Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UYC-06 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1608 SMD LED, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | Yellow; water clear colloid/transparent encapsulant |
| Colloid / Lens Type | Water clear colloid; yellow LED |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS Directive |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C, ≤6 s; absolute maximum rating |
| Luminous Intensity | 80 to 210 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 585 to 595 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8 to 2.4 V; IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | ≤1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M17-9 | 1.8 to 1.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-1 | 1.9 to 2.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1 to 2.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2 to 2.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3 to 2.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HY03 | 585 to 587.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY04 | 587.5 to 590 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY05 | 590 to 592.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY06 | 592.5 to 595 nm; IF=20 mA, wavelength error ±1 nm |
| Default Test Environment Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA; -24 h/+72 h |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C; -24 h/+72 h |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C; -24 h/+72 h |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s; ramp ≤3°C/s from 183°C to peak; cooling ≤6°C/s |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s; ramp ≤3°C/s from 217°C to peak; cooling ≤6°C/s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Dimensional Tolerance | ±0.25 mm; unless otherwise noted, outline dimensions |
| Tape / Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Maximum Reflow Soldering Cycles | 2 times; reflow soldering should not be done more than twice |
| Post-solder Alcohol Cleaning | ≤30°C for 3 min or ≤50°C for 30 s; alcohol solvent cleaning after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest recommended before cleaning |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH; recommended operating workshop storage condition |
| Baking Condition | 60±5°C for 24 hours; if desiccant faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
Absolute maximum ratings include 50 mW power dissipation, 20 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V reverse voltage, and 2000 V ESD capability at Ta=25°C. Operating and storage temperature ranges are both -40 to +85°C. Assembly guidance includes MSL 3 handling, up to two reflow soldering cycles, and soldering, cleaning, storage, and baking limits defined by the datasheet.
Key Features
- Yellow SMD chip LED in 1608 package
- 1.6 x 0.8 x 0.6 mm outline dimensions
- Water clear colloid transparent encapsulant
- 80 to 210 mcd at IF=20 mA
- 585 to 595 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage range
- 120° typical viewing angle at IF=20 mA
- 20 mA maximum continuous forward current
- MSL 3 moisture sensitivity classification
- RoHS Directive compliance stated in datasheet
Typical Applications
- Yellow status indicators
- Compact PCB indication
- Surface-mount signal lamps
- Equipment visual alerts
- Consumer device indicators
- Panel indication circuits
- Portable device status lights
Procurement Notes
When requesting a quote for XL-1608UYC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
LITEON
LTST-C191KSKT
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
LITEON
19-213UYC/S530-A2/TR8
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
LITEON
19-213/Y2C-AP1Q2B/3T
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
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FAQ
What package size is used by XL-1608UYC-06?
XL-1608UYC-06 uses a 1608 SMD LED package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet lists a general outline dimensional tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 210 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What forward voltage range is specified for this LED?
The datasheet specifies a forward voltage range of 1.8 to 2.4 V at IF=20 mA and Ta=25°C. Voltage bins from M17-9 through M18-5 divide that range into 0.1 V bin intervals.
What handling and storage limits apply after opening?
After opening the package, the datasheet specifies storage at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. If desiccant has faded or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.