Specifications
| Type | Description |
|---|---|
| Part Number | AM5729 |
| Manufacturer | Texas Instruments |
| Product Type | Sitara applications processor SoC |
| Category | MCU & Processors |
| Component Type | MCU |
| Package Case | FCBGA (760), 23.0 mm x 23.0 mm body, 0.8 mm pitch, ABC package |
| CPU Subsystem | Dual Arm Cortex-A15 microprocessor subsystem |
| DSP Cores | Up to 2 C66x floating-point VLIW DSP cores |
| DSP Fixed-Point Throughput | Up to thirty-two 16 x 16-bit fixed-point multiplies per cycle |
| On-Chip L3 RAM | Up to 2.5 MB |
| On-Chip Shared Memory | 2.5 MB OCMC_RAM |
| DDR Memory Interfaces | 2 EMIF modules supporting DDR3/DDR3L |
| DDR3 Speed Support | Up to DDR3-1066 |
| DDR Memory Capacity | Up to 2 GB per EMIF |
| Cortex-M4 Coprocessors | 2 dual Arm Cortex-M4 coprocessors, IPU1 and IPU2 |
| Embedded Vision Engines | Up to 4 EVEs |
| Video Accelerator | IVA-HD subsystem |
| H.264 Video Support | 4K at 15 fps encode and decode |
| Other Video CODECs Support | Up to 1080p60 |
| Display Output Capability | Full-HD video, 1920 x 1080p at 60 fps |
| Display Pipelines | Display controller with DMA engine and up to 3 pipelines |
| HDMI Support | HDMI 1.4a and DVI 1.0 compliant encoder |
| PRU-ICSS | 2 dual-core Programmable Real-Time Unit and Industrial Communication Subsystems |
| 2D Graphics Accelerator | Vivante GC320 core, BB2D subsystem |
| 3D GPU | Dual-core PowerVR SGX544 3D GPU |
| Crypto Accelerators | AES, SHA, RNG, DES, and 3DES |
| Video Input Ports | 3 VIP modules |
| Ethernet | 2-port gigabit Ethernet GMAC |
| General-Purpose Timers | 16 32-bit timers |
| Watchdog Timer | 32-bit MPU watchdog timer |
| I2C Ports | 5 ports |
| UART Ports | 10 configurable UART/IrDA/CIR modules |
| McSPI Interfaces | 4 Multichannel Serial Peripheral Interfaces |
| QSPI Interface | Supported |
| SATA Interface | SATA gen2 interface supported |
| McASP Modules | 8 Multichannel Audio Serial Port modules |
| USB 3.0 | SuperSpeed USB 3.0 dual-role device supported |
| USB 2.0 | High-speed USB 2.0 dual-role device with embedded HS PHY supported |
| MMC/SD/SDIO Interfaces | 4 interfaces |
| PCI Express | PCI Express 3.0 subsystems with two 5-Gbps lanes |
| CAN Interfaces | 2 DCAN modules supporting CAN 2.0B protocol |
| GPIO Pins | Up to 247 GPIO pins |
| Process Technology | 28-nm CMOS technology |
| Package Pin Count | 760-pin BGA |
| Silicon Revision | 2.0 |
| Datasheet Status | request_only |
Product Overview
The AM5729 is a Texas Instruments Sitara applications processor SoC categorized here as an MCU & Processors part. It combines a dual Arm Cortex-A15 microprocessor subsystem with supported MPU core 0 and MPU core 1, up to two C66x floating-point VLIW DSP cores, and two dual Arm Cortex-M4 coprocessor subsystems identified as IPU1 and IPU2.
Memory resources include up to 2.5 MB on-chip L3 RAM and 2.5 MB OCMC_RAM. External memory support is provided through two EMIF modules for DDR3/DDR3L, supporting up to DDR3-1066 and up to 2 GB per EMIF. The device is built on 28-nm CMOS technology and supplied in an FCBGA (760) ABC package with a 23.0 mm x 23.0 mm body and 0.8 mm pitch.
For multimedia and industrial designs, AM5729 includes up to four Embedded Vision Engines, IVA-HD video acceleration, Full-HD display output, HDMI 1.4a and DVI 1.0 encoder support, PRU-ICSS blocks, 2D graphics acceleration, and a dual-core PowerVR SGX544 3D GPU. Interfaces include gigabit Ethernet, PCI Express, USB, SATA, CAN, MMC/SD/SDIO, I2C, UART, McSPI, QSPI, McASP, GPIO, timers, watchdog, DMA, and GPMC support.
Key Features
- Dual Arm Cortex-A15 microprocessor subsystem
- Up to two C66x floating-point VLIW DSP cores
- Two dual Arm Cortex-M4 coprocessors, IPU1 and IPU2
- Up to four Embedded Vision Engines supported
- 2.5 MB OCMC_RAM on-chip shared memory
- Two DDR3/DDR3L EMIF modules up to DDR3-1066
- IVA-HD supports H.264 4K at 15 fps
- Dual-core PowerVR SGX544 3D GPU
- Two dual-core PRU-ICSS industrial communication subsystems
- PCI Express 3.0 with two 5-Gbps lanes
- USB 3.0 and USB 2.0 dual-role support
- FCBGA 760-pin ABC package, 0.8 mm pitch
Typical Applications
- Embedded vision processing
- Industrial communication controllers
- Full-HD display systems
- H.264 video encode and decode
- Gigabit Ethernet connected equipment
- PCI Express embedded platforms
- USB and SATA storage designs
- CAN 2.0B control networks
- Multichannel audio interfaces
Procurement Notes
When requesting a quote for AM5729, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.
FAQ
What processor subsystem is integrated in AM5729?
AM5729 integrates a dual Arm Cortex-A15 microprocessor subsystem. The extracted device comparison also identifies MPU core 0 and MPU core 1 as supported for the AM5729.
What memory interfaces does AM5729 support?
AM5729 provides two EMIF modules supporting DDR3 and DDR3L memory. The facts specify support up to DDR3-1066 and up to 2 GB of memory capacity per EMIF.
Which video and display functions are listed for AM5729?
The device includes the IVA-HD subsystem, H.264 encode and decode at 4K and 15 fps, other video CODECs up to 1080p60, and Full-HD 1920 x 1080p display output at 60 fps.
What package is used for the AM5729 device?
AM5729 is specified in an FCBGA (760) ABC package. The package details list a 23.0 mm x 23.0 mm body, 0.8 mm pitch, and 760-pin BGA configuration.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.