Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UGC-06A |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | Green; water-white transparent colloid |
| Colloid / Lens Appearance | Water-white transparent; green light product |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 100 mW; Ta=25°C |
| Maximum Continuous Forward Current | 30 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum ratings table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum ratings table |
| Lead Soldering Temperature / Time | 260°C <=6 s; Ta=25°C absolute maximum ratings table |
| Luminous Intensity | 550 to 1450 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 530 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.4 to 3.0 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 130° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin E5 | 550 to 600 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E6 | 600 to 700 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E7 | 700 to 800 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E8 | 800 to 900 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E9 | 900 to 1000 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin F1 | 1000 to 1150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin F2 | 1150 to 1300 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin F3 | 1300 to 1450 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-6 | 2.4 to 2.5 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-7 | 2.5 to 2.6 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-8 | 2.6 to 2.7 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7 to 2.8 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HG02 | 515 to 520 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HG03 | 520 to 525 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HG04 | 525 to 530 nm; IF=20 mA, wavelength error ±1 nm |
| Default Test Ambient Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature / High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 50 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 50 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; ramp <=3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s; cooling <=6°C/s |
| Lead-Free Process Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; ramp <=3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling <=6°C/s |
| Weldability Test | Tin loading rate >=95% pad area; soldering temperature 235±5°C; immersion speed 25±2.5 mm/s; immersion time 2±0.5 s |
| Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape / Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions; units in mm |
| Hand Soldering Iron Power | <30 W recommended; hand soldering only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Soldering Cycles | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning With Alcohol | <=30°C for 3 min or <=50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest required to confirm no LED damage |
| Unopened Storage Conditions | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Conditions | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Conditions | <=30°C, <=60% RH; operation after package opening |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent material faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-1608UGC-06A is a XINGLIGHT green SMD indicator LED built in a 1608 package with 1.6 x 0.8 x 0.6 mm outline dimensions. The device emits green light through a water-white transparent colloid, making it suitable for compact PCB-mounted visual indication where a small surface-mount LED is required.
At IF=20 mA and Ta=25°C, the LED is specified for 550 to 1450 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 130° typical viewing angle. Forward voltage is specified from 2.4 to 3.0 V at the same test current, with reverse current limited to <=1 µA at VR=5 V.
Assembly and handling data include RoHS compliance, MSL 3 moisture sensitivity, two maximum reflow soldering cycles, lead-free reflow peak conditions of 255°C +0/-5°C for 5 to 10 s, and opened-package storage of <=30°C, <=40% RH with soldering within 168 hours.
Key Features
- 1608 SMD package, 1.6 x 0.8 x 0.6 mm
- Green luminous color with water-white transparent colloid
- 550 to 1450 mcd luminous intensity at 20 mA
- 515 to 530 nm dominant wavelength range
- 2.4 to 3.0 V forward voltage at 20 mA
- 130° typical viewing angle for indicator visibility
- 30 mA maximum continuous forward current
- MSL 3 moisture sensitivity classification
- RoHS Directive compliant environmental process
- Two maximum reflow soldering cycles
Typical Applications
- PCB status indicators
- Compact green signal lamps
- Equipment front-panel indication
- Power or mode indicators
- Surface-mount visual alerts
- Control board indication
- Consumer device status lighting
Procurement Notes
When requesting a quote for XL-1608UGC-06A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-1608UGC-06A use?
XL-1608UGC-06A uses a 1608 SMD LED package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet lists the dimensions in length, width, and height order.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 550 to 1450 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, and 130° typical viewing angle.
What forward voltage range is specified for this LED?
The forward voltage range is 2.4 to 3.0 V at IF=20 mA and Ta=25°C. The datasheet also provides voltage bins from M18-6 through M19-2 across that range.
How should opened packages be stored before soldering?
After opening the package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering completed within 168 hours, or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.