AM5726 Sitara Applications Processor MPU

Specifications

Product Overview

The AM5726 is a Texas Instruments Sitara applications processor in the AM572x family. It is categorized here as an MPU in the MCU & Processors category and combines a dual Arm Cortex-A15 microprocessor subsystem with two supported MPU cores, two C66x VLIW DSP cores, and two dual Arm Cortex-M4 co-processors identified as IPU1 and IPU2.

Memory resources include 2.5 MB OCMC_RAM and two DDR3/DDR3L EMIF modules supporting DDR3-1066, with up to 2 GB on EMIF1 and up to 2 GB on EMIF2. The C66x DSP feature set supports up to thirty-two 16 x 16-bit fixed-point multiplies per cycle.

Connectivity and control resources include a 2-port gigabit Ethernet GMAC, up to 247 GPIO pins, five I2C ports, ten UART modules, four McSPI interfaces, eight McASP modules, four MMC/SD/SDIO interfaces, two PCIe 3.0 subsystems, USB dual-role support, SATA Gen2, two DCAN modules, sixteen 32-bit timers, a 32-bit MPU watchdog timer, two PRU-ICSS blocks, and AES, SHA, RNG, DES, and 3DES acceleration. The device is supplied in a 760-pin FCBGA package with a 23.0 mm x 23.0 mm body.

Key Features

• Dual Arm Cortex-A15 microprocessor subsystem
• Two supported C66x VLIW DSP cores
• 2.5 MB integrated OCMC_RAM
• Two DDR3/DDR3L EMIF memory interfaces
• Two dual Arm Cortex-M4 co-processors
• Three supported video input ports
• Two-port gigabit Ethernet GMAC
• Two PCIe 3.0 subsystems with integrated PHY
• USB SuperSpeed and high-speed dual-role support
• AES, SHA, RNG, DES and 3DES acceleration

Typical Applications

• Industrial communication controllers
• Embedded multi-core processing
• Video input processing systems
• Ethernet-connected control modules
• PCIe expansion designs
• CAN 2.0B control networks
• Audio interface aggregation
• DDR3-based embedded systems

Procurement Notes

When requesting a quote for AM5726, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.