SanDisk SDINBDG4-64G-XI iNAND Embedded Flash Drive 64GB eMMC 5.1 HS400

SanDisk Embedded Flash Memory — specifications, applications, sourcing support and RFQ.

SanDisk SDINBDG4-64G-XI iNAND Embedded Flash Drive 64GB eMMC 5.1 HS400

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
SDINBDG4-64G-XI
Manufacturer
SanDisk
Package
11.5x13x1.2 mm
Category
Memory
Product Type
iNAND Embedded Flash Drive eMMC 5.1 HS400

Specifications

TypeDescription
Part NumberSDINBDG4-64G-XI
ManufacturerSanDisk
Product TypeiNAND Embedded Flash Drive
Memory Capacity64GB
InterfaceeMMC 5.1 HS400
Operating Temperature-40°C to 85°C
Sequential Read Speed300MB/s
Sequential Write Speed150MB/s
Random Read IOPS25K
Random Write IOPS15K
Package Dimensions11.5 x 13 x 1.2 mm
Product FamilyIndustrial XT
Datasheet Statusrequest_only

Product Overview

The SDINBDG4-64G-XI belongs to the SanDisk Industrial XT iNAND embedded flash drive product family. It integrates managed NAND flash storage and controller functionality within a compact BGA package intended for embedded system integration.

The device supports the eMMC 5.1 HS400 interface, enabling high-speed data transfer performance for boot storage, application storage, logging, firmware execution, and edge data buffering applications. Its industrial extended-temperature rating of -40°C to 85°C supports deployment in harsh environmental conditions commonly found in industrial electronics and outdoor systems.

The component is optimized for SMT-compatible embedded hardware platforms and can be integrated into industrial controllers, HMI systems, embedded Linux platforms, telecom infrastructure, gateway devices, and edge AI systems requiring compact non-volatile storage.

Key Features

  • eMMC 5.1 HS400 high-speed interface
  • 64GB managed NAND embedded storage
  • Industrial extended-temperature support from -40°C to 85°C
  • Sequential read performance up to 300MB/s
  • Sequential write performance up to 150MB/s
  • Random read/write performance up to 25K/15K IOPS
  • Compact BGA package for embedded system integration
  • Suitable for automated SMT assembly processes
  • Integrated flash management architecture
  • Designed for industrial and edge computing applications

Typical Applications

  • Industrial automation systems
  • Embedded Linux platforms
  • Industrial gateways
  • Edge computing devices
  • Networking equipment
  • Human-machine interface (HMI) systems
  • Smart factory controllers
  • Data logging systems
  • Telecom infrastructure
  • Connected embedded devices

Alternatives

SanDisk

SDINBDG4-32G-XI1

Lower capacity Industrial XT variant

SanDisk

SDINBDG4-16G-XI1

16GB Industrial XT option

SanDisk

SDINBDG4-64G-I1

Industrial temperature variant (-25°C to 85°C)

SanDisk

SDINBDG4-64G-XA

Automotive XT variant

SanDisk

SDINADF4-64G

OEM/Commercial 64GB variant

Application Verification Recommended

FAQ

What interface does the SDINBDG4-64G-XI support?

The device supports the eMMC 5.1 HS400 interface for high-speed embedded storage applications.

What operating temperature range is supported?

The SDINBDG4-64G-XI is specified for operation from -40°C to 85°C, making it suitable for industrial extended-temperature environments.

Is this device suitable for industrial embedded Linux systems?

Yes. The combination of eMMC 5.1 HS400 support, managed NAND architecture, and industrial temperature capability makes it suitable for embedded Linux platforms and industrial computing systems.

Can this component be used in SMT manufacturing processes?

The device is supplied in a compact BGA package intended for embedded PCB assembly and automated SMT manufacturing workflows.

What should be considered when sourcing industrial eMMC devices?

Procurement teams should verify lifecycle status, firmware consistency, temperature grade, qualification requirements, and long-term availability before deployment in industrial production programs.

Are automotive and industrial variants interchangeable?

Not always. Automotive variants may include different qualification standards, operating temperature specifications, and validation requirements compared with industrial versions.

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