Specifications
| Type | Description |
|---|---|
| Part Number | TDA4VM |
| Manufacturer | Texas Instruments |
| Product Type | ADAS automotive processor SoC |
| Category | Microcontroller |
| Package / Case | ALF (FCBGA, 827), 24.0 mm × 24.0 mm, 0.8-mm pitch |
| Component Type | MCU |
| C7x DSP frequency | up to 1.0 GHz; C7x floating point vector DSP |
| C7x DSP floating-point performance | 80 GFLOPS; C7x floating point vector DSP |
| C7x DSP fixed-point/integer performance | 256 GOPS; C7x floating point vector DSP |
| Deep-learning MMA performance | up to 8 TOPS, 8-bit; MMA at 1.0 GHz |
| Arm Cortex-A72 subsystem | Dual 64-bit Arm Cortex-A72; microprocessor subsystem |
| Arm Cortex-A72 frequency | up to 2.0 GHz; dual 64-bit Arm Cortex-A72 subsystem |
| Cortex-A72 shared L2 cache | 1 MB; per dual-core Cortex-A72 cluster |
| Cortex-A72 L1 DCache | 32 KB; per Cortex-A72 core |
| Cortex-A72 L1 ICache | 48 KB; per Cortex-A72 core |
| Arm Cortex-R5F MCU count | 6 cores; Arm Cortex-R5F MCUs |
| Arm Cortex-R5F MCU frequency | up to 1.0 GHz; Arm Cortex-R5F MCUs |
| Cortex-R5F cache/TCM | 16 KB I-Cache, 16 KB D-Cache, 64 KB L2 TCM; Arm Cortex-R5F MCU subsystem |
| Isolated MCU subsystem | 2 Arm Cortex-R5F MCUs; isolated MCU subsystem |
| General compute R5F partition | 4 Arm Cortex-R5F MCUs; general compute partition |
| C66x DSP count | 2; floating point DSPs |
| C66x DSP frequency | up to 1.35 GHz; two C66x floating point DSPs |
| C66x DSP floating-point performance | 40 GFLOPS; two C66x floating point DSPs |
| C66x DSP fixed-point/integer performance | 160 GOPS; two C66x floating point DSPs |
| GPU | PowerVR Rogue 8XE GE8430; 3D GPU |
| GPU frequency | up to 750 MHz; PowerVR Rogue 8XE GE8430 |
| GPU performance | 96 GFLOPS, 6 Gpix/s; PowerVR Rogue 8XE GE8430 |
| On-chip L3 RAM | up to 8 MB; with ECC and coherency |
| MAIN domain SRAM | 512 KB; on-chip SRAM protected by ECC |
| External memory interface | LPDDR4, up to 4266 MT/s, 32-bit data bus with inline ECC; EMIF module with ECC |
| Ethernet switch external ports | up to 8 external ports; integrated Ethernet switch |
| Ethernet port support | 2.5 Gb SGMII, 1 Gb SGMII/RGMII, 100 Mb RMII; all Ethernet switch ports |
| QSGMII support | any two ports support QSGMII; using 4 internal ports per QSGMII |
| PCI Express controllers | up to 4 PCIe Gen3 controllers, up to 2 lanes per controller; PCIe Gen1/Gen2/Gen3 auto-negotiation |
| PCI Express data rates | Gen1 2.5 GT/s, Gen2 5.0 GT/s, Gen3 8.0 GT/s; PCIe operation with auto-negotiation |
| USB subsystem | 2 USB 3.0 dual-role device subsystems; two enhanced SuperSpeed Gen1 ports; host, peripheral, or DRD configurable |
| CAN interfaces | 16 MCAN modules; full CAN-FD support |
| CSI-2 interfaces | 2 CSI2.0 4-lane RX plus 1 CSI2.0 4-lane TX; automotive interfaces |
| CSI-2 RX throughput | 2.5 Gbps per lane, 20 Gbps total; CSI2.0 4-lane RX interfaces |
| DisplayPort/eDP interface | 1 eDP/DP interface with MST, HDCP 1.4/HDCP 2.2; display subsystem |
| DSI transmitter | 1 DSI TX up to 2.5K; display subsystem |
| DPI outputs | up to 2 DPI outputs; display subsystem |
| Audio interfaces | 12 MCASP modules; multichannel audio serial port modules |
| Video decode capability | 1 × 3840 × 2160p60 or 2 × 3840 × 2160p30 H.264/H.265 decode; Ultra-HD video acceleration |
| Full-HD video decode capability | 4 × 1920 × 1080p60 or 8 × 1920 × 1080p30 H.264/H.265 decode; Full-HD video acceleration |
| Full-HD video encode capability | 1 × 1920 × 1080p60 or up to 3 × 1920 × 1080p30 H.264 encode; Full-HD video acceleration |
| Flash/storage interfaces | eMMC 5.1, UFS 2.1 with 2 lanes, 2 SD3.0/SDIO3.0 interfaces; flash memory interfaces |
| Simultaneous flash interface configurations | one OSPI and one QSPI, or one HyperBus and one QSPI; two simultaneous flash interfaces |
| Process technology | 16-nm FinFET; SoC architecture |
| Package pin count | 827 pins; ALF FCBGA package |
| Package pitch | 0.8 mm; 24 mm × 24 mm FCBGA package |
| Package size | 24.0 mm × 24.0 mm; TDA4VM...ALF and XJ721E...ALF package information |
| Functional safety capability | ISO 26262 up to ASIL D; IEC 61508 up to SIL 3; select part numbers with documentation/certification support noted |
| AEC-Q100 qualification | qualified on variants ending in Q1; automotive part number variants |
| Secure boot | supported; select part numbers with secure run-time support |
| Customer programmable root key | up to RSA-4K or ECC-512; device security on select part numbers |
| Crypto accelerators | PKA with ECC, AES, SHA, RNG, DES, 3DES; embedded hardware security module |
| Datasheet Status | request_only |
Product Overview
The TDA4VM is a Texas Instruments ADAS automotive processor SoC categorized here as a Microcontroller. Its compute structure combines a dual 64-bit Arm Cortex-A72 subsystem, six Arm Cortex-R5F MCUs, one C7x floating-point vector DSP, two C66x floating-point DSPs, and a PowerVR Rogue 8XE GE8430 GPU. The C7x DSP supports up to 1.0 GHz operation with 80 GFLOPS and 256 GOPS, while the MMA reaches up to 8 TOPS for 8-bit deep-learning workloads at 1.0 GHz.
Memory and interface resources include up to 8 MB on-chip L3 RAM with ECC and coherency, 512 KB MAIN domain SRAM protected by ECC, and LPDDR4 up to 4266 MT/s on a 32-bit bus with inline ECC. External connectivity includes up to eight Ethernet switch external ports, up to four PCIe Gen3 controllers, two USB 3.0 dual-role subsystems, 16 MCAN modules, CSI-2 RX/TX, eDP/DP, DSI, DPI, MCASP audio, eMMC, UFS, SD, OSPI, QSPI, and HyperBus configurations.
The device uses 16-nm FinFET process technology and is supplied in an ALF FCBGA package with 827 pins, 24.0 mm × 24.0 mm body size, and 0.8-mm pitch. Its documented capabilities align with ADAS compute, automotive camera, networking, display, video, safety, and secure-boot system designs.
Key Features
- Dual 64-bit Arm Cortex-A72 subsystem up to 2.0 GHz
- Six Arm Cortex-R5F MCU cores up to 1.0 GHz
- C7x vector DSP delivers 80 GFLOPS and 256 GOPS
- MMA supports up to 8 TOPS 8-bit deep learning
- Two C66x floating-point DSPs up to 1.35 GHz
- PowerVR Rogue 8XE GE8430 GPU up to 750 MHz
- LPDDR4 interface up to 4266 MT/s with inline ECC
- Integrated Ethernet switch supports up to eight external ports
- Up to four PCIe Gen3 controllers with two lanes each
- Sixteen MCAN modules provide full CAN-FD support
- CSI-2 RX throughput reaches 20 Gbps total
- Secure boot and hardware crypto accelerators on select parts
Typical Applications
- ADAS compute systems
- Automotive camera processing
- Deep-learning inference modules
- Automotive Ethernet gateways
- CAN-FD vehicle networks
- Multi-display automotive systems
- H.264 and H.265 video processing
- Secure automotive control domains
Procurement Notes
When requesting a quote for TDA4VM, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For MCU, processor and logic IC sourcing, package, operating voltage, temperature grade, speed or frequency grade, firmware or mask version, lifecycle status and programming requirements should be checked before approval.
FAQ
What type of device is the TDA4VM?
The TDA4VM is a Texas Instruments ADAS automotive processor SoC categorized as a Microcontroller. It combines Arm Cortex-A72, Arm Cortex-R5F, C7x DSP, C66x DSP, GPU, video, networking, display, storage, safety, and security resources.
What compute engines are integrated in TDA4VM?
The device includes dual 64-bit Arm Cortex-A72 cores, six Arm Cortex-R5F MCU cores, a C7x floating-point vector DSP, two C66x floating-point DSPs, and a PowerVR Rogue 8XE GE8430 3D GPU.
What package is used for the TDA4VM?
The extracted package data lists an ALF FCBGA package with 827 pins. The body size is 24.0 mm × 24.0 mm, and the package pitch is 0.8 mm.
What memory interface does TDA4VM support?
The external memory interface supports LPDDR4 up to 4266 MT/s on a 32-bit data bus with inline ECC. On-chip memory includes up to 8 MB L3 RAM with ECC and coherency plus 512 KB MAIN domain SRAM protected by ECC.
Which automotive interfaces are listed for TDA4VM?
Automotive-oriented interfaces include up to eight Ethernet switch external ports, 16 MCAN modules with full CAN-FD support, two CSI2.0 4-lane RX interfaces, and one CSI2.0 4-lane TX interface.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.