Kioxia_eMMC_ProductBrief e-MMC Managed Flash Memory

Specifications

Product Overview

The integrated controller performs managed flash functions including error correction, wear leveling, logical-to-physical address translation, and bad-block management. The product lineup includes 15nm 2D flash memory and BiCS FLASH 3D flash memory options, with supported densities from 4GB through 128GB. The 4GB and 8GB products are identified as 15nm 2D flash memory based.

Package information includes a 153-ball BGA format, an 11.5 x 13 mm standard package, and an 11 x 10 mm 4GB package option. Listed package dimensions include 11 x 10 x 0.8 mm, 11.5 x 13 x 0.8 mm, 11.5 x 13 x 1.0 mm, and 11.5 x 13 x 1.2 mm.

Across listed products, the maximum data rate is 400 MB/s and VCC is 2.7 to 3.6 V. VCCQ depends on flash and grade, with consumer and industrial operating-temperature ranges specified for corresponding product groups.

Key Features

• JEDEC e-MMC Version 5.0/5.1 high-speed interface
• Integrated KIOXIA e-MMC controller in single BGA package
• Parallel MultiMediaCard interface for MMC/e-MMC hosts
• Error correction, wear leveling, and bad-block management
• Logical-to-physical address translation handled by controller
• 15nm 2D flash or BiCS FLASH 3D options
• 4GB to 128GB supported density lineup
• 400 MB/s maximum data rate across listed products
• 2.7 to 3.6 V core supply voltage
• Consumer and industrial operating-temperature grades

Typical Applications

• MMC/e-MMC host memory designs
• Parallel MultiMediaCard storage interfaces
• Consumer-grade memory systems
• Industrial-grade memory systems
• Managed flash storage assemblies
• BGA-mounted embedded memory designs

Procurement Notes

When requesting a quote for Kioxia_eMMC_ProductBrief, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.