Specifications
| Type | Description |
|---|---|
| Part Number | W25Q128JV-Winbond |
| Manufacturer | Winbond |
| Product Type | NOR Flash |
| Category | Memory & Storage |
| Package/Case | 8-pin SOIC 208-mil, 16-pin SOIC 300-mil, 8-pad WSON 6x5 mm, 8-pad WSON 8x6 mm, 24-ball TFBGA 8x6 mm, 24-ball WLCSP |
| Extracted Base Part Number | W25Q128JV |
| Extracted Datasheet Manufacturer | Winbond |
| Memory Density | 128 Mbit |
| Memory Type | Serial Flash memory |
| Interface | Dual/Quad SPI |
| Supply Voltage Range | 2.7 V to 3.6 V |
| Power-down Current | as low as 1 uA |
| Page Count | 65,536 programmable pages |
| Page Size | 256 bytes |
| Array Organization | 65,536 pages x 256 bytes |
| Supported SPI Modes | Standard SPI, Dual SPI, Quad SPI |
| Execution In Place Support | XIP from Dual/Quad SPI |
| Supported Applications | Code shadowing, XIP, voice/text/data storage |
| Package Option | SOIC 208-mil; package code S |
| Package Option | SOIC 300-mil; package code F |
| Package Option | WSON 6x5 mm; package code P |
| Package Option | WSON 8x6 mm; package code E |
| Package Option | TFBGA 8x6 mm, 24-ball, 5x5-1 ball array; package code B |
| Package Option | TFBGA 8x6 mm, 24-ball, 6x4 ball array; package code C |
| Package Option | WLCSP, 24-ball; package code Y |
| Grade | Industrial and Industrial Plus |
| Chip Select Pin | /CS |
| Serial Data Pins | DI, DO, IO0, IO1, IO2, IO3 |
| Write Protect Pin | /WP |
| Hold Pin | /HOLD |
| Clock Pin | CLK |
| Reset Pin | /RESET |
| Write Enable Instruction | 06h |
| Read Data Instruction | 03h |
| Fast Read Instruction | 0Bh |
| Page Program Instruction | 02h |
| Quad Input Page Program Instruction | 32h |
| Sector Erase Instruction | 20h |
| 32KB Block Erase Instruction | 52h |
| 64KB Block Erase Instruction | D8h |
| Chip Erase Instruction | C7h / 60h |
| Power-down Instruction | B9h |
| Read JEDEC ID Instruction | 9Fh |
| Reset Instructions | Enable Reset 66h, Reset Device 99h |
| Datasheet Revision | Revision F, publication release date March 27, 2018 |
| Datasheet Status | request_only |
Product Overview
W25Q128JV-Winbond is categorized as a Memory product and described in the extracted facts as a 3V 128M-bit Serial Flash memory device. The extracted datasheet facts identify the base part number as W25Q128JV and the datasheet branding/product family as Winbond, while the CMS product information supplies Texas Instruments as the manufacturer field.
The device supports Standard SPI, Dual SPI and Quad SPI instruction operation. It is organized as 65,536 programmable pages, with each page containing 256 bytes, giving an array organization of 65,536 pages x 256 bytes. Single-supply operation is specified from 2.7 V to 3.6 V, and power-down mode current is listed as low as 1 uA.
Package options include SOIC 208-mil, SOIC 300-mil, WSON 6x5 mm, WSON 8x6 mm, TFBGA 8x6 mm 24-ball options and WLCSP 24-ball. The extracted applications are code shadowing, execution in place from Dual/Quad SPI, and voice, text or data storage.
Key Features
- 128 Mbit Serial Flash memory density
- Standard SPI, Dual SPI and Quad SPI support
- 2.7 V to 3.6 V single-supply operation
- Power-down current as low as 1 uA
- 65,536 programmable pages with 256-byte page size
- XIP support from Dual and Quad SPI
- SOIC, WSON, TFBGA and WLCSP package options
- Industrial and Industrial Plus grade availability
- JEDEC ID read instruction uses 9Fh
- Reset sequence uses 66h and 99h instructions
Typical Applications
- Code shadowing
- Execution in place from Dual SPI
- Execution in place from Quad SPI
- Voice storage
- Text storage
- Data storage
- SPI memory expansion
Procurement Notes
When requesting a quote for W25Q128JV-Winbond, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For memory and storage sourcing, density, organization, speed grade, voltage, package, temperature grade, date code, lifecycle status and original packing condition should be verified before approval.
FAQ
What memory density is listed for W25Q128JV-Winbond?
The extracted facts list W25Q128JV as a 128 Mbit Serial Flash memory device. The memory array is organized as 65,536 programmable pages, with each page containing 256 bytes.
Which SPI modes does this memory device support?
The extracted instruction support lists Standard SPI, Dual SPI and Quad SPI. The facts also describe execution in place support from Dual/Quad SPI operation.
What supply voltage range is specified?
The extracted datasheet facts specify single power supply operation from 2.7 V to 3.6 V. Power-down mode current is listed as low as 1 uA.
Which package options are included in the extracted facts?
The extracted facts list SOIC 208-mil, SOIC 300-mil, WSON 6x5 mm, WSON 8x6 mm, TFBGA 8x6 mm 24-ball options and WLCSP 24-ball package options.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.