AM3359 Sitara ARM Cortex-A8 Processor Microcontroller

Texas Instruments Microcontroller — specifications, applications, sourcing support and RFQ.

AM3359 Sitara ARM Cortex-A8 Processor Microcontroller

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
AM3359
Manufacturer
Texas Instruments
Package
NFBGA(324) 15.0 mm x 15.0 mm; NFBGA(298) 13.0 mm x 13.0 mm
Category
Microcontroller
Product Type
Sitara ARM Cortex-A8 processor

Quick Sourcing Note

AM3359 from Texas Instruments is a Microcontroller-class Sitara ARM Cortex-A8 processor offered in NFBGA(324) 15.0 mm x 15.0 mm and NFBGA(298) 13.0 mm x 13.0 mm package options. It integrates an ARM Cortex-A8 32-bit RISC core running up to 1 GHz, NEON SIMD support, L1 and L2 cache, boot ROM, on-chip RAM, and shared L3 OCMC RAM. External memory support includes mDDR, DDR2, DDR3, and DDR3L with a 16-bit data bus and 1 GB addressable DDR space. Key application areas include embedded control, industrial Ethernet, display interfaces, storage, USB, CAN, and real-time PRU-based I/O.

Specifications

TypeDescription
Part NumberAM3359
ManufacturerTexas Instruments
Product TypeSitara ARM Cortex-A8 processor
CategoryMicrocontroller
Component TypeMCU
Package CaseNFBGA(324) 15.0 mm x 15.0 mm; NFBGA(298) 13.0 mm x 13.0 mm
Processor CoreARM Cortex-A8 32-bit RISC
Maximum CPU FrequencyUp to 1 GHz
SIMD CoprocessorNEON SIMD coprocessor
L1 Instruction Cache32 KB, with single-error detection parity
L1 Data Cache32 KB, with single-error detection parity
L2 Cache256 KB, with ECC
Boot ROM176 KB, on-chip boot ROM
Dedicated RAM64 KB, on-chip dedicated RAM
Shared L3 OCMC RAM64 KB, accessible to all masters
Interrupt RequestsUp to 128
DDR Interface TypesmDDR(LPDDR), DDR2, DDR3, DDR3L
mDDR Clock200 MHz clock, 400 MHz data rate
DDR2 Clock266 MHz clock, 532 MHz data rate
DDR3 Clock400 MHz clock, 800 MHz data rate
DDR3L Clock400 MHz clock, 800 MHz data rate
DDR Data Bus Width16-bit
Total Addressable DDR Space1 GB
GPMC Bus Width8-bit and 16-bit
GPMC Chip SelectsUp to 7
NAND ECC Support4-bit, 8-bit, or 16-bit BCH ECC; 1-bit Hamming ECC
PRU Count2 programmable real-time units
PRU Frequency200 MHz
PRU Instruction RAM8 KB per PRU, with single-error detection parity
PRU Data RAM8 KB per PRU, with single-error detection parity
PRU Shared RAM12 KB, with single-error detection parity
PRU UART Data RateUp to 12 Mbps
USB PortsUp to 2 USB 2.0 high-speed DRD ports with integrated PHY
Ethernet MACsUp to 2 industrial gigabit Ethernet MACs
Ethernet Speed and Switch10/100/1000 Mbps, integrated switch
Ethernet InterfacesMII, RMII, RGMII, MDIO
CAN PortsUp to 2, supports CAN version 2 parts A and B
UART InterfacesUp to 6; IrDA, CIR, RTS, and CTS support
UART1 ControlUART1 supports full modem control
SPI InterfacesUp to 2 McSPI master/slave interfaces
SPI Chip Selects and FrequencyUp to 2 chip selects, up to 48 MHz
MMC/SD/SDIO PortsUp to 3
MMC/SD/SDIO Modes1-bit, 4-bit, and 8-bit modes; up to 48 MHz data transfer rate
I2C InterfacesUp to 3 master/slave interfaces
I2C SpeedStandard mode up to 100 kHz, fast mode up to 400 kHz
GPIO BanksUp to 4 banks
GPIO Pins Per Bank32 GPIO pins per bank, multiplexed with other functional pins
General-Purpose Timers8 x 32-bit timers
Timer NotesDMTIMER1 is a 1-ms OS tick timer; DMTIMER4-DMTIMER7 are pinned out
Graphics EngineSGX530 3D graphics engine
Graphics PerformanceTile-based architecture up to 20 million polygons per second
LCD Controller OutputUp to 24-bit data output; 8 bits per pixel RGB
LCD ResolutionUp to 2048 x 2048
LCD Pixel ClockMaximum 126 MHz pixel clock
LCD FIFO Depth512-word internal FIFO
ADC Resolution12-bit SAR
ADC Sample Rate200 k samples/s
ADC Inputs8 analog inputs through 8:1 analog switch
DMA ControllerEDMA with 3 TPTCs and 1 TPCC
DMA ChannelsUp to 64 programmable logical channels and 8 QDMA channels
RTC Oscillator32.768 kHz
RTC LogicInternal RTC oscillator with RTC logic and 1.1 V internal LDO
High-Frequency Oscillator15 MHz to 35 MHz
High-Frequency Oscillator FunctionIntegrated oscillator used to generate reference clocks
Package Option ZCE298-pin S-PBGA-N298, 0.65 mm ball pitch
Package Option ZCZ324-pin S-PBGA-N324, 0.80 mm ball pitch
Datasheet Statusrequest_only

Product Overview

The AM3359 is a Texas Instruments Sitara ARM Cortex-A8 processor categorized here as a Microcontroller. Its MPU subsystem uses an ARM Cortex-A8 32-bit RISC processor running up to 1 GHz with a NEON SIMD coprocessor. On-chip memory resources include 176 KB boot ROM, 64 KB dedicated RAM, 64 KB shared L3 OCMC RAM, 32 KB instruction cache, 32 KB data cache, and 256 KB L2 cache with ECC.

External memory support covers mDDR(LPDDR), DDR2, DDR3, and DDR3L through a 16-bit DDR interface with up to 1 GB addressable DDR space. The GPMC supports 8-bit and 16-bit asynchronous memory interfaces for NAND, NOR, muxed-NOR, and SRAM, with up to 7 chip selects and NAND ECC options including BCH and Hamming modes.

Peripheral resources include USB 2.0 high-speed DRD ports, industrial gigabit Ethernet MACs, CAN, UART, McSPI, MMC/SD/SDIO, I2C, GPIO, timers, LCD controller, ADC, EDMA, RTC oscillator, and high-frequency oscillator functions. Package options include 298-pin S-PBGA-N298 at 0.65 mm pitch and 324-pin S-PBGA-N324 at 0.80 mm pitch.

Key Features

  • ARM Cortex-A8 32-bit RISC core up to 1 GHz
  • NEON SIMD coprocessor in the MPU subsystem
  • 32 KB instruction and 32 KB data L1 cache
  • 256 KB L2 cache with ECC protection
  • mDDR, DDR2, DDR3, and DDR3L memory support
  • 16-bit DDR interface with 1 GB addressable space
  • Two 200 MHz programmable real-time units
  • Up to two USB 2.0 high-speed DRD ports
  • Up to two industrial gigabit Ethernet MACs
  • SGX530 3D graphics engine for display applications
  • 12-bit SAR ADC with 200 k samples/s rate
  • 298-pin and 324-pin S-PBGA package options

Typical Applications

  • Industrial Ethernet control
  • Embedded Linux processing
  • Real-time PRU I/O control
  • LCD human-machine interfaces
  • USB connected embedded systems
  • CAN based industrial nodes
  • MMC and SD storage interfaces
  • NAND, NOR, and SRAM memory systems

Procurement Notes

When requesting a quote for AM3359, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.

FAQ

What processor core is used in the AM3359?

The AM3359 uses an ARM Cortex-A8 32-bit RISC processor in the Sitara processor family. The extracted datasheet facts list operation up to 1 GHz and include a NEON SIMD coprocessor in the MPU subsystem.

Which external DDR memory types does AM3359 support?

The AM3359 external memory interface supports mDDR(LPDDR), DDR2, DDR3, and DDR3L. The DDR interface is 16-bit wide and supports up to 1 GB of total addressable DDR space.

What real-time processing resources are included?

The AM3359 includes two programmable real-time units in the PRU-ICSS subsystem. Each PRU is a 200 MHz 32-bit load/store RISC processor with 8 KB instruction RAM and 8 KB data RAM.

What package options are listed for AM3359?

The extracted package facts list a 298-pin S-PBGA-N298 option with 0.65 mm ball pitch for the ZCE suffix and a 324-pin S-PBGA-N324 option with 0.80 mm ball pitch for the ZCZ suffix.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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