Specifications
| Type | Description |
|---|---|
| Part Number | SDINBDG4-64G-XI |
| Manufacturer | SanDisk |
| Product Type | iNAND Embedded Flash Drive |
| Memory Capacity | 64GB |
| Interface | eMMC 5.1 HS400 |
| Operating Temperature | -40°C to 85°C |
| Sequential Read Speed | 300MB/s |
| Sequential Write Speed | 150MB/s |
| Random Read IOPS | 25K |
| Random Write IOPS | 15K |
| Package Dimensions | 11.5 x 13 x 1.2 mm |
| Product Family | Industrial XT |
| Datasheet Status | request_only |
Product Overview
The SDINBDG4-64G-XI belongs to the SanDisk Industrial XT iNAND embedded flash drive product family. It integrates managed NAND flash storage and controller functionality within a compact BGA package intended for embedded system integration.
The device supports the eMMC 5.1 HS400 interface, enabling high-speed data transfer performance for boot storage, application storage, logging, firmware execution, and edge data buffering applications. Its industrial extended-temperature rating of -40°C to 85°C supports deployment in harsh environmental conditions commonly found in industrial electronics and outdoor systems.
The component is optimized for SMT-compatible embedded hardware platforms and can be integrated into industrial controllers, HMI systems, embedded Linux platforms, telecom infrastructure, gateway devices, and edge AI systems requiring compact non-volatile storage.
Key Features
- eMMC 5.1 HS400 high-speed interface
- 64GB managed NAND embedded storage
- Industrial extended-temperature support from -40°C to 85°C
- Sequential read performance up to 300MB/s
- Sequential write performance up to 150MB/s
- Random read/write performance up to 25K/15K IOPS
- Compact BGA package for embedded system integration
- Suitable for automated SMT assembly processes
- Integrated flash management architecture
- Designed for industrial and edge computing applications
Typical Applications
- Industrial automation systems
- Embedded Linux platforms
- Industrial gateways
- Edge computing devices
- Networking equipment
- Human-machine interface (HMI) systems
- Smart factory controllers
- Data logging systems
- Telecom infrastructure
- Connected embedded devices
Procurement Notes
When requesting a quote for SDINBDG4-64G-XI, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
Alternatives
SanDisk
SDINBDG4-32G-XI1
Lower capacity Industrial XT variant
SanDisk
SDINBDG4-16G-XI1
16GB Industrial XT option
SanDisk
SDINBDG4-64G-I1
Industrial temperature variant (-25°C to 85°C)
SanDisk
SDINBDG4-64G-XA
Automotive XT variant
SanDisk
SDINADF4-64G
OEM/Commercial 64GB variant
Application Verification Recommended
FAQ
What interface does the SDINBDG4-64G-XI support?
The device supports the eMMC 5.1 HS400 interface for high-speed embedded storage applications.
What operating temperature range is supported?
The SDINBDG4-64G-XI is specified for operation from -40°C to 85°C, making it suitable for industrial extended-temperature environments.
Is this device suitable for industrial embedded Linux systems?
Yes. The combination of eMMC 5.1 HS400 support, managed NAND architecture, and industrial temperature capability makes it suitable for embedded Linux platforms and industrial computing systems.
Can this component be used in SMT manufacturing processes?
The device is supplied in a compact BGA package intended for embedded PCB assembly and automated SMT manufacturing workflows.
What should be considered when sourcing industrial eMMC devices?
Procurement teams should verify lifecycle status, firmware consistency, temperature grade, qualification requirements, and long-term availability before deployment in industrial production programs.
Are automotive and industrial variants interchangeable?
Not always. Automotive variants may include different qualification standards, operating temperature specifications, and validation requirements compared with industrial versions.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.