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XL-1606SYGC 1608 SMD LED: SMT Integration & Binning Data

The XINGLIGHT XL-1606SYGC is a high-brightness yellow-green 1608 (0603) SMD LED designed for automated surface-mount assembly and indicator applications. This technical brief provides electrical characteristics, absol...

XL-1606SYGC 1608 SMD LED: SMT Integration & Binning Data

📌 Product Overview

The XL-1606SYGC is a 1608 metric package (0603 imperial) Surface Mount Device (SMD) LED manufactured by XINGLIGHT. 📦 It features a high-brightness yellow-green light source with a transparent water-clear colloid, designed for low-power indication and backlighting tasks where board space is constrained.

Targeting compact consumer electronics and display modules, this component supports standard SMT production lines. 💡 With a viewing angle of 120° and a dominant wavelength of 565–575 nm, it serves as a consistent visual indicator. Engineers should prioritize this model for designs requiring RoHS-compliant components and compatibility with standard reflow soldering processes.

🔧 Typical Applications

Based on the 1.8–2.3V forward voltage and 120° viewing angle, the XL-1606SYGC is optimized for the following scenarios:

  • Electronic Display Screens: ✨ Suitable for status indicators and information panels due to high visibility and distinct yellow-green emission.
  • Mobile Digital Products: 📱 Ideal for keypad backlighting and small-area illumination given the compact 1.7 x 0.6 mm footprint.
  • Pilot Lamps & Indicators: 🚦 Effective for power status signals on PCBA (Printed Circuit Board Assembly) panels.
  • Indoor/Outdoor Lighting: 💡 Can be utilized in low-light accent lighting or array-based illumination fixtures.
  • Consumer Electronics: 📟 Provides operation feedback for appliances and handheld devices.

⚡ Key Technical Specifications

The table below outlines the electro-optical characteristics at $T_a = 25°C$. These parameters are critical for driving circuit design and color consistency.

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Luminous Intensity$I_v$5080-mcd$I_F = 20\text{mA}$
Dominant Wavelength$\lambda_d$565-575nm$I_F = 20\text{mA}$
Peak Wavelength$\lambda_p$-570-nm$I_F = 20\text{mA}$
Forward Voltage$V_F$1.8-2.3V$I_F = 20\text{mA}$
Viewing Angle$2\theta_{1/2}$-120°-deg$I_F = 20\text{mA}$
Reverse Current$I_R$--5$\mu$A$V_R = 5\text{V}$

⚠️ Note: Brightness grading codes (e.g., D1, D2) correspond to intensity ranges (50–80 mcd, 80–120 mcd), allowing for specific bin selection during procurement.

🛡️ Absolute Maximum Ratings & Process Limits

To ensure reliability and prevent catastrophic failure, design engineers must strictly adhere to these limits. Exceeding these values may result in permanent damage or reduced lifespan ($T_a = 25°C$).

ParameterSymbolValueUnitNotes
Max Power Dissipation$P_D$50mW-
Max Continuous Forward Current$I_F$20mA-
Peak Forward Current$I_{FP}$80mAPulse width $\le 0.1\text{ms}$, Duty $\le 1/10$
Max Reverse Voltage$V_R$5V-
ESD ToleranceESD2000VHuman Body Model (HBM)
Operating Temperature$T_{OPR}$-40 ~ +85$^{\circ}\text{C}$-
Storage Temperature$T_{STR}$-40 ~ +85$^{\circ}\text{C}$-
Soldering Temp/Time$T_{SOL}$260$^{\circ}\text{C}$$\le 6$ seconds (Manual)

🔒 Design Alert: Ensure current limiting resistors are calculated to prevent inrush currents from exceeding the 80mA peak rating during switching transients.

📦 Package, Dimensions & Assembly Notes

The XL-1606SYGC utilizes a standard 1608 (metric) / 0603 (imperial) footprint, making it highly compatible with modern pick-and-place machinery.

Physical Dimensions:

  • Outline: $1.7 \text{mm (L)} \times 0.6 \text{mm (W)} \times 1.1 \text{mm (H)}$
  • Packaging: EIA standard compliant tape and reel for SMT automation.

Assembly Guidelines:

  • Soldering Profile: Suitable for reflow soldering processes. 🌡️
    • Lead-Free Process: Max temp $255^{\circ}\text{C}$ (5-10s).
    • Lead Process: Max temp $235^{\circ}\text{C}$ (10-15s).
  • Moisture Sensitivity: MSL Level 3. ⚠️ Floor life is limited; if the carrier is opened for more than 168 hours, baking may be required per IPC/JEDEC standards to prevent pop-corning during reflow.

🚚 Sourcing & Supply Considerations

When integrating the XL-1606SYGC into a BOM, consider the following supply chain and technical verification factors:

  • Binning & Consistency: 🔍 Verify supply lots for consistent "Voltage Grading" (M17-9 to M18-4) and "Brightness Grading" to ensure uniform display appearance across mass production.
  • Authenticity: Source components through authorized channels to guarantee compliance with the 2000V ESD rating and ROHS environmental standards.
  • Production Scaling: Given the EIA standard packaging, this component supports rapid SMT scaling, but moisture control (MSL 3) is critical for high-volume throughput.

❓ Frequently Asked Questions

Q: What is the forward voltage drop of the XL-1606SYGC?
A: The typical forward voltage ($V_F$) ranges between 1.8V and 2.3V at a forward current of 20mA. Specific voltage bins (M17-9, M18-1, etc.) allow for tighter tolerance selection if the design requires strict voltage regulation.

Q: Is the XL-1606SYGC compatible with lead-free soldering processes?
A: Yes, the datasheet specifies parameters for both leaded and lead-free processes. For lead-free reflow, the maximum peak temperature is $255^{\circ}\text{C}$, with a time above $217^{\circ}\text{C}$ limited to 60–120 seconds.

Q: What does MSL Level 3 mean for assembly?
A: Moisture Sensitivity Level (MSL) 3 indicates the component can be exposed to a factory environment (30$^{\circ}\text{C}$ / 85% RH) for up to 168 hours before baking is required. If floor life exceeds this, the components must be baked to prevent moisture-induced damage during soldering.

Q: What is the typical luminous intensity for this LED?
A: The luminous intensity ($I_v$) is typically 80 mcd at 20mA, though it can range from 50 mcd to 120 mcd depending on the brightness grading bin (D1 or D2) selected during procurement.

Q: What are the dimensions of this LED?
A: The XL-1606SYGC corresponds to the 1608 metric size (0603 imperial). The specific outline dimensions are $1.7 \text{mm} \times 0.6 \text{mm} \times 1.1 \text{mm}$ (Length x Width x Height).

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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