Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UBC-06FB |
| Manufacturer | XINGLIGHT |
| Product Type | Blue SMD LED |
| Category | LED |
| Package / Case | 0603 SMD, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | Blue; transparent/water-clear colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Maximum Power Dissipation | 70 mW at Ta=25°C |
| Maximum Continuous Forward Current | 20 mA at Ta=25°C |
| Peak Forward Current | 80 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability at Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C ≤6 s; Ta=25°C absolute maximum rating table |
| Luminous Intensity | 125 min, 240 max mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 460 min, 475 max nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 460 typ nm; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.7 min, 3.2 max V; IF=20 mA, Ta=25°C |
| Half Wave Width | 25 typ nm; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | ≤1 µA; VR=5 V, Ta=25°C |
| Brightness Grade D3 | 120 to 150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D4 | 150 to 180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D5 | 180 to 210 mcd; IF=20 mA, brightness error ±10% |
| Brightness Grade D6 | 210 to 240 mcd; IF=20 mA, brightness error ±10% |
| Voltage Grade M18-9 | 2.7 to 2.8 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade N19-1 | 2.8 to 2.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade N19-2 | 2.9 to 3.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade N19-3 | 3.0 to 3.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Grade N19-4 | 3.1 to 3.2 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Grade HB04 | 460 to 465 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HB05 | 465 to 470 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Grade HB06 | 470 to 475 nm; IF=20 mA, wavelength error ±1 nm |
| Default Test Ambient Temperature | 25±5°C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature, tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times, 100±5°C to -40±5°C, 20 min each |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; lead infrared reflow welding |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; lead-free infrared reflow welding |
| Weldability Test | Tin loading rate ≥95% pad area; T.sol=235±5°C, immersion speed 25±2.5 mm/s, immersion time 2±0.5 s |
| Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; less than 3 seconds per terminal, one time only |
| Maximum Reflow Cycles | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest recommended before cleaning |
| Unopened Storage Condition | ≤30°C, ≤60% RH, within 1 year before opening package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH operation/workshop environment |
| Baking Condition | 60±5°C for 24 hours if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-1608UBC-06FB is a XINGLIGHT blue SMD LED supplied in a compact 0603 surface-mount package. The outline dimensions are 1.6 x 0.8 x 0.6 mm, and the luminous color is blue with a transparent/water-clear colloid structure.
At IF=20 mA and Ta=25°C, the device is specified for 125 to 240 mcd luminous intensity, 460 to 475 nm dominant wavelength, 460 nm typical peak wavelength, 2.7 to 3.2 V forward voltage, 25 nm typical half wave width, and a 120° typical viewing angle. Absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under pulsed conditions, 5 V reverse voltage, and 2000 V ESD rating.
Assembly and handling data include MSL 3, RoHS compliance, up to two reflow cycles, 260°C lead soldering for no more than 6 seconds, and opened-package soldering within 168 hours under the stated storage conditions.
Key Features
- 0603 SMD package, 1.6 x 0.8 x 0.6 mm
- Blue output with transparent water-clear colloid
- 125 to 240 mcd luminous intensity at 20 mA
- 460 to 475 nm dominant wavelength range
- 2.7 to 3.2 V forward voltage at 20 mA
- 120° typical viewing angle for broad emission
- 20 mA maximum continuous forward current rating
- 80 mA peak forward current under pulsed conditions
- MSL 3 moisture sensitivity classification
- RoHS Directive compliance explicitly stated
- Up to two reflow soldering cycles
- Opened package soldering window of 168 hours
Typical Applications
- Compact PCB status indicators
- Blue panel indication
- Portable device indicator lamps
- Display and keypad backlighting
- Dense surface-mount LED assemblies
- Control board signal lighting
- Consumer electronics visual indicators
Procurement Notes
When requesting a quote for XL-1608UBC-06FB, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-1608UBC-06FB use?
XL-1608UBC-06FB uses a 0603 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet lists a general dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 125 to 240 mcd luminous intensity, 460 to 475 nm dominant wavelength, 460 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle.
What electrical limits apply to this blue SMD LED?
Absolute maximum ratings at Ta=25°C include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V reverse voltage, and a 2000 V ESD rating.
What soldering limits are stated for assembly?
The datasheet states 260°C for no more than 6 seconds for lead soldering, a maximum of two reflow cycles, and a recommended maximum welding temperature of 240±5°C for 6 seconds. Hand soldering is limited to <300°C for under 3 seconds per terminal.
How should opened packages be stored before soldering?
After opening, the LED should be stored at ≤30°C and ≤40% RH and soldered within 168 hours, or 7 days. If storage time is exceeded or the moisture absorbent has faded, the listed baking condition is 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.