KLMAG1JETD-B041 eMMC 5.1 Flash Memory

SAMSUNG eMMC 5.1 Flash Memory — specifications, applications, sourcing support and RFQ.

KLMAG1JETD-B041 eMMC 5.1 Flash Memory

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
KLMAG1JETD-B041
Manufacturer
SAMSUNG
Package
153FBGA, 11.5 mm x 13 mm x 0.8 mm
Category
Memory & Storage
Product Type
eMMC

Quick Sourcing Note

KLMAG1JETD-B041 from Samsung Electronics is a 16 GB Embedded MultiMediaCard memory component compatible with eMMC 5.1 and MMC protocol v5.1. It uses a 153FBGA package measuring 11.5 mm x 13 mm x 0.8 mm and supports 1-bit default, 4-bit, and 8-bit data bus operation. Key electrical parameters include 1.70 V to 1.95 V or 2.7 V to 3.6 V interface supply and 2.7 V to 3.6 V memory supply. The device supports HS400, command queuing, cache, field firmware update, enhanced strobe mode, and embedded flash management functions including wear leveling, bad block management, and ECC.

Specifications

TypeDescription
Part NumberKLMAG1JETD-B041
ManufacturerSAMSUNG
Product TypeeMMC 5.1 flash memory
CategoryMemory & Storage
Package/Case153FBGA, 11.5 mm x 13 mm x 0.8 mm
Datasheet PublisherSamsung Electronics
Product CategoryEmbedded MultiMediaCard memory
Specification CompatibilityeMMC 5.1
Host ProtocolMMC protocol v5.1
Memory Capacity16 GB
NAND Flash Type128 Gb x 1
User Density91.0 %
Package153FBGA
Package Dimensions11.5 mm x 13 mm x 0.8 mm
Interface Supply Voltage1.70 V to 1.95 V or 2.7 V to 3.6 V
Memory Supply Voltage2.7 V to 3.6 V
Controller Interface Voltage1.8 V or 3 V dual supply supported
Data Bus Width1-bit default, 4-bit, 8-bit
MMC Interface Clock Frequency0 MHz to 200 MHz
MMC Boot Frequency0 MHz to 52 MHz
Operating Temperature Range-25 °C to 85 °C
Storage Temperature Range-40 °C to 85 °C
High Speed Mode SupportHS400 supported
Supported eMMC 5.1 FeaturesHS400, Field Firmware Update, Cache, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, Partition types
Unsupported FeatureLarge Sector Size 4 KB not supported
Backward CompatibilityCompatible with previous MultiMediaCard system specification
Flash ManagementWear Leveling, Bad Block Management, ECC
Clock PinCLK
Command PinCMD
Data PinsDAT0-DAT7
Reset PinRST_n
Data Strobe FunctionGenerated from eMMC to host
VDDi FunctionInternal power node to stabilize regulator output to controller core logics
RFU Pin GuidanceReserved for future use; do not use
Datasheet SourceManufacturer technical datasheet
Datasheet Statusrequest_only

Product Overview

KLMAG1JETD-B041 is a Samsung Electronics Embedded MultiMediaCard memory device in the eMMC 5.1 flash memory family. The part provides 16 GB capacity using 128 Gb x 1 NAND flash and is specified for MMC protocol v5.1 operation. It supports a 1-bit default bus as well as 4-bit and 8-bit data bus configurations for host connection flexibility.

The package is 153FBGA with 11.5 mm x 13 mm x 0.8 mm dimensions. Interface supply is specified as 1.70 V to 1.95 V or 2.7 V to 3.6 V, while memory supply is 2.7 V to 3.6 V. Controller interface voltage supports 1.8 V or 3 V dual supply operation.

Supported eMMC 5.1 functions include HS400, field firmware update, cache, command queuing, enhanced strobe mode, secure write protection, and partition types. Pin functions include CLK, CMD, DAT0-DAT7, RST_n, Data Strobe, VDDi, and RFU pins reserved for future use.

Key Features

  • 16 GB Embedded MultiMediaCard memory capacity
  • Compatible with eMMC 5.1 specification
  • MMC protocol v5.1 host operation
  • 153FBGA package, 11.5 mm x 13 mm x 0.8 mm
  • Supports 1-bit default, 4-bit, and 8-bit buses
  • MMC interface clock frequency from 0 MHz to 200 MHz
  • HS400 mode supported for sequential bandwidth improvement
  • Field firmware update, cache, and command queuing supported
  • Wear leveling, bad block management, and ECC included
  • Operating temperature range from -25 °C to 85 °C

Typical Applications

  • Embedded system storage
  • MMC host memory designs
  • eMMC 5.1 device integration
  • Boot and application storage
  • Compact BGA storage assemblies
  • Systems requiring managed NAND flash

Procurement Notes

When requesting a quote for KLMAG1JETD-B041, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.

FAQ

What type of memory is KLMAG1JETD-B041?

KLMAG1JETD-B041 is an Embedded MultiMediaCard memory device from Samsung Electronics. The extracted datasheet facts identify it as eMMC 5.1 flash memory with 16 GB capacity and MMC protocol v5.1 host operation.

What package is used for KLMAG1JETD-B041?

The part uses a 153FBGA package. The specified package dimensions for KLMAG1JETD-B041 are 11.5 mm x 13 mm x 0.8 mm, based on the manufacturer technical datasheet facts.

Which bus widths does this eMMC support?

The supported data bus widths are 1-bit default, 4-bit, and 8-bit. The device is also backward compatible with previous MultiMediaCard system specification use cases that include 1-bit data bus and multi-eMMC systems.

What supply voltage ranges are specified?

The interface supply voltage is 1.70 V to 1.95 V or 2.7 V to 3.6 V. The memory supply voltage is 2.7 V to 3.6 V, and the controller interface supports 1.8 V or 3 V dual supply operation.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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