Specifications
| Type | Description |
|---|---|
| Part Number | Samsung_eMMC_FullDatasheet |
| Manufacturer | Samsung |
| Product Type | DRAM |
| Category | Memory & Storage |
| Package Case | 153FBGA, 11.5 mm x 13 mm x 0.8 mm for 8GB/16GB/32GB; 11.5 mm x 13 mm x 1.0 mm for 64GB |
| Interface Standard | embedded MultiMediaCard Ver. 5.1 compatible; condition: Samsung eMMC product family; source page: 4 |
| Supported Protocol | MMC protocol v5.1; condition: read/write memory operation; source page: 4 |
| Available Capacity | 8 GB; condition: Part ID KLM8G1GETF-B041; source page: 4 |
| Available Capacity | 16 GB; condition: Part ID KLMAG1JETD-B041; source page: 4 |
| Available Capacity | 32 GB; condition: Part ID KLMBG2JETD-B041; source page: 4 |
| Available Capacity | 64 GB; condition: Part ID KLMCG4JETD-B041; source page: 4 |
| NAND Flash Type | 64Gb x 1; condition: 8 GB KLM8G1GETF-B041; source page: 4 |
| NAND Flash Type | 128Gb x 1; condition: 16 GB KLMAG1JETD-B041; source page: 4 |
| NAND Flash Type | 128Gb x 2; condition: 32 GB KLMBG2JETD-B041; source page: 4 |
| NAND Flash Type | 128Gb x 4; condition: 64 GB KLMCG4JETD-B041; source page: 4 |
| User Density | 91.0%; condition: product list; source page: 4 |
| Interface Power Voltage | 1.70 V to 1.95 V or 2.7 V to 3.6 V; condition: VDD / VCCQ; source page: 4 |
| Memory Power Voltage | 2.7 V to 3.6 V; condition: VDDF / VCC; source page: 4 |
| Package Pin Count | 153 balls; condition: 153FBGA package; source page: 4 |
| Package Size | 11.5 mm x 13 mm x 0.8 mm; condition: 8 GB, 16 GB, and 32 GB products; source page: 4 |
| Package Size | 11.5 mm x 13 mm x 1.0 mm; condition: 64 GB product; source page: 4 |
| Data Bus Width | 1-bit default, 4-bit, and 8-bit; condition: MMC interface; source page: 4 |
| MMC Interface Clock Frequency | 0 MHz to 200 MHz; condition: normal MMC interface operation; source page: 4 |
| MMC Boot Frequency | 0 MHz to 52 MHz; condition: boot operation; source page: 4 |
| Operating Temperature | -25°C to 85°C; condition: device operation; source page: 4 |
| Storage Temperature | -40°C to 85°C; condition: storage without operation; source page: 4 |
| High-Speed Mode Support | HS400 supported; condition: sequential bandwidth improvement, especially read performance; source page: 4 |
| Supported Features | Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update; condition: eMMC 5.1 JEDEC-defined features; source page: 4 |
| Unsupported Feature | Large Sector Size, 4KB; condition: eMMC 5.1 feature support list; source page: 4 |
| Backward Compatibility | Previous MultiMediaCard system specification supported; condition: includes 1-bit data bus and multi-eMMC systems; source page: 4 |
| Flash Management | Wear leveling, bad block management, and ECC; condition: embedded flash management software / FTL; source page: 4 |
| Data Strobe Pin Function | Generated from eMMC to host; read data and CRC response synchronized with Data Strobe; condition: HS400 mode; source page: 5 |
| Command Signal Function | Bidirectional command and initialization signal; condition: CMD pin; open-drain for initialization and push-pull for fast command transfer; source page: 5 |
| Data Signal Function | DAT0-DAT7 bidirectional data channels operating in push-pull mode; condition: data bus pins; source page: 5 |
| Hardware Reset Pin | RST_n; condition: hardware reset signal pin; source page: 5 |
| Datasheet Status | request_only |
Product Overview
Samsung_eMMC_FullDatasheet is a Samsung eMMC 5.1 flash storage product family in the Memory & Storage category. It is compatible with embedded MultiMediaCard Ver. 5.1 and uses MMC protocol v5.1 for read and write memory operation. The family includes 8 GB, 16 GB, 32 GB, and 64 GB capacity options with NAND flash configurations from 64Gb x 1 through 128Gb x 4 and a listed user density of 91.0%.
The package is a 153-ball FBGA. The 8 GB, 16 GB, and 32 GB products use an 11.5 mm x 13 mm x 0.8 mm package size, while the 64 GB product uses an 11.5 mm x 13 mm x 1.0 mm package size. Interface power voltage is specified as 1.70 V to 1.95 V or 2.7 V to 3.6 V, and memory power voltage is 2.7 V to 3.6 V.
The MMC interface supports 1-bit default, 4-bit, and 8-bit data bus widths, 0 MHz to 200 MHz normal interface operation, and 0 MHz to 52 MHz boot operation. HS400 is supported for sequential bandwidth improvement, especially read performance. The device also includes embedded flash management functions such as wear leveling, bad block management, and ECC, with signal definitions for CMD, DAT0-DAT7, Data Strobe, and RST_n.
Key Features
- Embedded MultiMediaCard Ver. 5.1 compatible product family
- MMC protocol v5.1 read and write operation
- 8 GB, 16 GB, 32 GB, and 64 GB capacities
- 153-ball FBGA package with capacity-dependent height
- 1-bit default, 4-bit, and 8-bit MMC bus widths
- 0 MHz to 200 MHz normal MMC interface clock
- 0 MHz to 52 MHz boot operation frequency
- HS400 support for sequential bandwidth improvement
- Wear leveling, bad block management, and ECC
- CMD, DAT0-DAT7, Data Strobe, and RST_n signals
Typical Applications
- MMC v5.1 embedded storage systems
- HS400 host interface designs
- Boot storage using MMC boot frequency
- Multi-eMMC system designs
- 8-bit MMC data bus storage
- Systems requiring embedded flash management
Procurement Notes
When requesting a quote for Samsung_eMMC_FullDatasheet, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What interface standard does Samsung_eMMC_FullDatasheet support?
Samsung_eMMC_FullDatasheet is compatible with embedded MultiMediaCard Ver. 5.1 and supports MMC protocol v5.1 for read and write memory operation, according to the extracted Samsung eMMC product family facts.
What capacities are listed for this Samsung eMMC family?
The extracted product list includes 8 GB, 16 GB, 32 GB, and 64 GB capacity options. The corresponding NAND flash configurations are 64Gb x 1, 128Gb x 1, 128Gb x 2, and 128Gb x 4.
What package is used for Samsung_eMMC_FullDatasheet?
The device family uses a 153-ball FBGA package. The 8 GB, 16 GB, and 32 GB products are 11.5 mm x 13 mm x 0.8 mm, while the 64 GB product is 11.5 mm x 13 mm x 1.0 mm.
Which high-speed modes and features are supported?
The extracted facts list HS200, HS400, Enhanced Strobe Mode, Command Queuing, Cache, Packed command, Discard, Sanitize, Power Off Notification, Field Firmware Update, and other eMMC 5.1 JEDEC-defined features.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.