Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UBC-06 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 0603 SMD, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | blue; transparent/water colloid |
| Moisture Sensitivity Level | MSL 3; stated as 3 levels |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Package Standard | EIA standard packaging; standard packaging |
| Maximum Power Dissipation | 70 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; absolute maximum rating table |
| Luminous Intensity | 80 to 210 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 455 to 475 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 465 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6 to 3.4 V; IF=20 mA, Ta=25°C |
| Half Wave Width | 25 nm typ; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-8 | 2.6 to 2.7 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7 to 2.8 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-3 | 3.0 to 3.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-4 | 3.1 to 3.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-5 | 3.2 to 3.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-6 | 3.3 to 3.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HB03 | 455 to 460 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HB04 | 460 to 465 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HB05 | 465 to 470 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HB06 | 470 to 475 nm; IF=20 mA, wavelength error ±1 nm |
| Test Ambient Temperature | 25 ±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; lead infrared reflow welding |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; lead-free infrared reflow welding |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions, dimensions in mm |
| Hand Soldering Iron Power | <30 W recommended; manual welding for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning Condition | alcohol cleaning under 30°C for 3 min or 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W generally; pretest recommended to confirm no LED damage |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; operation after opening package |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-1608UBC-06 is a XINGLIGHT blue 0603 SMD LED with transparent/water colloid construction and a 1.6 x 0.8 x 0.6 mm outline. The package is specified with ±0.25 mm outline tolerance, EIA standard packaging, and tape/reel dimensions controlled to ±0.1 mm.
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 210 mcd luminous intensity, 455 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half-wave width, and 120° typical viewing angle. The forward voltage range is 2.6 to 3.4 V, with voltage, brightness, and wavelength bin options listed in the datasheet.
Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V reverse voltage, and 2000 V ESD rating. The operating and storage temperature ranges are both -40 to +85°C.
Assembly and storage controls include MSL 3, a maximum reflow count of 2 times, soldering and cleaning limits, and opened-package storage of ≤30°C and ≤40% RH with soldering within 168 hours / 7 days.
Key Features
- Blue 0603 SMD LED in 1.6 x 0.8 x 0.6 mm package
- 80 to 210 mcd luminous intensity at IF=20 mA
- 455 to 475 nm dominant wavelength range
- 2.6 to 3.4 V forward voltage at IF=20 mA
- 120° typical viewing angle at IF=20 mA
- 20 mA maximum continuous forward current rating
- 70 mW maximum power dissipation at Ta=25°C
- MSL 3 moisture sensitivity level
- RoHS Directive compliance stated in datasheet
- EIA standard packaging specified
Typical Applications
- Compact status indicators
- Blue board-level indicators
- Portable device indication
- Control panel backlighting
- Consumer electronics indicators
- SMD assemblies using 0603 LEDs
- Signals requiring 455 to 475 nm blue output
Procurement Notes
When requesting a quote for XL-1608UBC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size is specified for XL-1608UBC-06?
XL-1608UBC-06 is specified as a 0603 SMD LED with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at IF=20 mA?
At IF=20 mA and Ta=25°C, the LED has 80 to 210 mcd luminous intensity, 455 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half-wave width, and 120° typical viewing angle.
What forward voltage range does this LED use?
The forward voltage range is 2.6 to 3.4 V at IF=20 mA and Ta=25°C. The datasheet also defines voltage bins from M18-8 through M19-6, covering 2.6 V to 3.4 V in 0.1 V ranges.
What storage conditions apply after opening the package?
After opening the package, the storage condition is ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition after opening is ≤30°C and ≤60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
