Samsung_eMMC_Brochure eMMC NAND Flash Storage

Samsung Memory & Storage — specifications, applications, sourcing support and RFQ.

Samsung_eMMC_Brochure eMMC NAND Flash Storage

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
Samsung_eMMC_Brochure
Manufacturer
Samsung
Package
FBGA QDP / BGA package; listed sizes include 11x10x0.8 mm, 11.5x13x0.8 mm, 11.5x13x1.0 mm, 11.5x13x1.2 mm, 11.5x13x1.4 mm
Category
Memory & Storage
Product Type
DRAM

Quick Sourcing Note

Samsung_eMMC_Brochure from Samsung is a Memory & Storage product covering Samsung eMMC NAND Flash storage. The family is described as a managed NAND Flash memory solution with an intelligent MMC controller integrated with high-density NAND in a BGA package. Listed package formats include FBGA QDP / BGA sizes from 11x10x0.8 mm to 11.5x13x1.4 mm. The solution range covers 4 GB to 128 GB, with 4 GB, 8 GB, 16 GB, 32 GB, 64 GB, and 128 GB options. Supported applications include mobile applications, tablets, smartphones, GPS systems, e-readers, and portable media players. Interface data includes JEDEC eMMC support, eMMC 5.0 backward compatibility, and bandwidths up to 400 MB/s.

Specifications

TypeDescription
Part NumberSamsung_eMMC_Brochure
ManufacturerSamsung
Product TypeDRAM
CategoryMemory & Storage
Package / CaseFBGA QDP / BGA package; listed sizes include 11x10x0.8 mm, 11.5x13x0.8 mm, 11.5x13x1.0 mm, 11.5x13x1.2 mm, 11.5x13x1.4 mm
Memory technologyManaged NAND Flash memory solution
Supported applicationsMobile applications, tablets, smartphones, GPS systems, e-readers, portable media players
Density range4 GB to 128 GB
Available density options4 GB, 8 GB, 16 GB, 32 GB, 64 GB, 128 GB
NAND cell types2-bit MLC, 3-bit MLC, TLC
ControllerIntelligent MMC controller
Interface standardJEDEC eMMC mature standardized interface
Backward compatibilityeMMC 5.0 is backward compatible with eMMC 4.41 and eMMC 4.5
eMMC 4.3 interface bandwidth52 MB/s
eMMC 4.41 interface bandwidth104 MB/s
eMMC 4.5 interface bandwidth200 MB/s
eMMC 5.0 interface bandwidth400 MB/s
eMMC 4.5 clock frequency200 MHz
eMMC 5.0 clock frequency200 MHz
eMMC 4.5 data rate modeHS200, SDR
eMMC 5.0 data rate modeHS400, DDR
Bus widthx4 / x8
Hardware resetYes
Multi-partition supportYes
Enhanced modeSLC + MLC
Alternative bootYes
Security featuresTrim, RPMB, Secure Erase, Secure Trim
Secure Trim RefinementYes
High Priority InterruptYes
Background OperationYes
Packed CommandYes
Cache HandlingYes
DiscardYes
Dynamic CapacityYes
SanitizeYes
Smart ReportVendor Specific for eMMC 4.5; Yes-standardized for eMMC 5.0
Firmware updateN/A for eMMC 4.5; Yes-standardized for eMMC 5.0
Operating voltage levels4.41, 4.5, 5.0 voltage levels
Performance test conditionBus width x8, cache on, 512 KB data transfer, device full without file system overhead
Part KLM4G1YEMD-C031 density4 GB
Part KLM4G1YEMD-C031 performanceSequential read/write 100/6 MB/s; random read/write 2500/200 IOPS; MMC class 200
Part KLM4G1YEMD-C031 package11.5x13x0.8 mm
Part KLM8G1WEMB-B031 density8 GB
Part KLM8G1WEMB-B031 performanceSequential read/write 100/6 MB/s; random read/write 2500/200 IOPS; MMC class 200
Part KLMAG2WEMB-B031 density16 GB
Part KLMAG2WEMB-B031 performanceSequential read/write 170/11 MB/s; random read/write 4000/500 IOPS; MMC class 700
Part KLMBG4WEBC-B031 density32 GB
Part KLMBG4WEBC-B031 performanceSequential read/write 200/50 MB/s; random read/write 4000/1500 IOPS; MMC class 1500
Part KLMCG8WEBC-B031 density64 GB
Part KLMCG8WEBC-B031 performanceSequential read/write 200/50 MB/s; random read/write 4000/1500 IOPS; MMC class 1500
Part KLM4G1FEAC-B031 density4 GB
Part KLM4G1FEAC-B031 performanceSequential read/write 150/10 MB/s; random read/write 4000/700 IOPS; MMC class 700
Part KLM8G1GEAC-B031 density8 GB
Part KLM8G1GEAC-B031 performanceSequential read/write 180/20 MB/s; random read/write 4000/700 IOPS; MMC class 700
Part KLMAG2GEAC-B031 density16 GB
Part KLMAG2GEAC-B031 performanceSequential read/write 240/40 MB/s; random read/write 6000/2500 IOPS; MMC class 2000
Part KLMBG4GEAC-B031 density32 GB
Part KLMBG4GEAC-B031 performanceSequential read/write 240/60 MB/s; random read/write 6000/2500 IOPS; MMC class 2000
Part KLMCG8GEAC-B031 density64 GB
Part KLMCG8GEAC-B031 performanceSequential read/write 240/60 MB/s; random read/write 6000/2500 IOPS; MMC class 2000
Part KLMDGAGEAC-B001 density128 GB
Part KLMDGAGEAC-B001 performanceSequential read/write 150/50 MB/s; random read/write 3500/2000 IOPS; MMC class 2000
Mass production statusMP
Datasheet Statusrequest_only

Product Overview

Samsung_eMMC_Brochure documents Samsung eMMC NAND Flash storage in the Memory & Storage category. The extracted data identifies the product family as a managed NAND Flash memory solution using 2-bit MLC, 3-bit MLC, and TLC NAND cell types. It integrates high-density NAND with an intelligent MMC controller in an FBGA QDP / BGA package, with listed package sizes including 11x10x0.8 mm and multiple 11.5x13 mm height variants from 0.8 mm to 1.4 mm.

The family supports 4 GB to 128 GB densities, with listed options of 4 GB, 8 GB, 16 GB, 32 GB, 64 GB, and 128 GB. Interface facts include a JEDEC eMMC mature standardized interface, eMMC 5.0 backward compatibility with eMMC 4.41 and eMMC 4.5, x4 / x8 bus width, and 200 MHz clock frequency for eMMC 4.5 and eMMC 5.0.

Performance-related facts include interface bandwidths of 52 MB/s for eMMC 4.3, 104 MB/s for eMMC 4.41, 200 MB/s for eMMC 4.5, and 400 MB/s for eMMC 5.0. Listed applications include mobile applications, tablets, smartphones, GPS systems, e-readers, and portable media players.

Key Features

  • Managed NAND Flash memory solution for Samsung eMMC
  • Integrated intelligent MMC controller with high-density NAND
  • JEDEC eMMC mature standardized interface support
  • eMMC 5.0 backward compatible with eMMC 4.41 and 4.5
  • Density options from 4 GB through 128 GB
  • Interface bandwidths from 52 MB/s to 400 MB/s
  • x4 / x8 bus width for eMMC 4.5 and 5.0
  • HS200 SDR mode for eMMC 4.5 operation
  • HS400 DDR mode for eMMC 5.0 operation
  • Trim, RPMB, Secure Erase, and Secure Trim features
  • Hardware reset, alternative boot, and multi-partition support
  • Standard and High-Performance eMMC-Pro part listings

Typical Applications

  • Mobile applications
  • Tablets
  • Smartphones
  • GPS systems
  • E-readers
  • Portable media players

Procurement Notes

When requesting a quote for Samsung_eMMC_Brochure, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.

FAQ

What memory technology is described for Samsung_eMMC_Brochure?

Samsung_eMMC_Brochure describes a Samsung eMMC product family using a managed NAND Flash memory solution. The extracted facts also list 2-bit MLC, 3-bit MLC, and TLC NAND cell types.

What density range is listed for this Samsung eMMC family?

The Samsung eMMC solution range is listed from 4 GB to 128 GB. Available density options include 4 GB, 8 GB, 16 GB, 32 GB, 64 GB, and 128 GB.

Which eMMC interface bandwidths are included in the extracted facts?

The extracted interface bandwidths are 52 MB/s for eMMC 4.3, 104 MB/s for eMMC 4.41, 200 MB/s for eMMC 4.5, and 400 MB/s for eMMC 5.0.

What applications are listed for Samsung eMMC storage?

The supported applications listed in the extracted facts are mobile applications, tablets, smartphones, GPS systems, e-readers, and portable media players.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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