Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UYC-06FJ |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | SMD 1608, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | Yellow; water-white transparent colloid |
| Colloid / Lens Appearance | Water-white transparent; yellow light device |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Moisture Sensitivity Level | MSL 3 |
| Package Style | EIA standard packaging; suitable for SMT automatic production |
| Maximum Power Dissipation | 60 mW at Ta=25°C |
| Maximum Continuous Forward Current | 30 mA at Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability at Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C for <=6 s; Ta=25°C absolute maximum rating table |
| Luminous Intensity | 240 to 600 mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 585 to 595 nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ at IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 to 2.3 V at IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ at IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA at VR=5 V, Ta=25°C |
| Brightness Bin D7 | 240 to 270 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin D8 | 270 to 300 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin D9 | 300 to 350 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E1 | 350 to 400 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E2 | 400 to 450 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E3 | 450 to 500 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E4 | 500 to 550 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E5 | 550 to 600 mcd at IF=20 mA, brightness error ±10% |
| Voltage Bin M18-1 | 1.9 to 2.0 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0 to 2.1 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1 to 2.2 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2 to 2.3 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3 to 2.4 V at IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HY03 | 585 to 587.5 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY04 | 587.5 to 590 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY05 | 590 to 592.5 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY06 | 592.5 to 595 nm at IF=20 mA, wavelength error ±1 nm |
| Default Test Ambient Temperature | 25 ±5 °C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature, tested at 20 mA |
| High Temperature / High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times, Ta=85 ±5°C, RH=90 to 95% |
| High Temperature Storage Test | 1000 hours at Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours at Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times, 100 ±5°C for 20 min, -40 ±5°C for 20 min |
| Anti-Tin Test | 260 ±5°C for 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Profile | Maximum temperature 235°C +5/-0°C; time at peak 10 to 15 s; ramp max 3°C/s from 183°C to peak; 125 ±25°C <=120 s; above 183°C for 60 to 150 s; cooling max 6°C/s |
| Lead-Free Reflow Profile | Maximum temperature 255°C +0/-5°C; time at peak 5 to 10 s; ramp max 3°C/s from 217°C to peak; 175 ±25°C <=180 s; above 217°C for 60 to 120 s; cooling max 6°C/s |
| Weldability Test | Tin loading rate >=95% pad area; soldering temperature 235 ±5°C; immersion speed 25 ±2.5 mm/s; immersion time 2 ±0.5 s |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended only for repair and rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Soldering Count | 2 times; reflow soldering process |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s |
| Cleaning Solvent | Alcohol recommended after soldering |
| Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended to confirm no LED damage |
| Unopened Storage Life | 1 year; moisture-proof anti-electrostatic package with desiccant |
| Storage Before Opening | <=30°C, <60% RH; use within 1 year |
| Storage After Opening | <=30°C, <40% RH; solder within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <60% RH after opening package |
| Baking Condition | 60 ±5°C for 24 hours if desiccant fails or LEDs exceed storage time |
| Datasheet Status | request_only |
Product Overview
XL-1608UYC-06FJ is a XINGLIGHT yellow SMD chip LED built in a compact SMD 1608 package. The outline dimensions are 1.6 x 0.8 x 0.6 mm with a general outline tolerance of ±0.25 mm. The lens appearance is water-white transparent for a yellow light device.
At IF=20 mA and Ta=25°C, the LED is specified for 240 to 600 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle. Forward voltage is 1.9 to 2.3 V under the same test condition, with reverse current limited to <=1 µA at VR=5 V.
Assembly data includes EIA standard packaging for SMT automatic production, MSL 3 moisture sensitivity, and a maximum reflow soldering count of 2 times. Storage, baking, cleaning, and soldering limits are defined for process control in yellow LED indication and compact SMT light-output positions.
Key Features
- Yellow SMD chip LED in 1608 package
- 1.6 x 0.8 x 0.6 mm outline dimensions
- Water-white transparent colloid for yellow emission
- 240 to 600 mcd luminous intensity at 20 mA
- 585 to 595 nm dominant wavelength range
- 1.9 to 2.3 V forward voltage at 20 mA
- 120° typical viewing angle
- 30 mA maximum continuous forward current
- MSL 3 moisture sensitivity level
- RoHS Directive compliant environmental process
- EIA standard packaging for SMT automatic production
- -40 to +85 °C operating temperature range
Typical Applications
- Yellow status indicators
- Compact SMT indicator positions
- PCB-mounted signal lights
- Low-profile yellow light output
- Automated SMT assembly designs
- Wide-angle visual indication
- 20 mA LED drive circuits
Procurement Notes
When requesting a quote for XL-1608UYC-06FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for XL-1608UYC-06FJ?
XL-1608UYC-06FJ uses an SMD 1608 package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet lists EIA standard packaging suitable for SMT automatic production.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 240 to 600 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What soldering limits are specified for this LED?
The absolute maximum lead soldering condition is 260°C for <=6 s. The recommended maximum welding temperature is 240 ±5°C for 6 s, and the datasheet limits reflow soldering to 2 times.
How should opened packages be stored before soldering?
After opening, the datasheet specifies storage at <=30°C and <40% RH, with soldering within 168 hours or 7 days. Recommended workshop conditions after opening are <=30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.