LM5112 MOSFET Gate Driver

Texas Instruments Power_Management — specifications, applications, sourcing support and RFQ.

LM5112 MOSFET Gate Driver

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
LM5112
Manufacturer
Texas Instruments
Package
6-pin WSON (NGG) 3.00 mm x 3.00 mm; 8-pin MSOP PowerPAD (DGN) 3.00 mm x 3.00 mm
Category
Power Management
Product Type
LDO Regulator

Quick Sourcing Note

LM5112 from Texas Instruments is a Power_Management MOSFET gate driver offered in 6-pin WSON (NGG) and 8-pin MSOP PowerPAD (DGN) packages, both 3.00 mm x 3.00 mm. It operates from 3.5 to 14 V and drives MOSFET gates with 7 A peak sink current and 3 A peak source current under pulsed output-current conditions. The device provides TTL-compatible IN and INB control inputs, VEE-to-VCC output swing, 25 ns typical propagation delays, 14 ns typical rise time, and 12 ns typical fall time with a 2 nF load. Applications include MOSFET gate-drive stages, TTL-controlled switching, and LM5112-Q1 automotive designs.

Specifications

TypeDescription
Part NumberLM5112
ManufacturerTexas Instruments
Product TypeLDO Regulator
CategoryPower Management
Package / Case6-pin WSON (NGG) 3.00 mm x 3.00 mm; 8-pin MSOP PowerPAD (DGN) 3.00 mm x 3.00 mm
Component TypePower_IC
Peak sink current7 A; OUT = VCC/2, 200 ns pulsed current
Peak source current3 A; OUT = VCC/2, 200 ns pulsed current
Operating voltage3.5 to 14 V; VCC - IN_REF and VCC - VEE
Operating voltage over temperature3.5 to 14 V; VCC - IN_REF and VCC - VEE; TJ = -40 degC to 125 degC
Undervoltage lockout rising thresholdmin 2.4 V, typ 3 V, max 3.5 V; VCC - IN_REF
Undervoltage hysteresistyp 230 mV; TJ = -40 degC to 125 degC, VCC = 12 V
Supply currenttyp 1 mA, max 2 mA; TJ = -40 degC to 125 degC, VCC = 12 V, INB = IN_REF = VEE = 0 V, no load on output
Logic high input voltagemin 2.3 V; control inputs
Logic low input voltagemax 0.8 V; control inputs
Input high thresholdmin 1.3 V, typ 1.75 V, max 2.3 V; control inputs
Input low thresholdmin 0.8 V, typ 1.35 V, max 2 V; control inputs
Input hysteresistyp 400 mV; control inputs
Input current lowmin -1 uA, typ 0.1 uA, max 1 uA; IN = INB = 0 V
Input current highmin -1 uA, typ 0.1 uA, max 1 uA; IN = INB = VCC
Output resistance hightyp 30 ohm, max 50 ohm; IOUT = -10 mA; MOS device only
Output resistance lowtyp 1.4 ohm, max 2.5 ohm; IOUT = 10 mA; MOS device only
Propagation delay low-to-hightyp 25 ns, max 40 ns; IN or INB rising, IN to OUT; CLOAD = 2 nF
Propagation delay high-to-lowtyp 25 ns, max 40 ns; IN or INB falling, IN to OUT; CLOAD = 2 nF
Rise timetyp 14 ns; CLOAD = 2 nF
Fall timetyp 12 ns; CLOAD = 2 nF
Latch-up protection500 mA; AEC-Q100 Method 004, TJ = 150 degC
Absolute maximum VCC to VEE-0.3 to 15 V; over operating free-air temperature range unless otherwise noted
Absolute maximum VCC to IN_REF-0.3 to 15 V; over operating free-air temperature range unless otherwise noted
Absolute maximum IN/INB to IN_REF-0.3 to 15 V; over operating free-air temperature range unless otherwise noted
Absolute maximum IN_REF to VEE-0.3 to 5 V; over operating free-air temperature range unless otherwise noted
Maximum junction temperature150 degC; absolute maximum rating
Operating junction temperature-40 degC to 125 degC; absolute maximum and recommended operating range
Storage temperature-55 degC to 150 degC; Tstg
ESD rating+/-2000 V; human-body model, per ANSI/ESDA/JEDEC JS-001
Junction-to-ambient thermal resistance40 degC/W WSON; 53.7 degC/W MSOP PowerPAD; JEDEC thermal metric RthetaJA
Junction-to-case top thermal resistance50.8 degC/W WSON; 61.1 degC/W MSOP PowerPAD; JEDEC thermal metric RthetaJC(top)
Junction-to-board thermal resistance29.3 degC/W WSON; 37.2 degC/W MSOP PowerPAD; JEDEC thermal metric RthetaJB
Junction-to-top characterization parameter0.7 degC/W WSON; 7.2 degC/W MSOP PowerPAD; JEDEC thermal metric psiJT
Junction-to-board characterization parameter29.5 degC/W WSON; 36.9 degC/W MSOP PowerPAD; JEDEC thermal metric psiJB
Junction-to-case bottom thermal resistance7.5 degC/W WSON; 4.7 degC/W MSOP PowerPAD; JEDEC thermal metric RthetaJC(bot)
Output voltage swingVEE to VCC; gate drive output OUT
Input typeTTL-compatible thresholds; IN non-inverting input and INB inverting input
Automotive qualificationAEC-Q100 Grade 1 qualified; LM5112-Q1 variant
Datasheet Statusrequest_only

Product Overview

The LM5112 is a Texas Instruments MOSFET gate driver for Power_Management designs that require a VEE-to-VCC gate-drive output. It provides non-inverting IN and inverting INB control inputs with TTL-compatible thresholds, including a 2.3 V minimum logic-high input level and 0.8 V maximum logic-low input level.

Operating voltage is specified from 3.5 to 14 V for VCC-IN_REF and VCC-VEE, with operation over a -40 degC to 125 degC junction-temperature range. The driver delivers 7 A peak sink current and 3 A peak source current at OUT = VCC/2 using 200 ns pulsed current conditions.

Dynamic specifications include 25 ns typical low-to-high and high-to-low propagation delays, each with a 40 ns maximum, using a 2 nF load. Rise time is typically 14 ns and fall time is typically 12 ns with the same load condition.

Package options are a 6-pin WSON (NGG) 3.00 mm x 3.00 mm and an 8-pin MSOP PowerPAD (DGN) 3.00 mm x 3.00 mm. Thermal metrics are specified for both packages, and the LM5112-Q1 variant is AEC-Q100 Grade 1 qualified.

Key Features

  • 7 A peak sink current at OUT = VCC/2
  • 3 A peak source current under pulsed output condition
  • 3.5 to 14 V operating voltage range
  • VEE-to-VCC gate-drive output voltage swing
  • TTL-compatible IN and INB control thresholds
  • 25 ns typical propagation delay with 2 nF load
  • 14 ns typical rise time with 2 nF load
  • 12 ns typical fall time with 2 nF load
  • Typ 1 mA supply current at 12 V
  • AEC-Q100 Grade 1 qualified LM5112-Q1 variant

Typical Applications

  • MOSFET gate-drive stages
  • Power management switching circuits
  • TTL-controlled gate-driver interfaces
  • Automotive qualified LM5112-Q1 designs
  • Compact WSON power assemblies
  • MSOP PowerPAD gate-drive layouts

Procurement Notes

When requesting a quote for LM5112, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.

FAQ

What type of device is the LM5112?

The LM5112 is a Texas Instruments MOSFET gate driver in the Power_Management category. It provides a VEE-to-VCC gate-drive output and uses TTL-compatible IN and INB control inputs.

What operating voltage range does the LM5112 support?

The LM5112 operating voltage is specified from 3.5 to 14 V for VCC-IN_REF and VCC-VEE. The same range is specified across TJ = -40 degC to 125 degC.

What are the LM5112 peak drive-current ratings?

The LM5112 specifies 7 A peak sink current and 3 A peak source current. Both values are measured at OUT = VCC/2 using 200 ns pulsed current conditions.

Which packages are specified for the LM5112?

The extracted package data lists a 6-pin WSON (NGG) package measuring 3.00 mm x 3.00 mm and an 8-pin MSOP PowerPAD (DGN) package measuring 3.00 mm x 3.00 mm.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

Request Quote Request Datasheet