Renesas_P8900_ShortForm DDR5 Module PMIC

Specifications

Product Overview

Renesas_P8900_ShortForm is a Renesas DDR5 memory module PMIC in the Power_Management category. Its primary function is power management for DDR5 RDIMM, DDR5 LRDIMM, and DDR5 NVDIMM applications, with device power support up to 15 W. The package case is not specified in the extracted facts.

The device includes four integrated step-down switching regulators named SWA, SWB, SWC, and SWD, plus three integrated LDO regulators named VBias, VOUT_1.8V, and VOUT_1.0V. VIN_Bulk supplies the switching regulators across 4.25 V to 15.0 V, while VIN_Mgmt supplies the rest of the PMIC across 3.0 V to 3.6 V. Automatic switchover from VIN_Mgmt to VIN_Bulk is supported.

Control and configuration functions include selectable I2C or I3C interface operation, programmable dual-phase and single-phase configuration for SWA and SWB, independently programmable output voltage, power-up sequence, and power-down sequence for switch regulators, plus multi-time programmable non-volatile memory and programmable DIMM-specific registers.

Key Features

• Power management IC for DDR5 memory modules
• Supports DDR5 RDIMM, LRDIMM, and NVDIMM applications
• Up to 15 W device power support
• Four step-down regulators: SWA, SWB, SWC, SWD
• Three LDO regulators: VBias, VOUT_1.8V, VOUT_1.0V
• Selectable I2C or I3C application interface
• Programmable dual-phase and single-phase operation for SWA and SWB
• Independent output voltage, power-up, and power-down programming
• Input and output power-good status reporting
• Output current measurement and threshold mechanism
• Temperature measurement, warning threshold, and critical shutdown
• Multi-time programmable memory with DIMM-specific registers

Typical Applications

• DDR5 RDIMM modules
• DDR5 LRDIMM modules
• DDR5 NVDIMM modules
• DDR5 memory module power management
• DIMM-specific PMIC configuration
• DDR5 module fault monitoring

Procurement Notes

When requesting a quote for Renesas_P8900_ShortForm, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For power IC and power device sourcing, voltage rating, current rating, power dissipation, package thermal performance, protection features, qualification grade and application conditions should be reviewed before approval.