XL-1608UGC-06 Green SMD Chip LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-1608UGC-06 Green SMD Chip LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-1608UGC-06
Manufacturer
XINGLIGHT
Package
0603 SMD, 1.6 x 0.8 x 0.6 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-1608UGC-06 from XINGLIGHT is a green SMD chip LED in the LED category. It uses a 0603 surface-mount package with 1.6 x 0.8 x 0.6 mm outline dimensions and a water clear lens appearance. Key electrical and optical parameters include 20 mA maximum continuous forward current, 70 mW maximum power dissipation, 2.6 to 3.4 V forward voltage at IF=20 mA, 450 to 1000 mcd luminous intensity, 520 to 535 nm dominant wavelength, and 120° typical viewing angle. It is suited to compact green indicator, status display, panel indication, and backlighting functions where 0603 SMD assembly is required.

Specifications

TypeDescription
Part NumberXL-1608UGC-06
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Outline Dimensions1.6 x 0.8 x 0.6 mm; L/W/H
Package Size0603; SMD LED package
Luminous ColorGreen; water clear colloid
Colloid / Lens AppearanceWater clear; green LED
RoHS ComplianceCompliant with RoHS Directive; environmental protection process
Moisture Sensitivity LevelMSL 3; moisture sensitivity level
Maximum Power Dissipation70 mW; Ta=25°C
Maximum Continuous Forward Current20 mA; Ta=25°C
Peak Forward Current80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD / Antistatic Ability2000 V; Ta=25°C
Operating Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Storage Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Lead Soldering Temperature / Time260°C, <=6 s; Ta=25°C absolute maximum rating table
Luminous Intensity450 to 1000 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength520 to 535 nm; IF=20 mA, Ta=25°C
Peak Wavelength525 nm typ; IF=20 mA, Ta=25°C
Forward Voltage2.6 to 3.4 V; IF=20 mA, Ta=25°C
Half Wave Width30 nm typ; IF=20 mA, Ta=25°C
Viewing Angle120° typ; 2θ1/2, IF=20 mA, Ta=25°C
Reverse Current<=1 µA; VR=5 V, Ta=25°C
Brightness Grade E3450 to 550 mcd; IF=20 mA
Brightness Grade E4500 to 550 mcd; IF=20 mA
Brightness Grade E5550 to 600 mcd; IF=20 mA
Brightness Grade E6600 to 700 mcd; IF=20 mA
Brightness Grade E7700 to 800 mcd; IF=20 mA
Brightness Grade E8800 to 900 mcd; IF=20 mA
Brightness Grade E9900 to 1000 mcd; IF=20 mA
Brightness Measurement Tolerance±10%; brightness grading
Voltage Grade M18-82.6 to 2.7 V; IF=20 mA
Voltage Grade M18-92.7 to 2.8 V; IF=20 mA
Voltage Grade M19-12.8 to 2.9 V; IF=20 mA
Voltage Grade M19-22.9 to 3.0 V; IF=20 mA
Voltage Grade M19-33.0 to 3.1 V; IF=20 mA
Voltage Grade M19-43.2 to 3.3 V; IF=20 mA
Voltage Grade M19-53.3 to 3.4 V; IF=20 mA
Voltage Measurement Tolerance±0.1 V; voltage grading
Wavelength Grade HG02515 to 520 nm; IF=20 mA
Wavelength Grade HG03520 to 525 nm; IF=20 mA
Wavelength Grade HG04525 to 530 nm; IF=20 mA
Wavelength Grade HG05530 to 535 nm; IF=20 mA
Wavelength Measurement Tolerance±1 nm; wavelength grading
Default Test Environment Temperature25±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature and High Humidity Storage Test240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min and -40±5°C for 20 min
Anti-tin Test260±5°C for 10±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature235°C +5/-0°C; keep at peak for 10-15 s
Lead-free Process Reflow Peak Temperature255°C +0/-5°C; keep at peak for 5-10 s
Weldability Test235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s, tin loading rate >=95% pad area
Outline Dimension Tolerance±0.25 mm; unless otherwise noted
Tape/Reel Dimension Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W; manual welding recommended only for repair/rework
Hand Soldering Temperature<300°C; each terminal less than 3 s, one time only
Recommended Maximum Welding Temperature240±5°C for 6 s; product best maximum soldering temperature recommendation
Maximum Reflow Cycles2 times; reflow soldering
Cleaning ConditionAlcohol cleaning under 30°C for 3 min or 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest required to confirm no LED damage
Unopened Storage Condition<=30°C, <60% RH, use within 1 year; before opening package
Opened Storage Condition<=30°C, <40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition<=30°C, <60% RH; operation after package opening
Baking Condition60±5°C for 24 hours; if moisture absorbent material faded or storage time exceeded
Datasheet Statusrequest_only

Product Overview

XL-1608UGC-06 is a XINGLIGHT green SMD chip LED supplied in a 0603 package. The device outline is 1.6 x 0.8 x 0.6 mm, with a water clear colloid/lens appearance for the green emitter. The datasheet lists RoHS compliance and moisture sensitivity level MSL 3.

At Ta=25°C, the absolute maximum ratings include 70 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under pulse conditions, 5 V reverse voltage, and 2000 V ESD/antistatic ability. The specified operating and storage temperature ranges are both -40 to +85°C.

Optical and electrical characteristics at IF=20 mA and Ta=25°C include 450 to 1000 mcd luminous intensity, 520 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 2.6 to 3.4 V forward voltage, 30 nm typical half wave width, and 120° typical viewing angle. Assembly guidance includes reflow, hand soldering, cleaning, storage, and baking conditions from the manufacturer datasheet.

Key Features

  • Green SMD chip LED in 0603 package
  • 1.6 x 0.8 x 0.6 mm outline dimensions
  • Water clear colloid and lens appearance
  • 450 to 1000 mcd luminous intensity at 20 mA
  • 520 to 535 nm dominant wavelength range
  • 2.6 to 3.4 V forward voltage at 20 mA
  • 120° typical viewing angle at 20 mA
  • 20 mA maximum continuous forward current
  • 70 mW maximum power dissipation at 25°C
  • MSL 3 moisture sensitivity level
  • RoHS Directive compliant process
  • -40 to +85°C operating temperature range

Typical Applications

  • Green status indicators
  • Compact panel indication
  • 0603 SMD indicator circuits
  • Portable equipment indicators
  • Backlighting and signal indication
  • PCB-mounted green visual alerts
  • Low-profile electronic assemblies

Procurement Notes

When requesting a quote for XL-1608UGC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-1608UGC-06 use?

XL-1608UGC-06 uses a 0603 SMD LED package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.

What are the main optical ratings at 20 mA?

At IF=20 mA and Ta=25°C, the LED is specified for 450 to 1000 mcd luminous intensity, 520 to 535 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.

What forward voltage range is specified for this LED?

The forward voltage range is 2.6 to 3.4 V at IF=20 mA and Ta=25°C. The datasheet also provides voltage grading from M18-8 through M19-5, with a voltage measurement tolerance of ±0.1 V.

What storage conditions apply after opening the package?

After opening, the datasheet specifies storage at <=30°C and <40% RH, with soldering within 168 hours or 7 days. The recommended workshop condition after package opening is <=30°C and <60% RH.

How many reflow soldering cycles are allowed?

The datasheet lists a maximum of 2 reflow soldering cycles. For lead-free processing, the reflow peak temperature is 255°C +0/-5°C with 5 to 10 seconds at peak.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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