Specifications
| Type | Description |
|---|---|
| Part Number | Samsung_eMMC_Brochure |
| Manufacturer | Samsung |
| Product Type | DRAM |
| Category | Memory & Storage |
| Package / Case | FBGA QDP / BGA package; listed package sizes include 11.5x13x0.8 mm, 11.5x13x1.0 mm, 11.5x13x1.2 mm, 11.5x13x1.4 mm, and 11x10x0.8 mm |
| Memory type | Managed NAND Flash memory solution |
| Supported densities | 4 GB, 8 GB, 16 GB, 32 GB, 64 GB, 128 GB |
| NAND technology | 2-bit and 3-bit MLC NAND; TLC memory support mentioned |
| Controller integration | Intelligent MMC controller integrated with high-density NAND |
| Interface standard | JEDEC standardized eMMC interface |
| Operating voltage standards | eMMC 4.41, 4.5, and 5.0 voltage levels |
| Application examples | Tablets, smartphones, GPS systems, e-readers, advanced mobile devices and handsets |
| eMMC 4.3 interface bandwidth | 52 MB/s |
| eMMC 4.41 interface bandwidth | 104 MB/s |
| eMMC 4.5 interface bandwidth | 200 MB/s |
| eMMC 5.0 interface bandwidth | 400 MB/s |
| eMMC 4.5 clock frequency | 200 MHz |
| eMMC 5.0 clock frequency | 200 MHz |
| eMMC 4.5 data rate mode | HS200, SDR |
| eMMC 5.0 data rate mode | HS400, DDR |
| Bus width | x4 / x8 |
| Hardware reset | Yes |
| Multi-partition support | Yes |
| Enhanced mode | SLC + MLC |
| Alternative boot | Yes |
| Security features | Trim, RPMB, Secure Erase, Secure Trim |
| Secure trim refinement | Yes |
| High priority interrupt | Yes |
| Background operation | Yes |
| Packed command | Yes |
| Cache handling | Yes |
| Discard | Yes |
| Dynamic capacity | Yes |
| Sanitize | Yes |
| Smart report | Vendor Specific for eMMC 4.5; Yes-standardized for eMMC 5.0 |
| Firmware update | N/A for eMMC 4.5; Yes-standardized for eMMC 5.0 |
| Standard eMMC 4 GB part | KLM4G1YEMD-C031; 32Gb*1 Flash; MMC class 200; sequential R/W 100/6 MB/s; random R/W 2500/200 IOPS; 11.5x13x0.8 mm; MP |
| Standard eMMC 8 GB part | KLM8G1WEMB-B031; 64Gb*1 Flash; MMC class 200; sequential R/W 100/6 MB/s; random R/W 2500/200 IOPS; 11.5x13x0.8 mm; MP |
| Standard eMMC 16 GB part | KLMAG2WEMB-B031; 64Gb*2 Flash; MMC 5.0; class 700; sequential R/W 170/11 MB/s; random R/W 4000/500 IOPS; 11.5x13x0.8 mm; MP |
| Standard eMMC 32 GB part | KLMBG4WEBC-B031; 64Gb*4 Flash; class 1500; sequential R/W 200/50 MB/s; random R/W 4000/1500 IOPS; 11.5x13x1.0 mm; MP |
| Standard eMMC 64 GB part | KLMCG8WEBC-B031; 64Gb*8 Flash; class 1500; sequential R/W 200/50 MB/s; random R/W 4000/1500 IOPS; 11.5x13x1.0 mm; MP |
| High-performance eMMC-Pro 4 GB part | KLM4G1FEAC-B031; 32Gb*1 Flash; class 700; sequential R/W 150/10 MB/s; random R/W 4000/700 IOPS; 11x10x0.8 mm; MP |
| High-performance eMMC-Pro 8 GB part | KLM8G1GEAC-B031; 64Gb*1 Flash; class 700; sequential R/W 180/20 MB/s; random R/W 4000/700 IOPS; 11.5x13x1.0 mm; MP |
| High-performance eMMC-Pro 16 GB part | KLMAG2GEAC-B031; 64Gb*2 Flash; MMC 5.0; class 2000; sequential R/W 240/40 MB/s; random R/W 6000/2500 IOPS; 11.5x13x1.0 mm; MP |
| High-performance eMMC-Pro 32 GB part | KLMBG4GEAC-B031; 64Gb*4 Flash; class 2000; sequential R/W 240/60 MB/s; random R/W 6000/2500 IOPS; 11.5x13x1.0 mm; MP |
| High-performance eMMC-Pro 64 GB part | KLMCG8GEAC-B031; 64Gb*8 Flash; class 2000; sequential R/W 240/60 MB/s; random R/W 6000/2500 IOPS; 11.5x13x1.2 mm; MP |
| High-performance eMMC-Pro 128 GB part | KLMDGAGEAC-B001; 64Gb*16 Flash; MMC 4.5; class 2000; sequential R/W 150/50 MB/s; random R/W 3500/2000 IOPS; 11.5x13x1.4 mm; MP |
| Performance test conditions | Bus width x8, cache on, 512KB data transfer, device full without file system overhead |
| Backward compatibility | eMMC 5.0 is JEDEC compliant and backwards compatible with eMMC 4.41 and 4.5 |
| Datasheet Status | request_only |
Product Overview
Samsung_eMMC_Brochure covers Samsung Embedded MultiMediaCard NAND Flash devices for Memory & Storage applications. The described memory type is a managed NAND Flash memory solution, combining high-density NAND with an intelligent MMC controller in a BGA package. NAND technology includes 2-bit and 3-bit MLC NAND, with TLC memory support mentioned.
The product range supports 4 GB, 8 GB, 16 GB, 32 GB, 64 GB, and 128 GB densities. Package information includes FBGA QDP / BGA formats with listed sizes of 11.5x13x0.8 mm, 11.5x13x1.0 mm, 11.5x13x1.2 mm, 11.5x13x1.4 mm, and 11x10x0.8 mm.
The brochure identifies a JEDEC standardized eMMC interface and eMMC 4.41, 4.5, and 5.0 voltage levels. Interface bandwidths are listed as 52 MB/s for eMMC 4.3, 104 MB/s for eMMC 4.41, 200 MB/s for eMMC 4.5, and 400 MB/s for eMMC 5.0. Target applications include tablets, smartphones, GPS systems, e-readers, advanced mobile devices, and handsets.
Key Features
- Managed NAND Flash memory solution
- Intelligent MMC controller integrated with high-density NAND
- Supports 4 GB through 128 GB densities
- JEDEC standardized eMMC interface
- 2-bit and 3-bit MLC NAND architecture
- eMMC 5.0 bandwidth listed at 400 MB/s
- eMMC 4.5 bandwidth listed at 200 MB/s
- HS200 SDR and HS400 DDR data modes
- x4 and x8 bus width support
- Trim, RPMB, Secure Erase, and Secure Trim
- Hardware reset and multi-partition support
- Backward compatible eMMC 5.0 implementation
Typical Applications
- Tablets
- Smartphones
- GPS systems
- E-readers
- Advanced mobile devices
- Handsets
Procurement Notes
When requesting a quote for Samsung_eMMC_Brochure, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What memory type is described for Samsung_eMMC_Brochure?
Samsung_eMMC_Brochure describes a managed NAND Flash memory solution. The brochure identifies the product type as Embedded MultiMediaCard NAND Flash with an intelligent MMC controller integrated with high-density NAND.
Which eMMC interface bandwidths are listed?
The brochure lists 52 MB/s for eMMC 4.3, 104 MB/s for eMMC 4.41, 200 MB/s for eMMC 4.5, and 400 MB/s for eMMC 5.0 interface bandwidth.
What applications are identified for this Samsung eMMC range?
Application examples in the extracted facts include tablets, smartphones, GPS systems, e-readers, advanced mobile devices, and handsets. These are the consumer electronics targets stated for the Samsung eMMC solution range.
What package sizes are listed in the brochure?
The package information lists FBGA QDP / BGA packaging with sizes including 11.5x13x0.8 mm, 11.5x13x1.0 mm, 11.5x13x1.2 mm, 11.5x13x1.4 mm, and 11x10x0.8 mm.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.