XL-1608SYGC-06FB Yellow-Green SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-1608SYGC-06FB Yellow-Green SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-1608SYGC-06FB
Manufacturer
XINGLIGHT
Package
1608 SMD LED, 1.6 x 0.8 x 0.6 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-1608SYGC-06FB from XINGLIGHT is a yellow-green SMD LED in a 1608 package measuring 1.6 x 0.8 x 0.6 mm. It uses a transparent water colloid construction and is specified for 50-120 mcd luminous intensity at IF=20 mA and Ta=25°C. The LED has a 567-575 nm dominant wavelength, 570 nm typical peak wavelength, 1.8-2.4 V forward voltage, and 120° typical viewing angle. It is suited to compact board-level indication where yellow-green output, small SMD size, defined brightness bins, and reflow assembly limits are required.

Specifications

TypeDescription
Part NumberXL-1608SYGC-06FB
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case1608 SMD LED, 1.6 x 0.8 x 0.6 mm
Outline Dimensions1.6 x 0.8 x 0.6 mm; L/W/H
Luminous ColorYellow-green; transparent/water colloid
Colloid TypeWater colloid / transparent colloid
RoHS ComplianceComplied with RoHS Directive; environmental protection process
Moisture Sensitivity LevelMSL 3
Maximum Power Dissipation50 mW; Ta=25°C
Maximum Continuous Forward Current20 mA; Ta=25°C
Peak Forward Current60 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD Rating2000 V; Ta=25°C
Operating Temperature Range-40 to +85 °C
Storage Temperature Range-40 to +85 °C
Lead Soldering Temperature/Time260°C <=6 s
Luminous Intensity50-120 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength567-575 nm; IF=20 mA, Ta=25°C
Peak Wavelength570 nm typ; IF=20 mA, Ta=25°C
Forward Voltage1.8-2.4 V; IF=20 mA, Ta=25°C
Viewing Angle120° typ; 2θ1/2, IF=20 mA, Ta=25°C
Half Wave Width20 nm typ; IF=20 mA, Ta=25°C
Reverse Current<=1 µA; VR=5 V, Ta=25°C
Brightness Grade D150-80 mcd; IF=20 mA
Brightness Grade D280-120 mcd; IF=20 mA
Brightness Tolerance±10%
Voltage Grade M17-91.8-1.9 V; IF=20 mA
Voltage Grade M18-11.9-2.0 V; IF=20 mA
Voltage Grade M18-22.0-2.1 V; IF=20 mA
Voltage Grade M18-32.1-2.2 V; IF=20 mA
Voltage Grade M18-42.2-2.3 V; IF=20 mA
Voltage Grade M18-52.3-2.4 V; IF=20 mA
Voltage Tolerance±0.1 V
Wavelength Grade HYG04567.5-570 nm; IF=20 mA
Wavelength Grade HYG05570-572.5 nm; IF=20 mA
Wavelength Grade HYG06572.5-575 nm; IF=20 mA
Wavelength Tolerance±1 nm
Test Environment Temperature25±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature and High Humidity Storage Test240 hours ±2 hours; IR-Reflow in-board 2 times; Ta=85±5°C, RH=90-95%
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR-Reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min
Anti-Tin Test260±5°C, 10±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature235°C +5/-0°C for 10-15 s; lead process infrared reflow
Lead-Free Reflow Peak Temperature255°C +0/-5°C for 5-10 s; lead-free infrared reflow
Weldability Test235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area
Unspecified Dimensional Tolerance±0.25 mm; unless otherwise noted
Tape/Reel Dimensional Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W; hand soldering recommended only for repair/rework
Hand Soldering Temperature<300°C; each terminal once only, less than 3 s
Recommended Maximum Welding Temperature240±5°C for 6 s; product recommended maximum welding temperature
Maximum Reflow Cycles2 times; reflow soldering
Alcohol Cleaning ConditionUnder 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest cleaning conditions before use
Unopened Storage Condition<=30°C, <=60% RH, use within 1 year; before opening package
Opened Storage Condition<=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition<=30°C, <=60% RH; product operation/workshop condition
Baking Condition60±5°C for 24 hours; if moisture absorbent material has faded or LEDs exceeded storage time
Datasheet Statusrequest_only

Product Overview

The XL-1608SYGC-06FB is a XINGLIGHT yellow-green SMD LED built in a 1608 surface-mount package. Its outline dimensions are 1.6 x 0.8 x 0.6 mm, with a transparent water colloid optical body and RoHS-compliant environmental process noted in the datasheet.

At IF=20 mA and Ta=25°C, the device is specified for 50-120 mcd luminous intensity, 567-575 nm dominant wavelength, 570 nm typical peak wavelength, 20 nm typical half-wave width, and a 120° typical viewing angle. Forward voltage is specified from 1.8 V to 2.4 V, with voltage, brightness, and wavelength grading options listed for production sorting.

Electrical limits include 50 mW maximum power dissipation, 20 mA maximum continuous forward current, 60 mA peak forward current under pulsed conditions, 5 V maximum reverse voltage, and 2000 V ESD rating at Ta=25°C. Assembly guidance includes MSL 3 handling, two maximum reflow cycles, soldering temperature limits, cleaning conditions, and storage requirements before and after package opening.

Key Features

  • 1608 SMD package with 1.6 x 0.8 x 0.6 mm outline
  • Yellow-green transparent water colloid LED construction
  • 50-120 mcd luminous intensity at 20 mA
  • 567-575 nm dominant wavelength at 20 mA
  • 1.8-2.4 V forward voltage at 20 mA
  • 120° typical viewing angle for board-level indication
  • 20 mA maximum continuous forward current at 25°C
  • MSL 3 moisture sensitivity handling classification
  • Two maximum reflow soldering cycles specified
  • Opened packages require soldering within 168 hours

Typical Applications

  • Yellow-green status indicators
  • Compact SMD indicator layouts
  • Board-level visual signaling
  • Reflow-assembled LED boards
  • Brightness-binned indicator designs
  • Wavelength-binned yellow-green displays
  • Repair or rework soldering cases

Procurement Notes

When requesting a quote for XL-1608SYGC-06FB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL-1608SYGC-06FB?

XL-1608SYGC-06FB uses a 1608 SMD LED package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet lists unspecified dimensional tolerance as ±0.25 mm unless otherwise noted.

What optical output is specified at 20 mA?

At IF=20 mA and Ta=25°C, the LED is specified for 50-120 mcd luminous intensity, 567-575 nm dominant wavelength, 570 nm typical peak wavelength, 20 nm typical half-wave width, and 120° typical viewing angle.

What are the main electrical ratings for this LED?

At Ta=25°C, the datasheet lists 50 mW maximum power dissipation, 20 mA maximum continuous forward current, 60 mA peak forward current under pulsed conditions, 5 V maximum reverse voltage, and 2000 V ESD rating.

How should opened packages be stored and processed?

After opening the package, storage is specified at <=30°C and <=40% RH, with soldering required within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if storage time is exceeded or the moisture indicator has faded.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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