Specifications
| Type | Description |
|---|---|
| Part Number | Kioxia_BiCS_Industrial |
| Manufacturer | Kioxia |
| Product Type | DRAM |
| Category | Memory & Storage |
| Package Case | 132-BGA Package |
| Memory Technology | BiCS FLASH 3D flash memory |
| Cell Technology | 3-bit-per-cell TLC |
| Supported Cell Modes | TLC and SLC |
| Minimum Density | 512 gigabits |
| Minimum Density Equivalent | 64 gigabytes |
| Maximum Density | 4 terabits |
| Maximum Density Equivalent | 512 gigabytes |
| Available Density | 512 gigabits |
| Available Density | 1 terabit |
| Available Density | 2 terabits |
| Available Density | 4 terabits |
| Operating Temperature Range | -40°C to +85°C |
| Package | 132-BGA |
| Reliability Feature | High reliability in rugged operating conditions |
| Performance Feature | Maintains performance in rugged operating conditions |
| SLC Mode Performance | Faster read/write times than TLC mode |
| SLC Mode Endurance | Higher cell endurance than TLC mode |
| Lifecycle Support | Long lifecycle support |
| Target Application | Base stations |
| Target Application | Telecom equipment |
| Target Application | Industrial memory cards |
| Target Application | M.2 modules |
| Target Application | High reliability SSDs |
| Target Application | Small density SSDs |
| Density Identification Basis | Density of memory chip(s), not end-user usable capacity |
| Datasheet Status | request_only |
Product Overview
Kioxia_BiCS_Industrial is Kioxia industrial BiCS 3D NAND flash memory for Memory & Storage applications. The memory technology is BiCS FLASH 3D flash memory, using 3-bit-per-cell TLC as the stated cell technology while supporting both TLC and SLC cell modes.
The product density range is 512 gigabits to 4 terabits, with equivalent capacities shown as 64 gigabytes for 512 gigabits and 512 gigabytes for 4 terabits. The available density lineup includes 512 gigabits, 1 terabit, 2 terabits, and 4 terabits. Kioxia states that density refers to the density of the memory chip or chips, not end-user usable capacity.
The package line-up identifies a 132-BGA package. The device is specified for a -40°C to +85°C operating temperature range and is intended for rugged operating conditions where performance and reliability are required. SLC mode provides faster read/write times and higher cell endurance than TLC mode. Target applications include base stations, telecom equipment, industrial memory cards, M.2 modules, high reliability SSDs, and small density SSDs.
Key Features
- BiCS FLASH 3D flash memory technology
- 3-bit-per-cell TLC cell technology
- Supports TLC and SLC cell modes
- 512 gigabit to 4 terabit density range
- Available 512Gb, 1Tb, 2Tb, and 4Tb densities
- -40°C to +85°C operating temperature range
- 132-BGA package line-up
- SLC mode has faster read/write times than TLC
- SLC mode has higher cell endurance than TLC
- Long lifecycle support for industrial flash memory
Typical Applications
- Base stations
- Telecom equipment
- Industrial memory cards
- M.2 modules
- High reliability SSDs
- Small density SSDs
Procurement Notes
When requesting a quote for Kioxia_BiCS_Industrial, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What memory technology does Kioxia_BiCS_Industrial use?
Kioxia_BiCS_Industrial uses BiCS FLASH 3D flash memory. The stated cell technology is 3-bit-per-cell TLC, and the device supports both TLC and SLC cell technology modes.
What densities are available for this industrial NAND flash memory?
The available density lineup includes 512 gigabits, 1 terabit, 2 terabits, and 4 terabits. The datasheet states that product density refers to memory chip density, not end-user usable capacity.
What package and temperature range are specified?
The package line-up lists a 132-BGA package. The operating temperature range is specified as -40°C to +85°C for use across wide-temperature industrial conditions.
Which applications are listed for Kioxia_BiCS_Industrial?
Listed target applications include base stations, telecom equipment, industrial memory cards, M.2 modules, high reliability SSDs, and small density SSDs.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.