Kioxia_TH58_BiCS_Datasheet 1.8V Serial Interface NAND

Specifications

Product Overview

Kioxia_TH58_BiCS_Datasheet covers the KIOXIA Corporation TH58CYG3S0HRAIJ, described in the manufacturer datasheet as an 8 Gb NAND Flash memory with a 1.8 V nominal serial interface. It belongs to the Memory & Storage category and is identified as a 1.8V Serial Interface NAND device.

The package information lists WSON8 and package code P-WSON8-0608-1.27-003. Assembly planning should therefore be based on this WSON8 package case and the package code stated in the datasheet, without assuming other package, compliance, or moisture sensitivity data.

The command set includes page read commands such as Read Cell Array 13h, Read Buffer 03h or 0Bh, Read Buffer x2 3Bh, and Read Buffer x4 6Bh. Program commands include Program Load x1 02h, Program Load x4 32h, Program Execute 10h, random data load x1 84h, and random data load x4 34h or C4h.

The device also lists Block Erase D8h, Reset FFh or FEh, Write Enable 06h, Write Disable 04h, Set Feature 1Fh, Get Feature 0Fh, Protect Execute 2Ah, and Read ID 9Fh. Internal ECC supports ECC bit flip count detection, bit flip count reporting, and maximum bit flip count reporting.

Key Features

• 8 Gb NAND Flash memory density
• 1.8 V nominal serial interface
• WSON8 package, code P-WSON8-0608-1.27-003
• High Speed Mode page read support
• Internal ECC for NAND data management
• ECC bit flip count detection and reporting
• Read buffer supports x1, x2, and x4 commands
• Program load supports x1, x4, and random data
• Block erase, reset, write enable, and write disable commands
• Set Feature, Get Feature, and Read ID command support

Typical Applications

• Serial NAND flash storage designs
• 1.8 V memory interfaces
• WSON8 memory board assemblies
• High Speed Mode read operations
• Internal ECC managed storage
• Command-controlled program workflows
• Command-controlled erase workflows
• NAND designs using x1/x2/x4 reads

Procurement Notes

When requesting a quote for Kioxia_TH58_BiCS_Datasheet, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.