: MMC protocol v5.1 industry standard; source page: 1 |
| Product Family | Samsung eMMC Product family; condition: KLM8G1GETF-B041, KLMAG1JETD-B041, KLMBG2JETD-B041, KLMCG4JETD-B041; source page: 1 |
| 8GB Part ID | KLM8G1GETF-B041; condition: 8 GB capacity; source page: 4 |
| 16GB Part ID | KLMAG1JETD-B041; condition: 16 GB capacity; source page: 4 |
| 32GB Part ID | KLMBG2JETD-B041; condition: 32 GB capacity; source page: 4 |
| 64GB Part ID | KLMCG4JETD-B041; condition: 64 GB capacity; source page: 4 |
| 8GB NAND Flash Type | 64Gb x 1; condition: KLM8G1GETF-B041; source page: 4 |
| 16GB NAND Flash Type | 128Gb x 1; condition: KLMAG1JETD-B041; source page: 4 |
| 32GB NAND Flash Type | 128Gb x 2; condition: KLMBG2JETD-B041; source page: 4 |
| 64GB NAND Flash Type | 128Gb x 4; condition: KLMCG4JETD-B041; source page: 4 |
| User Density | 91.0%; condition: Product list; source page: 4 |
| Interface Power Voltage | 1.70-1.95 V or 2.7-3.6 V; condition: VDD / VCCQ; source page: 4 |
| Memory Power Voltage | 2.7-3.6 V; condition: VDDF / VCC; source page: 4 |
| Pin Configuration | 153FBGA; condition: all listed capacities; source page: 4 |
| Package Size | 11.5 mm x 13 mm x 0.8 mm; condition: 8GB, 16GB, and 32GB products; source page: 4 |
| Package Size | 11.5 mm x 13 mm x 1.0 mm; condition: 64GB product; source page: 4 |
| Supported Data Bus Width | 1-bit default, 4-bit, 8-bit; condition: MMC interface; source page: 4 |
| MMC Interface Clock Frequency | 0-200 MHz; condition: MMC I/F; source page: 4 |
| MMC Boot Frequency | 0-52 MHz; condition: MMC I/F boot; source page: 4 |
| Operating Temperature | -25°C to 85°C; condition: operation; source page: 4 |
| Storage Temperature | -40°C to 85°C; condition: storage without operation; source page: 4 |
| High Speed Mode | HS400 supported; condition: sequential bandwidth improvement, especially sequential read performance; source page: 4 |
| Supported eMMC 5.1 Features | Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update; condition: JEDEC eMMC 5.1 features; source page: 4 |
| Unsupported Feature | Large Sector Size (4KB); condition: eMMC 5.1 feature list; source page: 4 |
| Backward Compatibility | Full backward compatibility with previous MultiMediaCard system specification; condition: 1-bit data bus and multi-eMMC systems; source page: 4 |
| Flash Management Functions | Wear Leveling, Bad Block Management, ECC; condition: Embedded FTL / Flash Transition Layer; source page: 4 |
| Data Strobe Pin Function | Generated from eMMC to host; condition: HS400 mode; read data and CRC response synchronized with Data Strobe; source page: 5 |
| CMD Signal Function | Bidirectional signal for device initialization and command transfers; condition: open-drain for initialization, push-pull for fast command transfer; source page: 5 |
| DAT0-DAT7 Signal Function | Bidirectional data channels; condition: push-pull mode; source page: 5 |
| Reset Pin | RST_n; condition: hardware reset signal pin; source page: 5 |
| Datasheet Status | request_only |
Product Overview
Samsung_eMMC_FullDatasheet covers the Samsung eMMC Product family for MMC protocol v5.1 industry-standard storage. Listed part IDs include KLM8G1GETF-B041 for 8 GB, KLMAG1JETD-B041 for 16 GB, KLMBG2JETD-B041 for 32 GB, and KLMCG4JETD-B041 for 64 GB. NAND configurations are 64Gb x 1, 128Gb x 1, 128Gb x 2, and 128Gb x 4 respectively, with a listed user density of 91.0%.
The devices use a 153FBGA pin configuration. Package dimensions are 11.5 mm x 13 mm x 0.8 mm for 8GB, 16GB, and 32GB products, and 11.5 mm x 13 mm x 1.0 mm for the 64GB product. Electrical ranges include 1.70-1.95 V or 2.7-3.6 V interface power and 2.7-3.6 V memory power.
The MMC interface supports 1-bit default, 4-bit, and 8-bit bus widths, 0-200 MHz interface clock frequency, and 0-52 MHz boot frequency. Supported features include HS200, HS400, command queuing, cache, discard, sanitize, enhanced strobe mode, secure write protection, field firmware update, and embedded flash management functions such as wear leveling, bad block management, and ECC.
Key Features
- Compliant with MMC protocol v5.1 industry standard
- 153FBGA package across all listed capacities
- 8GB, 16GB, 32GB, and 64GB part IDs
- Supports 1-bit default, 4-bit, and 8-bit buses
- MMC interface clock range from 0 to 200 MHz
- Boot operation clock range from 0 to 52 MHz
- HS400 mode supported for sequential bandwidth improvement
- Interface power supports 1.70-1.95 V or 2.7-3.6 V
- Embedded FTL includes wear leveling, bad block management, ECC
- RST_n hardware reset signal pin included
Typical Applications
- eMMC 5.1 host storage designs
- MMC interface memory systems
- 1-bit data bus systems
- 4-bit data bus systems
- 8-bit data bus systems
- HS400 read data interfaces
- Multi-eMMC system designs
- Embedded boot storage interfaces
Procurement Notes
When requesting a quote for Samsung_eMMC_FullDatasheet, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
Which eMMC standard does Samsung_eMMC_FullDatasheet describe?
Samsung_eMMC_FullDatasheet describes Samsung eMMC 5.1 storage compatible with the MMC protocol v5.1 industry standard. The extracted feature list includes HS200, HS400, command queuing, cache, discard, sanitize, and field firmware update support.
What package is used for the listed Samsung eMMC products?
All listed capacities use a 153FBGA pin configuration. The 8GB, 16GB, and 32GB products use an 11.5 mm x 13 mm x 0.8 mm package, while the 64GB product uses an 11.5 mm x 13 mm x 1.0 mm package.
What MMC bus widths and clock ranges are supported?
The MMC interface supports 1-bit default, 4-bit, and 8-bit data bus widths. The interface clock frequency range is 0-200 MHz, and the MMC boot frequency range is 0-52 MHz.
Which flash management functions are listed in the datasheet facts?
The embedded Flash Transition Layer lists wear leveling, bad block management, and ECC. These functions are identified as flash management functions in the extracted datasheet facts.
Is Large Sector Size supported by this eMMC 5.1 family?
Large Sector Size, identified as 4KB, is listed as an unsupported feature in the extracted eMMC 5.1 feature list. Other listed supported features include cache, discard, sanitize, HS200, HS400, and command queuing.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.