Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UOC-06FJ |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 0603 SMD, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm, L/W/H |
| Luminous Color | Orange, transparent/water colloid |
| Moisture Sensitivity Level | MSL 3, moisture sensitivity level |
| Maximum Power Dissipation | 60 mW, Ta=25°C |
| Maximum Continuous Forward Current | 30 mA, Ta=25°C |
| Peak Forward Current | 80 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD Withstand Voltage | 2000 V, antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C, Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85°C, Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s, absolute maximum rating |
| Luminous Intensity | 240-600 mcd, IF=20 mA, Ta=25°C |
| Dominant Wavelength | 600-615 nm, IF=20 mA, Ta=25°C |
| Peak Wavelength | 605 nm typ, IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9-2.4 V, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ, IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA, VR=5 V, Ta=25°C |
| Brightness Bin D7 | 240-270 mcd, IF=20 mA |
| Brightness Bin D8 | 270-300 mcd, IF=20 mA |
| Brightness Bin D9 | 300-350 mcd, IF=20 mA |
| Brightness Bin E1 | 350-400 mcd, IF=20 mA |
| Brightness Bin E2 | 400-450 mcd, IF=20 mA |
| Brightness Bin E3 | 450-500 mcd, IF=20 mA |
| Brightness Bin E4 | 500-550 mcd, IF=20 mA |
| Brightness Bin E5 | 550-600 mcd, IF=20 mA |
| Brightness Tolerance | ±10%, brightness grading |
| Voltage Bin M18-1 | 1.9-2.0 V, IF=20 mA |
| Voltage Bin M18-2 | 2.0-2.1 V, IF=20 mA |
| Voltage Bin M18-3 | 2.1-2.2 V, IF=20 mA |
| Voltage Bin M18-4 | 2.2-2.3 V, IF=20 mA |
| Voltage Bin M18-5 | 2.3-2.4 V, IF=20 mA |
| Voltage Tolerance | ±0.1 V, voltage grading |
| Wavelength Bin HO01 | 600-602.5 nm, IF=20 mA |
| Wavelength Bin HO02 | 602.5-605 nm, IF=20 mA |
| Wavelength Bin HO03 | 605-607.5 nm, IF=20 mA |
| Wavelength Bin HO04 | 607.5-610 nm, IF=20 mA |
| Wavelength Tolerance | ±1 nm, wavelength grading |
| Outline Dimension Tolerance | ±0.25 mm, unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm, belt and disk dimensions |
| Hand Soldering Iron Power | <30 W, manual soldering recommended for repair/rework only |
| Hand Soldering Temperature | <300°C, less than 3 s per terminal, one time only |
| Maximum Reflow Cycles | 2 cycles, reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s, product recommendation |
| Cleaning Condition | under 30°C for 3 min or under 50°C for 30 s, alcohol solvent cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W, pretest recommended before ultrasonic cleaning |
| Unopened Storage Condition | <=30°C, <=60%RH, use within 1 year |
| Opened Storage Condition | <=30°C, <=40%RH, solder within 168 hours |
| Recommended Workshop Condition | <=30°C, <=60%RH |
| Baking Condition | 60±5°C for 24 hours, if desiccant/package fails or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-1608UOC-06FJ is a XINGLIGHT reverse polarity orange LED intended for compact surface-mount layouts. The package is a 0603 SMD form factor with 1.6 x 0.8 x 0.6 mm outline dimensions and an outline dimension tolerance of ±0.25 mm unless otherwise noted.
At IF=20 mA and Ta=25°C, the device is specified for 240-600 mcd luminous intensity, 600-615 nm dominant wavelength, 605 nm typical peak wavelength, 30 nm typical half wave width, and a 120° typical viewing angle. The forward voltage range is 1.9-2.4 V, with reverse current limited to <=1 µA at VR=5 V.
Absolute maximum ratings include 60 mW power dissipation, 30 mA continuous forward current, 80 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, and -40 to +85°C operating and storage ranges. Assembly guidance includes MSL 3 handling, up to two reflow cycles, recommended maximum soldering at 240±5°C for 6 s, and opened-package soldering within 168 hours.
Key Features
- 0603 SMD package measures 1.6 x 0.8 x 0.6 mm
- Orange luminous color with transparent/water colloid construction
- 240-600 mcd luminous intensity at IF=20 mA
- 600-615 nm dominant wavelength at IF=20 mA
- 1.9-2.4 V forward voltage at IF=20 mA
- 120° typical viewing angle at IF=20 mA
- 30 mA maximum continuous forward current at Ta=25°C
- MSL 3 moisture sensitivity level for handling control
- Two maximum reflow cycles with 240±5°C recommendation
Typical Applications
- Compact indicator lighting
- Orange status indication
- Surface-mount control panels
- Polarity-specific LED layouts
- Low-profile electronic displays
- Signal and mode indicators
- Reflow-assembled PCB indicators
Procurement Notes
When requesting a quote for XL-1608UOC-06FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package does XL-1608UOC-06FJ use?
XL-1608UOC-06FJ uses a 0603 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 240-600 mcd luminous intensity, 600-615 nm dominant wavelength, 605 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.
What soldering limits are specified for this LED?
The datasheet lists lead soldering at 260°C for <=6 s as an absolute maximum rating. It recommends a maximum soldering temperature of 240±5°C for 6 s, with no more than two reflow cycles.
How should opened packages be handled before soldering?
After opening the package, storage is specified at <=30°C and <=40%RH, with soldering within 168 hours. If the desiccant or package fails or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.