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XL-1606SURC SMD LED: Thermal & Optical Specs for Indicator Design

The XINGLIGHT XL-1606SURC is a standard 1606 (0405 metric) SMD LED featuring high-brightness red emission (620nm) in a water-clear colloid. This technical brief analyzes optical consistency, forward voltage tolerances...

XL-1606SURC SMD LED: Thermal & Optical Specs for Indicator Design

📌 Product Overview

The XL-1606SURC from XINGLIGHT is a surface-mount device (SMD) LED designed for high-brightness red light emission. 💡 It utilizes a water-clear colloid to maximize luminous intensity and beam definition. With a compact footprint of 1.7 x 0.6 x 1.1 mm, this component is engineered for applications requiring dense component placement without sacrificing optical output. 👇 It serves as a robust solution for status indication and compact backlighting requirements in consumer electronics and industrial panels.

🔌 Typical Applications

Based on its 1606 package size and optical characteristics, the XL-1606SURC is ideal for:

  • Electronic Display Panels: Used as pixel elements or status indicators where high density is required.
  • Mobile Device Backlighting: Suitable for button indicators or small-area LCD illumination in smartphones and digital products.
  • Indoor/Outdoor Lighting: 🏠 Can be implemented in low-light accent lighting or guide lights.
  • Pilot Lamps & Indicators: ⚡ Provides clear visual feedback for power or function states in electrical appliances.
  • Consumer Electronics: Integrated into PCBs for signal transmission status or operational mode display.

📊 Key Technical Specifications

The XL-1606SURC is engineered to meet specific optical and electrical performance windows. Key parameters under standard test conditions (Ta=25℃) are outlined below:

ParameterSymbolMin.Typ.Max.UnitTest Conditions
Luminous IntensityIv90-210mcdIF = 20 mA
Dominant Wavelengthλd615-630nmIF = 20 mA
Forward VoltageVF1.9-2.3VIF = 20 mA
Viewing Angle2Ø1/2-120-degIF = 20 mA
Peak Wavelengthλp-625-nmIF = 20 mA

💡 Note: Binning codes (Brightness D2-D5, Voltage N11-4/5) are available to ensure batch consistency for series production.

🚨 Absolute Maximum Ratings & Process Limits

To ensure reliability and prevent catastrophic failure, designers must strictly adhere to the following absolute maximum ratings (Ta=25℃). ⚠️ Exceeding these values may cause permanent damage to the device.

ParameterSymbolValueUnitNotes
Max Power DissipationPD50mWDerate above 25℃ ambient
Max Forward CurrentIF20mAContinuous DC operation
Peak Forward CurrentIFP80mAPulse width ≤0.1ms, Duty ≤1/10
Max Reverse VoltageVR5V-
ESD SusceptibilityESD2000VHuman Body Model (HBM)
Operating TemperatureTOPR-40 ~ +85-
Storage TemperatureTSTR-40 ~ +85-

🔒 Thermal Warning: Soldering temperature must not exceed 260°C for longer than 6 seconds (Manual) or follow specific reflow profiles.

📦 Package, Dimensions & Assembly Notes

  • Package Type: 1606 (Imperial: 0605, Metric: 0405 approximation).
  • Dimensions (L x W x H): 1.7 x 0.6 x 1.1 mm.
  • Packaging Standard: EIA standard compliant, designed for automated pick-and-place machines.
  • Soldering Compatibility: 💡 Suitable for both Reflow Soldering and manual soldering processes.
    • Reflow Profile: Designed for standard leaded or lead-free profiles (Peak 235°C for leaded, 255°C for lead-free).
    • MSL Level: 3 (Floor life: 168 hours at 30°C / 60% RH).
    • Moisture Sensitivity: Baking is required if opened and exposed beyond MSL limits before reflow.

🚀 Sourcing & Supply Considerations

When integrating the XL-1606SURC into BOMs, consider the following supply chain factors:

  • Binning Management: Verify with the supplier if specific voltage (N11) and brightness (D2-D5) binning are required for your optical design to ensure uniformity.
  • MSL Handling: Ensure the supply chain maintains proper dry storage; check for "vacuum-sealed" integrity upon receipt to prevent moisture-induced popcorning during reflow.
  • Authenticity: Cross-reference the part number and manufacturer branding to avoid off-spec components that may not meet the ROHS or optical consistency requirements.
  • Procurement: 📈 For mass production, coordinate lead times based on specific colloid transparency (water clear) specifications.

❓ FAQ

Q: What is the MSL level of the XL-1606SURC and how does it affect storage?
A: The XL-1606SURC has a Moisture Sensitivity Level (MSL) of 3. This means the components can be exposed to a factory environment (30°C / 60% RH) for up to 168 hours after the vacuum seal is opened before they must be baked or reflowed to prevent internal damage.

Q: Can this LED be used in outdoor environments?
A: While the datasheet lists "Indoor and outdoor lighting" as an application, the device itself is rated for an operating temperature of -40°C to +85°C. For outdoor use, additional protection against water ingress (IP rating) and UV exposure is likely required, as the basic package is not inherently waterproof.

Q: What is the forward voltage range I should design my driver for?
A: The forward voltage (VF) ranges from a minimum of 1.9V to a maximum of 2.3V at 20mA. Your driver circuit should accommodate this range, and it is common practice to select resistors based on the maximum VF to ensure consistent current regulation across bins.

Q: Are there specific brightness bin codes available for this model?
A: Yes, the datasheet specifies brightness codes D2 (80-120 mcd), D3 (120-150 mcd), D4 (150-180 mcd), and D5 (180-210 mcd). You should specify the required bin code to the distributor to ensure luminous uniformity in your final product.

Q: What are the soldering profile limits for lead-free assembly?
A: For a lead-free process, the maximum peak temperature should not exceed 255°C (with a tolerance of 0/-5°C) for 5-10 seconds. The ramp-up rate should be kept under 3°C/second to minimize thermal shock.

About Leon Zhang

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

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