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DRV10987 — Memory & Sourcing Validation Guide

The DRV10987 from Texas Instruments is a memory device where interface compatibility, speed grade, package type, and supply chain traceability impact system ...

DRV10987 — Memory & Sourcing Validation Guide

📌 Product Overview

The DRV10987 is a three-phase, sensorless BLDC motor driver integrating power MOSFETs and a control algorithm. It is designed for cost-sensitive, low-noise fan and pump applications operating between 6.2 V and 28 V. This device eliminates the need for external sense resistors by using a 180° sinusoidal commutation scheme. The on-chip buck converter and LDO power the external microcontroller (MCU), simplifying system BOM and reducing PCB footprint. Engineers typically select this component for compact designs requiring reliable motor speed regulation without expensive position sensors.

🎯 Typical Applications & Design Context

  • 💨 Pedestal and Ceiling Fans: Low-noise operation is critical; the integrated 5 V/100 mA Buck converter allows direct interface with smart modules (IoT control).
  • 🌬️ Air Purifiers and Humidifiers: The anti-voltage surge (AVS) protection is essential for dealing with variable back-EMF during sudden decelerations or blocking conditions.
  • 💧 Drain and Water Pumps: Configurable PWM slew rate helps manage EMI in wet environments where long cables can act as antennas.
  • 🔄 Dryer Circulation Fans: The sleep/standby versions (DRV10987D/S) allow for ultra-low standby power (48 µA Sleep), meeting strict energy regulations like Energy Star.

📊 Key Technical Specifications

ParameterValue/ConditionEngineering Impact
Motor Operation Voltage6.2 V to 28 VFlexible for 12 V and 24 V bus systems; stops driving >28 V.
Drive Current2 A Continuous / 3 A PeakLimits motor selection to low-power fan/pump motors (approx. <40W output).
Total RDS(on) (H+L)250 mΩ @ 25°CDetermines thermal budget; requires thermal pad for high ambient temps.
CommutationSensorless 180° SinusoidalReduces torque ripple and acoustic noise compared to block commutation.
Regulator Outputs5 V @ 100 mA (Buck), 3.3 V @ 20 mA (LDO)Powers external sensors/MCU; verify total external load current does not exceed limits.
InterfacesI2C, SPEED (Analog/PWM), FG (TACH)Offers flexibility for closed-loop control or simple open-loop set-ups.

⚠️ Absolute Maximum Ratings & Process Limits

RatingMaximum ValueSystem Failure Risk if Exceeded
Supply Voltage (VCC)40 V (Transient)Exceeding 28 V nominal triggers protection; >40 V causes permanent oxide breakdown.
Continuous Current3 A (Peak)Continuous operation above 2 A will trip thermal shutdown, shortening MTBF.
Junction Temperature150°CPCB with poor copper dissipation will cause the device to throttle (thermal warning) or shut down during motor stalls.
ESD RatingHBM 2 kV, CDM 500 V⚠️ Supply Chain Risk: Handling in dry environments (e.g., Winter in Northern China) requires strict ESD bracelets; latent ESD damage causes "Infant Mortality" in the field.
Operating AmbientUp to 125°C (Derated)System thermal design must account for the heat generated by the integrated MOSFETs (I²R losses).

🧩 Package, Dimensions & Assembly Notes

  • Package Type: HTSSOP-24 (7.80 mm × 6.40 mm).
  • Thermal Pad: The package features an exposed thermal pad (PowerPAD) on the bottom.
  • PCB Design: You must connect this pad to the GND plane on the PCB using thermal vias. Failing to solder this pad properly is the #1 cause of premature failure due to poor heat extraction.
  • SMT Validation: Ensure the stencil aperture accounts for the paste requirements under the body. Standard reflow profiles for lead-free soldering (Pb-free) apply, but attention must be paid to wetting the large ground pad.

🔍 Procurement & Sourcing Insights

  • Supply Chain Variants: The market splits this part into DRV10987D (Sleep version, 48 µA) and DRV10987S (Standby version, 8.5 mA). Purchasing the wrong version will fail power consumption validation.
  • Availability: As a mature TI part, lead times are generally stable, but low-volume orders from non-authorized distributors carry a risk of " remarked" surface scratches on the laser markings.
  • Sourcing Tip: Verify the "D" or "S" suffix on the label tape and box. Do not rely on generic "DRV10987" descriptions in BOM tools unless the power state is irrelevant to your application.

❓ FAQ

Q: What is the difference between the Sleep (DRV10987D) and Standby (DRV10987S) versions?
A: The primary difference is supply current. The Sleep version draws only 48 µA, ideal for battery-operated or strict "vampire power" standby requirements. The Standby version draws 8.5 mA, which is faster to wake up but consumes more power. They are not pin-to-pin compatible in terms of system behavior; ensure your MCU power budget matches the procured version.

Q: Can I use this for a 24 V high-torque industrial motor?
A:No. The DRV10987 is rated for 2 A continuous drive current. High-torque motors often require 5 A+ to start or overcome load. Pushing this IC beyond 2 A continuous will trigger Overcurrent Protection (OCP) or thermal shutdown immediately.

Q: Why is the "Speed Pin" configuration critical for my PCB layout?
A: The SPEED pin accepts either an analog voltage or a PWM signal. If routed as an analog trace near the switching motor nodes (V, W, U), noise coupling will cause the motor speed to fluctuate ("hunting"). Treat this trace as a sensitive signal; keep it away from high dV/dt switching lines.

Q: Do I need to calibrate the motor manually?
A: Most likely not for simple fans. The DRV10987 uses an automatic "Initial Position Detect" algorithm to prevent back-spin. However, for high-inertia loads (like pumps with water), you may need to tune the "Spin-Up Profile" via I2C to prevent stalling at startup.


About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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